JP2024011954A5 - - Google Patents
Info
- Publication number
- JP2024011954A5 JP2024011954A5 JP2022114323A JP2022114323A JP2024011954A5 JP 2024011954 A5 JP2024011954 A5 JP 2024011954A5 JP 2022114323 A JP2022114323 A JP 2022114323A JP 2022114323 A JP2022114323 A JP 2022114323A JP 2024011954 A5 JP2024011954 A5 JP 2024011954A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor layer
- disposed
- semiconductor device
- semiconductor
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022114323A JP2024011954A (ja) | 2022-07-15 | 2022-07-15 | 半導体装置および半導体装置の製造方法 |
| EP23180893.2A EP4307379A1 (en) | 2022-07-15 | 2023-06-22 | Semiconductor device |
| KR1020230081587A KR20240010401A (ko) | 2022-07-15 | 2023-06-26 | 반도체 장치 |
| US18/345,012 US20240021648A1 (en) | 2022-07-15 | 2023-06-30 | Semiconductor device |
| TW112124698A TW202405925A (zh) | 2022-07-15 | 2023-07-03 | 半導體裝置 |
| CN202310847703.7A CN117410296A (zh) | 2022-07-15 | 2023-07-11 | 半导体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022114323A JP2024011954A (ja) | 2022-07-15 | 2022-07-15 | 半導体装置および半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024011954A JP2024011954A (ja) | 2024-01-25 |
| JP2024011954A5 true JP2024011954A5 (enExample) | 2025-07-16 |
Family
ID=86942147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022114323A Pending JP2024011954A (ja) | 2022-07-15 | 2022-07-15 | 半導体装置および半導体装置の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240021648A1 (enExample) |
| EP (1) | EP4307379A1 (enExample) |
| JP (1) | JP2024011954A (enExample) |
| KR (1) | KR20240010401A (enExample) |
| CN (1) | CN117410296A (enExample) |
| TW (1) | TW202405925A (enExample) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120193785A1 (en) * | 2011-02-01 | 2012-08-02 | Megica Corporation | Multichip Packages |
| JP6861471B2 (ja) | 2015-06-12 | 2021-04-21 | キヤノン株式会社 | 撮像装置およびその製造方法ならびにカメラ |
| JP6779825B2 (ja) * | 2017-03-30 | 2020-11-04 | キヤノン株式会社 | 半導体装置および機器 |
| US11985443B2 (en) | 2018-11-21 | 2024-05-14 | Sony Semiconductor Solutions Corporation | Solid-state image sensor |
| EP4235791A4 (en) * | 2020-10-23 | 2024-04-24 | Sony Semiconductor Solutions Corporation | IMAGING DEVICE AND LIGHT RECEIVING ELEMENT |
-
2022
- 2022-07-15 JP JP2022114323A patent/JP2024011954A/ja active Pending
-
2023
- 2023-06-22 EP EP23180893.2A patent/EP4307379A1/en active Pending
- 2023-06-26 KR KR1020230081587A patent/KR20240010401A/ko active Pending
- 2023-06-30 US US18/345,012 patent/US20240021648A1/en active Pending
- 2023-07-03 TW TW112124698A patent/TW202405925A/zh unknown
- 2023-07-11 CN CN202310847703.7A patent/CN117410296A/zh active Pending
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