JP2023516856A - ドープされたald窒化タンタルにおける不純物の除去 - Google Patents
ドープされたald窒化タンタルにおける不純物の除去 Download PDFInfo
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- JP2023516856A JP2023516856A JP2022542959A JP2022542959A JP2023516856A JP 2023516856 A JP2023516856 A JP 2023516856A JP 2022542959 A JP2022542959 A JP 2022542959A JP 2022542959 A JP2022542959 A JP 2022542959A JP 2023516856 A JP2023516856 A JP 2023516856A
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- Prior art keywords
- tantalum nitride
- substrate
- plasma
- doped
- nitride layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 title claims abstract description 141
- 239000012535 impurity Substances 0.000 title description 4
- 238000000034 method Methods 0.000 claims abstract description 144
- 239000000758 substrate Substances 0.000 claims abstract description 123
- 239000002019 doping agent Substances 0.000 claims abstract description 59
- 229910052754 neon Inorganic materials 0.000 claims abstract description 26
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 18
- 239000001307 helium Substances 0.000 claims abstract description 16
- 229910052734 helium Inorganic materials 0.000 claims abstract description 16
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 230000008569 process Effects 0.000 claims description 91
- 238000012545 processing Methods 0.000 claims description 63
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 28
- 238000000151 deposition Methods 0.000 claims description 28
- 238000012546 transfer Methods 0.000 claims description 28
- 229910052707 ruthenium Inorganic materials 0.000 claims description 27
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 24
- 239000010941 cobalt Substances 0.000 claims description 23
- 229910017052 cobalt Inorganic materials 0.000 claims description 23
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 23
- 229910052721 tungsten Inorganic materials 0.000 claims description 22
- 239000010937 tungsten Substances 0.000 claims description 22
- 229910052799 carbon Inorganic materials 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 238000000137 annealing Methods 0.000 claims description 18
- 238000000231 atomic layer deposition Methods 0.000 claims description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 238000009616 inductively coupled plasma Methods 0.000 claims description 10
- 239000003989 dielectric material Substances 0.000 claims description 9
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 229910021426 porous silicon Inorganic materials 0.000 claims description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims 1
- 239000010410 layer Substances 0.000 description 127
- 239000000463 material Substances 0.000 description 35
- 230000006698 induction Effects 0.000 description 20
- 235000012431 wafers Nutrition 0.000 description 19
- 239000007789 gas Substances 0.000 description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 14
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 14
- 238000010586 diagram Methods 0.000 description 11
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 10
- 230000008021 deposition Effects 0.000 description 10
- 150000002500 ions Chemical class 0.000 description 10
- 230000004888 barrier function Effects 0.000 description 8
- 238000011068 loading method Methods 0.000 description 8
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- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 8
- 230000007423 decrease Effects 0.000 description 7
- 229910052715 tantalum Inorganic materials 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- VSLPMIMVDUOYFW-UHFFFAOYSA-N dimethylazanide;tantalum(5+) Chemical compound [Ta+5].C[N-]C.C[N-]C.C[N-]C.C[N-]C.C[N-]C VSLPMIMVDUOYFW-UHFFFAOYSA-N 0.000 description 4
- 239000011572 manganese Substances 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 230000001603 reducing effect Effects 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
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- 238000000277 atomic layer chemical vapour deposition Methods 0.000 description 3
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- 239000002243 precursor Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
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- 238000003860 storage Methods 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 229940082150 encore Drugs 0.000 description 2
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- 239000011261 inert gas Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 239000010955 niobium Substances 0.000 description 2
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- JUTRBLIIVLVGES-UHFFFAOYSA-N cobalt tantalum Chemical compound [Co].[Ta] JUTRBLIIVLVGES-UHFFFAOYSA-N 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000001227 electron beam curing Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000000640 hydroxylating effect Effects 0.000 description 1
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- 238000010849 ion bombardment Methods 0.000 description 1
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- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910001512 metal fluoride Inorganic materials 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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- 150000002978 peroxides Chemical class 0.000 description 1
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- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
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- C—CHEMISTRY; METALLURGY
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- C23C16/45531—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations specially adapted for making ternary or higher compositions
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
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- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
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- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
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- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
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- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
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- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
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- H01L23/53238—Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
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- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
- H01L21/28562—Selective deposition
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Abstract
Description
Claims (20)
- 相互接続を形成する方法であって、
ルテニウム、タングステン、またはコバルトのうちの1つまたは複数を含む第1のドーパント量を有するドープされた窒化タンタル層を基板上に形成することと、
前記ドープされた窒化タンタル層を、ヘリウムまたはネオンのうちの1つまたは複数を含むプラズマに露出させて、前記第1のドーパント量より小さい第2のドーパント量を有する処理済みのドープされた窒化タンタル層を形成することとを含む、方法。 - 前記第1のドーパント量が、前記ドープされた窒化タンタル層の0.5~50質量%の範囲内である、請求項1に記載の方法。
- 前記第2のドーパント量が、前記第1のドーパント量から減少されており、前記処理済みのドープされた窒化タンタル層の0.05~20質量%の範囲内である、請求項2に記載の方法。
- 前記ドープされた窒化タンタル層を形成することが、原子層堆積によって窒化タンタルおよびドーパント含有層の積層を形成し、次いで前記積層をアニーリングすることを含む、請求項1に記載の方法。
- 前記ドープされた窒化タンタル層が、1200μΩ・cmより大きい抵抗を有する、請求項1に記載の方法。
- 前記処理済みのドープされた窒化タンタル層が、600μΩ・cmより小さい抵抗を有する、請求項1に記載の方法。
- 前記ドープされた窒化タンタルが、原子ベースで0.8%より大きい炭素含量を有する、請求項1に記載の方法。
- 前記処理済みのドープされた窒化タンタル層が、原子ベースで0.6%より小さい炭素含量を有する、請求項7に記載の方法。
- 前記プラズマが誘導結合プラズマであり、ICPコイルによって生成される、請求項1に記載の方法。
- 前記ICPコイルによって生成される前記プラズマが、2MHzの周波数を有する、請求項9に記載の方法。
- 指向性プラズマを生じるように、前記基板にバイアスがかけられる、請求項1に記載の方法。
- 前記処理済みのドープされた窒化タンタル層上に金属コンタクトを堆積させることをさらに含む、請求項1に記載の方法。
- 前記金属コンタクトが、銅、コバルト、またはマンガン、タングステン、もしくはアルミニウムのうちの1つもしくは複数でドープされた銅のうちの1つまたは複数を含む、請求項12に記載の方法。
- 前記基板が、構造が形成された表面を有し、前記構造が、ある距離だけ前記基板内へ延び、側壁および底部を有し、前記底部が銅層を含む、請求項1に記載の方法。
- 前記構造の前記側壁が低誘電率誘電体材料を含む、請求項14に記載の方法。
- 前記低誘電率誘電体材料が、フッ素でドープされた酸化ケイ素、有機ケイ酸塩ガラス、または多孔性二酸化ケイ素のうちの1つまたは複数を含む、請求項15に記載の方法。
- 前記ドープされた窒化タンタル層が、前記構造の前記側壁および底部に形成された共形の膜である、請求項16に記載の方法。
- 指向性プラズマを形成するように、前記基板にバイアスがかけられ、前記指向性プラズマが、前記構造の前記底部の前記窒化タンタルから前記ドーパントを除去し、前記側壁の前記窒化タンタルの実質的にすべての前記ドーパントを残す、請求項17に記載の方法。
- 中央移送ステーションの周りの1つまたは複数のプロセスチャンバであって、ドープされた窒化タンタル膜を堆積させ、前記ドープされた窒化タンタル膜をアニーリングし、前記アニーリング済みのドープされた窒化タンタル膜を、ヘリウムまたはネオンのうちの1つまたは複数を含むプラズマに露出させるように構成された1つまたは複数のプロセスチャンバと、
前記1つまたは複数のプロセスチャンバおよび中央移送ステーションに接続された少なくとも1つのコントローラであって、窒化タンタル膜を堆積させるための構成、ドーパント含有膜を堆積させるための構成、基板をアニーリングするための構成、前記1つまたは複数のプロセスチャンバと中央移送ステーションとの間で前記基板を動かすための構成、および前記基板をネオンプラズマに露出させるための構成から選択された1つまたは複数の構成を有する少なくとも1つのコントローラと
を備えるクラスタツール。 - 命令を含む非一時的コンピュータ可読媒体であって、前記命令が、処理チャンバのコントローラによって実行されたとき、
窒化タンタル膜を基板上に堆積させる動作と、
ドーパント含有膜を前記基板上に堆積させる動作と、
前記基板をアニーリングする動作と、
前記基板をネオンプラズマに露出させる動作とを、前記処理チャンバに実行させる、非一時的コンピュータ可読媒体。
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