JP2024011992A - 配線基板及び電子機器 - Google Patents

配線基板及び電子機器 Download PDF

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Publication number
JP2024011992A
JP2024011992A JP2022114387A JP2022114387A JP2024011992A JP 2024011992 A JP2024011992 A JP 2024011992A JP 2022114387 A JP2022114387 A JP 2022114387A JP 2022114387 A JP2022114387 A JP 2022114387A JP 2024011992 A JP2024011992 A JP 2024011992A
Authority
JP
Japan
Prior art keywords
ground
conductor layer
wiring board
wiring
wirings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022114387A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024011992A5 (enExample
Inventor
昇司 松本
Shoji Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2022114387A priority Critical patent/JP2024011992A/ja
Priority to US18/342,941 priority patent/US12432848B2/en
Priority to CN202310847206.7A priority patent/CN117412480A/zh
Publication of JP2024011992A publication Critical patent/JP2024011992A/ja
Publication of JP2024011992A5 publication Critical patent/JP2024011992A5/ja
Pending legal-status Critical Current

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Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2022114387A 2022-07-15 2022-07-15 配線基板及び電子機器 Pending JP2024011992A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022114387A JP2024011992A (ja) 2022-07-15 2022-07-15 配線基板及び電子機器
US18/342,941 US12432848B2 (en) 2022-07-15 2023-06-28 Wiring board and electronic equipment
CN202310847206.7A CN117412480A (zh) 2022-07-15 2023-07-11 布线板和电子装备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022114387A JP2024011992A (ja) 2022-07-15 2022-07-15 配線基板及び電子機器

Publications (2)

Publication Number Publication Date
JP2024011992A true JP2024011992A (ja) 2024-01-25
JP2024011992A5 JP2024011992A5 (enExample) 2025-07-17

Family

ID=89491469

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022114387A Pending JP2024011992A (ja) 2022-07-15 2022-07-15 配線基板及び電子機器

Country Status (3)

Country Link
US (1) US12432848B2 (enExample)
JP (1) JP2024011992A (enExample)
CN (1) CN117412480A (enExample)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030163373A1 (en) * 1999-06-30 2003-08-28 Vlady Cornateanu Device for receiving advertising data and method of application
JP2006100384A (ja) 2004-09-28 2006-04-13 Oki Data Corp プリント配線基板及びインタフェース制御装置
JP4819639B2 (ja) 2005-10-12 2011-11-24 キヤノン株式会社 プリント回路板
US7564695B2 (en) 2007-07-09 2009-07-21 Canon Kabushiki Kaisha Circuit connection structure and printed circuit board
JP5610970B2 (ja) 2010-10-19 2014-10-22 キヤノン株式会社 プリント回路板
JP2012227211A (ja) 2011-04-15 2012-11-15 Olympus Corp 差動信号用配線基板
JP2014160690A (ja) 2011-06-23 2014-09-04 Sanyo Electric Co Ltd 配線基板
US9241400B2 (en) * 2013-08-23 2016-01-19 Seagate Technology Llc Windowed reference planes for embedded conductors
JP6357033B2 (ja) 2014-06-30 2018-07-11 キヤノン株式会社 プリント回路板
JP6818534B2 (ja) 2016-12-13 2021-01-20 キヤノン株式会社 プリント配線板、プリント回路板及び電子機器
US10716211B2 (en) 2018-02-08 2020-07-14 Canon Kabushiki Kaisha Printed circuit board, printed wiring board, electronic device, and camera
JP6942679B2 (ja) 2018-09-21 2021-09-29 キヤノン株式会社 伝送回路、電子機器、及び撮像装置
US11019719B2 (en) 2019-08-06 2021-05-25 Canon Kabushiki Kaisha Printed circuit board, printed wiring board, and electronic device
JP2023067351A (ja) 2021-11-01 2023-05-16 キヤノン株式会社 伝送モジュール、電子ユニット、及び電子機器

Also Published As

Publication number Publication date
CN117412480A (zh) 2024-01-16
US20240023231A1 (en) 2024-01-18
US12432848B2 (en) 2025-09-30

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