JP2023546177A5 - - Google Patents

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Publication number
JP2023546177A5
JP2023546177A5 JP2023523612A JP2023523612A JP2023546177A5 JP 2023546177 A5 JP2023546177 A5 JP 2023546177A5 JP 2023523612 A JP2023523612 A JP 2023523612A JP 2023523612 A JP2023523612 A JP 2023523612A JP 2023546177 A5 JP2023546177 A5 JP 2023546177A5
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JP
Japan
Prior art keywords
protective film
article according
substrate
article
metal
Prior art date
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Granted
Application number
JP2023523612A
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English (en)
Japanese (ja)
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JP7667262B2 (ja
JP2023546177A (ja
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Application filed filed Critical
Priority claimed from PCT/EP2021/078906 external-priority patent/WO2022084292A1/en
Publication of JP2023546177A publication Critical patent/JP2023546177A/ja
Publication of JP2023546177A5 publication Critical patent/JP2023546177A5/ja
Application granted granted Critical
Publication of JP7667262B2 publication Critical patent/JP7667262B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023523612A 2020-10-19 2021-10-19 フッ素プラズマエッチングプロセスにおける保護層としての炭素ドープオキシフッ化イットリウム（ｃ：ｙ－ｏ－ｆ）層 Active JP7667262B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102020006407 2020-10-19
DE102020006407.8 2020-10-19
PCT/EP2021/078906 WO2022084292A1 (en) 2020-10-19 2021-10-19 Carbon doped metal oxyfluoride (c:m-0-f) layer as protection layer in fluorine plasma etch processes

Publications (3)

Publication Number Publication Date
JP2023546177A JP2023546177A (ja) 2023-11-01
JP2023546177A5 true JP2023546177A5 (https=) 2024-05-09
JP7667262B2 JP7667262B2 (ja) 2025-04-22

Family

ID=78516756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023523612A Active JP7667262B2 (ja) 2020-10-19 2021-10-19 フッ素プラズマエッチングプロセスにおける保護層としての炭素ドープオキシフッ化イットリウム（ｃ：ｙ－ｏ－ｆ）層

Country Status (7)

Country Link
US (1) US20230383396A1 (https=)
EP (1) EP4229227A1 (https=)
JP (1) JP7667262B2 (https=)
KR (1) KR20230091895A (https=)
CN (1) CN116635565A (https=)
IL (1) IL302021A (https=)
WO (1) WO2022084292A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025263344A1 (ja) * 2024-06-20 2025-12-26 東京エレクトロン株式会社 膜、物品及びプラズマ処理装置
CN119894249B (zh) * 2024-12-23 2026-02-03 厦门天马显示科技有限公司 一种显示面板及其制备方法、显示装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3894313B2 (ja) * 2002-12-19 2007-03-22 信越化学工業株式会社 フッ化物含有膜、被覆部材及びフッ化物含有膜の形成方法
JP4864757B2 (ja) * 2007-02-14 2012-02-01 東京エレクトロン株式会社 基板載置台及びその表面処理方法
US20100068489A1 (en) * 2007-02-23 2010-03-18 Applied Microstructures, Inc. Wear-resistant, carbon-doped metal oxide coatings for MEMS and nanoimprint lithography
US8900695B2 (en) * 2007-02-23 2014-12-02 Applied Microstructures, Inc. Durable conformal wear-resistant carbon-doped metal oxide-comprising coating
US9359666B2 (en) * 2009-03-13 2016-06-07 The Board Of Trustees Of The University Of Illinois Rapid crystallization of heavily doped metal oxides and products produced thereby
JP5939084B2 (ja) * 2012-08-22 2016-06-22 信越化学工業株式会社 希土類元素オキシフッ化物粉末溶射材料の製造方法
CN107250082B (zh) * 2015-03-05 2018-10-12 日本钇股份有限公司 烧结用材料以及用于制造烧结用材料的粉末
EP3377318A1 (en) * 2015-11-16 2018-09-26 Coorstek Inc. Corrosion-resistant components and methods of making
US20200002799A1 (en) * 2017-03-01 2020-01-02 Shin-Etsu Chemical Co., Ltd. Spray coating, sraying powder, spraying powder manufacturing method and spray coating manufacturing method
US20180327892A1 (en) * 2017-05-10 2018-11-15 Applied Materials, Inc. Metal oxy-flouride films for chamber components
WO2019044850A1 (ja) * 2017-09-01 2019-03-07 学校法人 芝浦工業大学 部品および半導体製造装置
US20190078199A1 (en) * 2017-09-08 2019-03-14 Applied Materials, Inc. Rare-earth-based oxyfluoride ald coating for chamber productivity enhancement
TWI704843B (zh) * 2018-04-03 2020-09-11 日商京瓷股份有限公司 電漿處理裝置用構件及具備其之電漿處理裝置
JP6939853B2 (ja) * 2018-08-15 2021-09-22 信越化学工業株式会社 溶射皮膜、溶射皮膜の製造方法、及び溶射部材
US10858741B2 (en) * 2019-03-11 2020-12-08 Applied Materials, Inc. Plasma resistant multi-layer architecture for high aspect ratio parts

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