JP2023509943A - 基板処理装置及び方法 - Google Patents

基板処理装置及び方法 Download PDF

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JP2023509943A
JP2023509943A JP2022540837A JP2022540837A JP2023509943A JP 2023509943 A JP2023509943 A JP 2023509943A JP 2022540837 A JP2022540837 A JP 2022540837A JP 2022540837 A JP2022540837 A JP 2022540837A JP 2023509943 A JP2023509943 A JP 2023509943A
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plasma
inner chamber
chamber
reaction chamber
substrate
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JP2023509943A5 (https=
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ヴァイノ キルピ
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Picosun Oy
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Picosun Oy
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    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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    • C23C16/45523—Pulsed gas flow or change of composition over time
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    • C23C16/45536—Use of plasma, radiation or electromagnetic fields
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    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
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    • H01J37/32—Gas-filled discharge tubes
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    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
    • H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H10P14/6336—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
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    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
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    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
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