JP2024009020A5 - - Google Patents
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- Publication number
- JP2024009020A5 JP2024009020A5 JP2023189249A JP2023189249A JP2024009020A5 JP 2024009020 A5 JP2024009020 A5 JP 2024009020A5 JP 2023189249 A JP2023189249 A JP 2023189249A JP 2023189249 A JP2023189249 A JP 2023189249A JP 2024009020 A5 JP2024009020 A5 JP 2024009020A5
- Authority
- JP
- Japan
- Prior art keywords
- flow path
- gas flow
- plug
- semiconductor manufacturing
- manufacturing equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims 5
- 230000037431 insertion Effects 0.000 claims 2
- 238000003780 insertion Methods 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023189249A JP7580555B2 (ja) | 2021-02-04 | 2023-11-06 | 半導体製造装置用部材及びプラグ |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021016385A JP7382978B2 (ja) | 2021-02-04 | 2021-02-04 | 半導体製造装置用部材及びプラグ |
| JP2023189249A JP7580555B2 (ja) | 2021-02-04 | 2023-11-06 | 半導体製造装置用部材及びプラグ |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021016385A Division JP7382978B2 (ja) | 2021-02-04 | 2021-02-04 | 半導体製造装置用部材及びプラグ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2024009020A JP2024009020A (ja) | 2024-01-19 |
| JP2024009020A5 true JP2024009020A5 (https=) | 2024-01-26 |
| JP7580555B2 JP7580555B2 (ja) | 2024-11-11 |
Family
ID=82611592
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021016385A Active JP7382978B2 (ja) | 2021-02-04 | 2021-02-04 | 半導体製造装置用部材及びプラグ |
| JP2023189249A Active JP7580555B2 (ja) | 2021-02-04 | 2023-11-06 | 半導体製造装置用部材及びプラグ |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021016385A Active JP7382978B2 (ja) | 2021-02-04 | 2021-02-04 | 半導体製造装置用部材及びプラグ |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12040160B2 (https=) |
| JP (2) | JP7382978B2 (https=) |
| KR (1) | KR102728858B1 (https=) |
| CN (1) | CN114864435A (https=) |
| TW (1) | TWI824350B (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7616762B2 (ja) * | 2020-12-14 | 2025-01-17 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP7744328B2 (ja) * | 2022-12-21 | 2025-09-25 | 日本碍子株式会社 | 半導体製造装置用部材、プラグ及びプラグ製造方法 |
| JP7764356B2 (ja) * | 2022-12-21 | 2025-11-05 | 日本碍子株式会社 | プラグ、プラグ製造方法及び半導体製造装置用部材 |
| WO2025177564A1 (ja) * | 2024-02-22 | 2025-08-28 | 日本碍子株式会社 | 半導体製造装置用部材 |
| WO2026063179A1 (ja) * | 2024-09-18 | 2026-03-26 | 京セラ株式会社 | 試料保持具 |
| JP7711292B1 (ja) * | 2024-10-17 | 2025-07-22 | 日本特殊陶業株式会社 | 保持装置、および、保持装置の製造方法 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5720818A (en) * | 1996-04-26 | 1998-02-24 | Applied Materials, Inc. | Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck |
| US6108189A (en) * | 1996-04-26 | 2000-08-22 | Applied Materials, Inc. | Electrostatic chuck having improved gas conduits |
| US6490145B1 (en) | 2001-07-18 | 2002-12-03 | Applied Materials, Inc. | Substrate support pedestal |
| US20090086401A1 (en) | 2007-09-28 | 2009-04-02 | Intevac, Inc. | Electrostatic chuck apparatus |
| JP5331519B2 (ja) | 2008-03-11 | 2013-10-30 | 日本碍子株式会社 | 静電チャック |
| JP5665265B2 (ja) | 2008-06-24 | 2015-02-04 | 東京エレクトロン株式会社 | チャンバー部品を介してプロセス流体を導入する方法及びシステム |
| JP5449750B2 (ja) | 2008-11-19 | 2014-03-19 | 株式会社日本セラテック | 静電チャックおよびその製造方法 |
| KR101040697B1 (ko) * | 2009-11-25 | 2011-06-13 | 세메스 주식회사 | 정전척 |
| JP5956379B2 (ja) | 2012-04-27 | 2016-07-27 | 日本碍子株式会社 | 半導体製造装置用部材 |
| JP5633766B2 (ja) | 2013-03-29 | 2014-12-03 | Toto株式会社 | 静電チャック |
| US9608550B2 (en) | 2015-05-29 | 2017-03-28 | Lam Research Corporation | Lightup prevention using multi-layer ceramic fabrication techniques |
| US11227749B2 (en) | 2016-02-18 | 2022-01-18 | Lam Research Corporation | 3D printed plasma arrestor for an electrostatic chuck |
| JP6634315B2 (ja) * | 2016-03-03 | 2020-01-22 | 日本特殊陶業株式会社 | 保持装置および保持装置の製造方法 |
| US10770270B2 (en) | 2016-06-07 | 2020-09-08 | Applied Materials, Inc. | High power electrostatic chuck with aperture-reducing plug in a gas hole |
| KR102438888B1 (ko) | 2017-07-06 | 2022-08-31 | 엔지케이 인슐레이터 엘티디 | 반도체 제조 장치용 부재 및 그 제조법 |
| JP6504532B1 (ja) * | 2018-03-14 | 2019-04-24 | Toto株式会社 | 静電チャック |
| US11456161B2 (en) * | 2018-06-04 | 2022-09-27 | Applied Materials, Inc. | Substrate support pedestal |
| US11715652B2 (en) | 2018-09-28 | 2023-08-01 | Ngk Insulators, Ltd. | Member for semiconductor manufacturing apparatus |
| JP7002014B2 (ja) * | 2018-10-30 | 2022-01-20 | Toto株式会社 | 静電チャック |
| JP7402411B2 (ja) * | 2018-10-30 | 2023-12-21 | Toto株式会社 | 静電チャック |
| JP7134104B2 (ja) * | 2019-01-09 | 2022-09-09 | 東京エレクトロン株式会社 | プラズマ処理装置およびプラズマ処理装置の載置台 |
| CN113228496B (zh) | 2019-01-24 | 2024-08-20 | 京瓷株式会社 | 静电卡盘 |
| US20200411355A1 (en) * | 2019-06-28 | 2020-12-31 | Applied Materials, Inc. | Apparatus for reduction or prevention of arcing in a substrate support |
-
2021
- 2021-02-04 JP JP2021016385A patent/JP7382978B2/ja active Active
- 2021-12-06 US US17/457,725 patent/US12040160B2/en active Active
- 2021-12-06 TW TW110145429A patent/TWI824350B/zh active
- 2021-12-14 KR KR1020210178710A patent/KR102728858B1/ko active Active
-
2022
- 2022-01-26 CN CN202210096313.6A patent/CN114864435A/zh active Pending
-
2023
- 2023-11-06 JP JP2023189249A patent/JP7580555B2/ja active Active
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