JP2023502617A - レーザ加工システム及びレーザ加工方法 - Google Patents

レーザ加工システム及びレーザ加工方法 Download PDF

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Publication number
JP2023502617A
JP2023502617A JP2022527834A JP2022527834A JP2023502617A JP 2023502617 A JP2023502617 A JP 2023502617A JP 2022527834 A JP2022527834 A JP 2022527834A JP 2022527834 A JP2022527834 A JP 2022527834A JP 2023502617 A JP2023502617 A JP 2023502617A
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Prior art keywords
workpiece
laser
lens
laser beam
processing
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JP2022527834A
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Japanese (ja)
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JP7522834B2 (ja
Inventor
ジュンジョン イ
デヨン イ
ボンドン イ
チャンファン ソン
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ミーレ カンパニー インコーポレイテッド
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2022527834A 2019-12-31 2020-12-18 レーザ加工システム及びレーザ加工方法 Active JP7522834B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2019-0179976 2019-12-31
KR1020190179976A KR102324548B1 (ko) 2019-12-31 2019-12-31 레이저 가공 시스템 및 레이저 가공 방법
PCT/KR2020/018695 WO2021137488A1 (ko) 2019-12-31 2020-12-18 레이저 가공 시스템 및 레이저 가공 방법

Publications (2)

Publication Number Publication Date
JP2023502617A true JP2023502617A (ja) 2023-01-25
JP7522834B2 JP7522834B2 (ja) 2024-07-25

Family

ID=76686009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022527834A Active JP7522834B2 (ja) 2019-12-31 2020-12-18 レーザ加工システム及びレーザ加工方法

Country Status (5)

Country Link
JP (1) JP7522834B2 (ko)
KR (2) KR102324548B1 (ko)
CN (1) CN114728373A (ko)
DE (1) DE112020006412T5 (ko)
WO (1) WO2021137488A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102324548B1 (ko) * 2019-12-31 2021-11-10 (주)미래컴퍼니 레이저 가공 시스템 및 레이저 가공 방법
KR20240002660A (ko) * 2022-06-29 2024-01-05 (주)미래컴퍼니 표시 장치 제조에 사용되는 레이저 가공 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005262251A (ja) * 2004-03-17 2005-09-29 Shibaura Mechatronics Corp レーザ加工装置
JP2010099674A (ja) * 2008-10-21 2010-05-06 Mitsubishi Electric Corp レーザ加工装置
JP2016168600A (ja) * 2015-03-11 2016-09-23 オムロン株式会社 接合構造体の製造方法および接合構造体
US20180157006A1 (en) * 2016-12-06 2018-06-07 Samsung Display Co. Ltd. Laser processing apparatus

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6875951B2 (en) * 2000-08-29 2005-04-05 Mitsubishi Denki Kabushiki Kaisha Laser machining device
JP4667329B2 (ja) * 2006-08-30 2011-04-13 三菱電機株式会社 レーザ加工装置
JP4805123B2 (ja) 2006-12-22 2011-11-02 日酸Ｔａｎａｋａ株式会社 トーチの開先角度の制御方法及びトーチの開先角度の制御装置
JP4386137B2 (ja) * 2008-02-29 2009-12-16 トヨタ自動車株式会社 レーザ加工装置及びレーザ加工方法
JP2010227962A (ja) 2009-03-26 2010-10-14 Fujitsu Ltd レーザ加工方法
SE0950604A1 (sv) * 2009-08-24 2010-06-22 Esab Ab Anordning och förfarande för automatisk flersträngssvetsning
FR2949618B1 (fr) * 2009-09-01 2011-10-28 Air Liquide Tete de focalisation laser pour installation laser solide
JP5994723B2 (ja) * 2013-05-09 2016-09-21 トヨタ自動車株式会社 レーザ穴あけ加工方法および装置
US10357848B2 (en) * 2015-01-19 2019-07-23 General Electric Company Laser machining systems and methods
KR101742132B1 (ko) * 2015-08-10 2017-05-31 주식회사 이오테크닉스 레이저 가공장치
WO2018047823A1 (ja) * 2016-09-09 2018-03-15 三菱電機株式会社 レーザ加工装置
KR102108403B1 (ko) * 2017-04-14 2020-05-26 (주)비슬로 다축 레이저 가공기
KR102324548B1 (ko) * 2019-12-31 2021-11-10 (주)미래컴퍼니 레이저 가공 시스템 및 레이저 가공 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005262251A (ja) * 2004-03-17 2005-09-29 Shibaura Mechatronics Corp レーザ加工装置
JP2010099674A (ja) * 2008-10-21 2010-05-06 Mitsubishi Electric Corp レーザ加工装置
JP2016168600A (ja) * 2015-03-11 2016-09-23 オムロン株式会社 接合構造体の製造方法および接合構造体
US20180157006A1 (en) * 2016-12-06 2018-06-07 Samsung Display Co. Ltd. Laser processing apparatus

Also Published As

Publication number Publication date
KR20210086199A (ko) 2021-07-08
DE112020006412T5 (de) 2022-11-17
CN114728373A (zh) 2022-07-08
KR102324548B1 (ko) 2021-11-10
KR102324548B9 (ko) 2022-03-15
KR102483670B1 (ko) 2023-01-03
KR20210136946A (ko) 2021-11-17
JP7522834B2 (ja) 2024-07-25
WO2021137488A1 (ko) 2021-07-08

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