JP2023516642A - 高能率低損傷加工方法及び加工装置 - Google Patents

高能率低損傷加工方法及び加工装置 Download PDF

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Publication number
JP2023516642A
JP2023516642A JP2022552329A JP2022552329A JP2023516642A JP 2023516642 A JP2023516642 A JP 2023516642A JP 2022552329 A JP2022552329 A JP 2022552329A JP 2022552329 A JP2022552329 A JP 2022552329A JP 2023516642 A JP2023516642 A JP 2023516642A
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Japan
Prior art keywords
machining
workpiece
damage
unit
processing
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Pending
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JP2022552329A
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English (en)
Japanese (ja)
Inventor
張璧
郭塞
殷景飛
楊秀軒
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Southwest University of Science and Technology
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Southwest University of Science and Technology
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Publication of JP2023516642A publication Critical patent/JP2023516642A/ja
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Milling Processes (AREA)
  • Turning (AREA)
JP2022552329A 2020-05-19 2020-11-27 高能率低損傷加工方法及び加工装置 Pending JP2023516642A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN202010426289.9A CN111618665B (zh) 2020-05-19 2020-05-19 高效率低损伤加工方法及加工装置
CN202010426289.9 2020-05-19
PCT/CN2020/132300 WO2021232735A1 (zh) 2020-05-19 2020-11-27 高效率低损伤加工方法及加工装置

Publications (1)

Publication Number Publication Date
JP2023516642A true JP2023516642A (ja) 2023-04-20

Family

ID=72256064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022552329A Pending JP2023516642A (ja) 2020-05-19 2020-11-27 高能率低損傷加工方法及び加工装置

Country Status (5)

Country Link
US (1) US20230143368A1 (zh)
EP (1) EP4155024A4 (zh)
JP (1) JP2023516642A (zh)
CN (1) CN111618665B (zh)
WO (1) WO2021232735A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111618665B (zh) * 2020-05-19 2022-03-29 南方科技大学 高效率低损伤加工方法及加工装置

Citations (7)

* Cited by examiner, † Cited by third party
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JPS53114681U (zh) * 1977-02-21 1978-09-12
JPS63286240A (ja) * 1987-05-18 1988-11-22 Mitsubishi Heavy Ind Ltd ポリオレフイン系樹脂発泡体の切削加工法
JPS6451256A (en) * 1987-08-21 1989-02-27 Fanuc Ltd Spindle device
JPH09155617A (ja) * 1995-12-15 1997-06-17 Niigata Pref Gov エンドミル状工具による繊維質有機材料、硬脆性無機材料、ガラス質無機材料の切削加工法
JP2004512185A (ja) * 2000-10-23 2004-04-22 べーリンガー ヴェルクツオィクマシーネン ゲーエムベーハー 組合せ機械
JP2008542053A (ja) * 2005-06-09 2008-11-27 ケンナメタル インコーポレイテッド 工作物を加工する工具および方法
CN102107376A (zh) * 2010-12-16 2011-06-29 湖南大学 一种实现磨削加工效率和质量最优化的工艺链方法

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DE69619789T2 (de) * 1995-09-28 2002-08-29 Rikagaku Kenkyusho Methode zum Bearbeiten mit hoher Geschwindigkeit von Matrizen und Ultrahochgeschwindigkeitsfräsmaschine
JP2013000845A (ja) * 2011-06-17 2013-01-07 Mitsubishi Heavy Ind Ltd 板状ワークの加工方法および加工体
CN102922014B (zh) * 2012-10-25 2015-07-01 沈阳航空航天大学 一种结合拉伸装夹的超声扭振侧铣方法
CN103163038B (zh) * 2013-04-02 2014-11-26 山东大学 电磁驱动高速切削模拟实验装置
CN203679976U (zh) * 2013-12-30 2014-07-02 天津大学 硬脆材料磨削脆-延转化临界切削深度确定装置
CN104044069B (zh) * 2014-07-03 2016-12-07 上海理工大学 基于声发射信号光学工件亚表面损伤深度预测方法
CN104625571A (zh) * 2015-01-06 2015-05-20 湖南科技大学 一种时效强化铝合金的切削加工方法
JP6602148B2 (ja) * 2015-10-16 2019-11-06 三菱電機株式会社 エンドミル
CN105562792A (zh) * 2015-11-26 2016-05-11 陕西高新实业有限公司 薄壁吊舱零件高速切削方法
CN105817976A (zh) * 2016-03-23 2016-08-03 大连理工大学 一种纳米深度损伤层高效超精密磨削方法
CN109145442B (zh) * 2018-08-22 2020-07-14 大连理工大学 Cfrp不同速度直角切削面下损伤深度的预测方法
US11116096B2 (en) * 2019-04-18 2021-09-07 City University Of Hong Kong Medium for binding components in an assembly of an electronic device, a method of preparing the same, a display assembly of an electronic device, and a system for simulating mechanical behaviours of the electronic device and the medium
CN110355620B (zh) * 2019-05-30 2021-07-27 浙江工业大学 陶瓷材质上芬顿辅助的旋转超声高效抛光法
CN110281087B (zh) * 2019-06-11 2021-06-01 北京航空航天大学 一种旋转超声振动磨削切削力预测方法
CN110480429B (zh) * 2019-10-17 2020-02-28 中国科学院宁波材料技术与工程研究所 车用硬脆材料旋转超声加工亚表层损伤深度在线预测方法
CN111618665B (zh) * 2020-05-19 2022-03-29 南方科技大学 高效率低损伤加工方法及加工装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53114681U (zh) * 1977-02-21 1978-09-12
JPS63286240A (ja) * 1987-05-18 1988-11-22 Mitsubishi Heavy Ind Ltd ポリオレフイン系樹脂発泡体の切削加工法
JPS6451256A (en) * 1987-08-21 1989-02-27 Fanuc Ltd Spindle device
JPH09155617A (ja) * 1995-12-15 1997-06-17 Niigata Pref Gov エンドミル状工具による繊維質有機材料、硬脆性無機材料、ガラス質無機材料の切削加工法
JP2004512185A (ja) * 2000-10-23 2004-04-22 べーリンガー ヴェルクツオィクマシーネン ゲーエムベーハー 組合せ機械
JP2008542053A (ja) * 2005-06-09 2008-11-27 ケンナメタル インコーポレイテッド 工作物を加工する工具および方法
CN102107376A (zh) * 2010-12-16 2011-06-29 湖南大学 一种实现磨削加工效率和质量最优化的工艺链方法

Also Published As

Publication number Publication date
WO2021232735A1 (zh) 2021-11-25
CN111618665A (zh) 2020-09-04
US20230143368A1 (en) 2023-05-11
EP4155024A4 (en) 2023-11-15
EP4155024A1 (en) 2023-03-29
CN111618665B (zh) 2022-03-29

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