JP2023516642A - 高能率低損傷加工方法及び加工装置 - Google Patents
高能率低損傷加工方法及び加工装置 Download PDFInfo
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- JP2023516642A JP2023516642A JP2022552329A JP2022552329A JP2023516642A JP 2023516642 A JP2023516642 A JP 2023516642A JP 2022552329 A JP2022552329 A JP 2022552329A JP 2022552329 A JP2022552329 A JP 2022552329A JP 2023516642 A JP2023516642 A JP 2023516642A
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- machining
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- unit
- processing
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- 238000003672 processing method Methods 0.000 title description 13
- 238000003754 machining Methods 0.000 claims abstract description 303
- 239000000463 material Substances 0.000 claims abstract description 163
- 238000000034 method Methods 0.000 claims abstract description 59
- 238000000227 grinding Methods 0.000 claims description 23
- 238000003801 milling Methods 0.000 claims description 17
- 238000005520 cutting process Methods 0.000 claims description 15
- 238000007514 turning Methods 0.000 claims description 15
- 238000001514 detection method Methods 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 230000002500 effect on skin Effects 0.000 abstract description 13
- 239000002344 surface layer Substances 0.000 abstract description 11
- 239000002131 composite material Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 10
- 229910000838 Al alloy Inorganic materials 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 230000007547 defect Effects 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 230000007123 defense Effects 0.000 description 2
- 238000009795 derivation Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 230000006911 nucleation Effects 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Milling Processes (AREA)
- Turning (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010426289.9A CN111618665B (zh) | 2020-05-19 | 2020-05-19 | 高效率低损伤加工方法及加工装置 |
CN202010426289.9 | 2020-05-19 | ||
PCT/CN2020/132300 WO2021232735A1 (zh) | 2020-05-19 | 2020-11-27 | 高效率低损伤加工方法及加工装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2023516642A true JP2023516642A (ja) | 2023-04-20 |
Family
ID=72256064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022552329A Pending JP2023516642A (ja) | 2020-05-19 | 2020-11-27 | 高能率低損傷加工方法及び加工装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230143368A1 (zh) |
EP (1) | EP4155024A4 (zh) |
JP (1) | JP2023516642A (zh) |
CN (1) | CN111618665B (zh) |
WO (1) | WO2021232735A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111618665B (zh) * | 2020-05-19 | 2022-03-29 | 南方科技大学 | 高效率低损伤加工方法及加工装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53114681U (zh) * | 1977-02-21 | 1978-09-12 | ||
JPS63286240A (ja) * | 1987-05-18 | 1988-11-22 | Mitsubishi Heavy Ind Ltd | ポリオレフイン系樹脂発泡体の切削加工法 |
JPS6451256A (en) * | 1987-08-21 | 1989-02-27 | Fanuc Ltd | Spindle device |
JPH09155617A (ja) * | 1995-12-15 | 1997-06-17 | Niigata Pref Gov | エンドミル状工具による繊維質有機材料、硬脆性無機材料、ガラス質無機材料の切削加工法 |
JP2004512185A (ja) * | 2000-10-23 | 2004-04-22 | べーリンガー ヴェルクツオィクマシーネン ゲーエムベーハー | 組合せ機械 |
JP2008542053A (ja) * | 2005-06-09 | 2008-11-27 | ケンナメタル インコーポレイテッド | 工作物を加工する工具および方法 |
CN102107376A (zh) * | 2010-12-16 | 2011-06-29 | 湖南大学 | 一种实现磨削加工效率和质量最优化的工艺链方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69619789T2 (de) * | 1995-09-28 | 2002-08-29 | Rikagaku Kenkyusho | Methode zum Bearbeiten mit hoher Geschwindigkeit von Matrizen und Ultrahochgeschwindigkeitsfräsmaschine |
JP2013000845A (ja) * | 2011-06-17 | 2013-01-07 | Mitsubishi Heavy Ind Ltd | 板状ワークの加工方法および加工体 |
CN102922014B (zh) * | 2012-10-25 | 2015-07-01 | 沈阳航空航天大学 | 一种结合拉伸装夹的超声扭振侧铣方法 |
CN103163038B (zh) * | 2013-04-02 | 2014-11-26 | 山东大学 | 电磁驱动高速切削模拟实验装置 |
CN203679976U (zh) * | 2013-12-30 | 2014-07-02 | 天津大学 | 硬脆材料磨削脆-延转化临界切削深度确定装置 |
CN104044069B (zh) * | 2014-07-03 | 2016-12-07 | 上海理工大学 | 基于声发射信号光学工件亚表面损伤深度预测方法 |
CN104625571A (zh) * | 2015-01-06 | 2015-05-20 | 湖南科技大学 | 一种时效强化铝合金的切削加工方法 |
JP6602148B2 (ja) * | 2015-10-16 | 2019-11-06 | 三菱電機株式会社 | エンドミル |
CN105562792A (zh) * | 2015-11-26 | 2016-05-11 | 陕西高新实业有限公司 | 薄壁吊舱零件高速切削方法 |
CN105817976A (zh) * | 2016-03-23 | 2016-08-03 | 大连理工大学 | 一种纳米深度损伤层高效超精密磨削方法 |
CN109145442B (zh) * | 2018-08-22 | 2020-07-14 | 大连理工大学 | Cfrp不同速度直角切削面下损伤深度的预测方法 |
US11116096B2 (en) * | 2019-04-18 | 2021-09-07 | City University Of Hong Kong | Medium for binding components in an assembly of an electronic device, a method of preparing the same, a display assembly of an electronic device, and a system for simulating mechanical behaviours of the electronic device and the medium |
CN110355620B (zh) * | 2019-05-30 | 2021-07-27 | 浙江工业大学 | 陶瓷材质上芬顿辅助的旋转超声高效抛光法 |
CN110281087B (zh) * | 2019-06-11 | 2021-06-01 | 北京航空航天大学 | 一种旋转超声振动磨削切削力预测方法 |
CN110480429B (zh) * | 2019-10-17 | 2020-02-28 | 中国科学院宁波材料技术与工程研究所 | 车用硬脆材料旋转超声加工亚表层损伤深度在线预测方法 |
CN111618665B (zh) * | 2020-05-19 | 2022-03-29 | 南方科技大学 | 高效率低损伤加工方法及加工装置 |
-
2020
- 2020-05-19 CN CN202010426289.9A patent/CN111618665B/zh active Active
- 2020-11-27 EP EP20937035.2A patent/EP4155024A4/en active Pending
- 2020-11-27 US US17/802,283 patent/US20230143368A1/en active Pending
- 2020-11-27 WO PCT/CN2020/132300 patent/WO2021232735A1/zh unknown
- 2020-11-27 JP JP2022552329A patent/JP2023516642A/ja active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53114681U (zh) * | 1977-02-21 | 1978-09-12 | ||
JPS63286240A (ja) * | 1987-05-18 | 1988-11-22 | Mitsubishi Heavy Ind Ltd | ポリオレフイン系樹脂発泡体の切削加工法 |
JPS6451256A (en) * | 1987-08-21 | 1989-02-27 | Fanuc Ltd | Spindle device |
JPH09155617A (ja) * | 1995-12-15 | 1997-06-17 | Niigata Pref Gov | エンドミル状工具による繊維質有機材料、硬脆性無機材料、ガラス質無機材料の切削加工法 |
JP2004512185A (ja) * | 2000-10-23 | 2004-04-22 | べーリンガー ヴェルクツオィクマシーネン ゲーエムベーハー | 組合せ機械 |
JP2008542053A (ja) * | 2005-06-09 | 2008-11-27 | ケンナメタル インコーポレイテッド | 工作物を加工する工具および方法 |
CN102107376A (zh) * | 2010-12-16 | 2011-06-29 | 湖南大学 | 一种实现磨削加工效率和质量最优化的工艺链方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2021232735A1 (zh) | 2021-11-25 |
CN111618665A (zh) | 2020-09-04 |
US20230143368A1 (en) | 2023-05-11 |
EP4155024A4 (en) | 2023-11-15 |
EP4155024A1 (en) | 2023-03-29 |
CN111618665B (zh) | 2022-03-29 |
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