JP2023173758A - Exposure device, exposure method, and article manufacturing method - Google Patents

Abstract

To provide a lithography device advantageous in a production cost and a through-put with regard to correction processing for a placement error of a plurality of substrates.SOLUTION: An exposure device includes: a holding part configured to hold a plurality of substrates arranged on one holding face; a measurement part configured to measure an amount of positional deviation against a reference position with regard to each of the plurality of substrates held by the holding part; a drive mechanism configured to rotate and drive the holding part around an axis intersecting the holding face; and a control part configured to control an exposure of each of the plurality of substrates held by the holding part. The control part determines a drive amount of the drive mechanism according to the amount of positional deviation of each of the plurality of substrates obtained by the measurement, drives the drive mechanism according to the determined drive amount and then sequentially exposes each of the plurality of substrates.SELECTED DRAWING: Figure 8

Description

The present invention relates to an exposure apparatus, an exposure method, and an article manufacturing method.

In the lithography process, which is a manufacturing process for flat panel displays (FPDs), etc., exposure equipment is used to transfer the pattern by projecting the pattern on an original (mask) onto a substrate (glass plate or wafer) via a projection optical system. be done.

In recent years, displays such as liquid crystal panels have become larger, and devices used in the lithography process and the processes before and after the lithography process also need to be compatible with such larger substrates. However, at present, for example, there may be a situation in which a processing apparatus used in a process prior to a lithography process in which an exposure apparatus is used can only process small-sized substrates. Under such circumstances, in order to improve processing efficiency, an exposure apparatus places a plurality of substrates on a stage at the same time and exposes them.

When a plurality of substrates are placed on a stage, there is a possibility that placement errors may occur in different rotational directions with respect to the stage for each substrate. Therefore, at present, the position of the stage is adjusted to correct the placement error before each substrate is exposed. Patent Document 1 discloses that when a plurality of substrates are placed on a substrate placement section, the placement timing of each substrate is shifted and the substrate holding section is driven in the rotational direction during that time, thereby reducing the placement error of the plurality of substrates. A technique for individually correcting is disclosed.

Japanese Patent Application Publication No. 2020-194007

However, in order to implement the technique described in Patent Document 1, a mechanism for shifting the mounting timing of each substrate is required, which increases manufacturing costs. Further, in the technique described in Patent Document 1, it is necessary to correct a placement error by rotating the substrate holding section individually for all of the plurality of substrates. Since it takes a certain amount of time to rotate the substrate holder, throughput decreases when the substrate holder is individually driven to rotate for all of the plurality of substrates.

The present invention provides a lithography apparatus that is advantageous in terms of manufacturing cost and throughput, for example, in terms of correction processing for placement errors of a plurality of substrates.

According to one aspect of the present invention, there is provided an exposure apparatus that exposes a substrate, including a holding part that holds a plurality of substrates arranged on one holding surface, and a plurality of substrates held by the holding part. for each of the plurality of substrates held by the holding section, a measuring section that measures the amount of positional deviation with respect to a reference position, a drive mechanism that rotationally drives the holding section around an axis intersecting the holding surface, and a a control unit that controls each exposure, and the control unit determines the drive amount of the drive mechanism based on the positional shift amount of each of the plurality of substrates obtained by the measurement, and the control unit There is provided an exposure apparatus characterized in that the drive mechanism is driven by a determined drive amount, and then each of the plurality of substrates is sequentially exposed.

According to the present invention, it is possible to provide a lithography apparatus that is advantageous in terms of manufacturing cost and throughput regarding correction processing of placement errors of a plurality of substrates.

FIG. 2 is a block diagram showing the configuration of an exposure apparatus. The figure which shows the structure for performing board|substrate delivery. FIG. 3 is a diagram illustrating a board transfer operation. Flowchart of board transfer operation. FIG. 3 is a diagram showing the state of the substrate after the substrate is delivered. 1 is a flowchart of conventional exposure processing for multiple substrates. The figure which shows the example of a structure of a (theta) drive mechanism. Flowchart of calculation process of θ drive amount. Flowchart of calculation process of θ drive amount. Flowchart of calculation process of θ drive amount. A flowchart of exposure processing for multiple substrates.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the claimed invention. Although a plurality of features are described in the embodiments, not all of these features are essential to the invention, and the plurality of features may be arbitrarily combined. Furthermore, in the accompanying drawings, the same or similar components are designated by the same reference numerals, and redundant description will be omitted.

The present invention relates to a technique for correcting a mounting error of a plurality of substrates on a substrate holder (chuck), and the technique can be applied to a lithography apparatus that transfers or forms a pattern on an original onto a substrate. An exposure apparatus that is an example of a lithography apparatus will be described below. However, the lithography apparatus is not limited to an exposure apparatus, and may be another lithography apparatus. For example, the lithography apparatus may be a drawing apparatus that performs drawing on (a photosensitive material on) a substrate using a charged particle beam. Alternatively, the lithography apparatus may be an imprint apparatus that forms a pattern on the substrate by molding an imprint material on the substrate with a mold.

FIG. 1 is a diagram showing a configuration example of an exposure apparatus 10 in an embodiment. In this specification and the drawings, directions are shown in an XYZ coordinate system in which the horizontal plane is the XY plane. The plate stage 17, which will be described later, holds the substrate 16 on the holding surface of the plate stage 17 so that the surface of the substrate 16 is parallel to the horizontal plane (XY plane). Therefore, hereinafter, directions perpendicular to each other within a plane along the holding surface of the plate stage 17 will be referred to as the X-axis and the Y-axis, and a direction perpendicular to the X-axis and the Y-axis will be referred to as the Z-axis. Furthermore, hereinafter, directions parallel to the X, Y, and Z axes in the XYZ coordinate system will be referred to as the X direction, Y direction, and Z direction, respectively, and the direction of rotation around the Z axis will be referred to as the θ direction.

In this embodiment, the exposure apparatus 10 is assumed to be used as a lithography apparatus, for example, in the manufacturing process of flat panels such as liquid crystal display devices and organic EL devices. The exposure device 10 uses, for example, a step-and-scan method to transfer a pattern formed on a mask 13, which is an original, onto a substrate 16, which is a glass plate whose surface is coated with a resist (photosensitive agent). It may be a scanning type projection exposure apparatus. The exposure apparatus 10 may include an illumination optical system 12, a mask stage 14, a projection optical system 15, a plate stage 17, and a measurement camera 18 (measurement section). The mask 13 is mounted on the mask stage 14, and the substrate 16 is mounted on the plate stage 17. The control device 30 (control unit) controls the operation of the exposure device 10. The control device 30 may be configured by, for example, a PLD such as an FPGA, an ASIC, a general-purpose computer with a program installed, or a combination of all or part of these. For example, control device 30 may include a processor and memory that stores programs and data. Note that the control device 30 may be placed inside the exposure apparatus 10 or may be placed outside the exposure apparatus 10.

Illumination optical system 12 illuminates mask 13 using light from light source 11 . Projection optical system 15 projects the pattern drawn on mask 13 onto substrate 16 . During exposure processing, the exposure apparatus 10 performs highly accurate alignment between the pattern on the substrate 16, on which a pattern has already been formed, and the pattern on the mask 13. Specifically, the control device 30 performs the exposure process while controlling at least one of the mask stage 14 and the plate stage 17 in the XYθ directions based on the amount of positional deviation of the pattern measured using the camera 18. The amount of positional shift is determined by the relative position of the pattern on the mask 13 and the pattern on the substrate 16. The amount of positional deviation also includes a placement error component when the substrate 16 is mounted on the plate stage 17.

In this embodiment, the exposure apparatus 10 is capable of mounting a plurality of substrates on the plate stage 17 and sequentially exposing each of the plurality of substrates. FIG. 2 shows an example of a configuration for transferring substrates to and from the plate stage 17. The plate stage 17 has a stage 100 that can be driven in the X and Y directions. A substrate holder 101 that can be driven in the XYθ directions is arranged on the stage 100. Furthermore, a substrate mounting section 102 that can be driven in the XYZ directions is arranged above the substrate holding section 101 to transfer substrates. The substrate transport section 103 carries in a plurality of substrates from outside the apparatus and transfers them to the substrate platform 102.

In the example of FIG. 2, a plurality of substrates 16a, 16b, 16c, and 16d are transferred from the substrate transport section 103 to the substrate platform 102. In FIG. 2, the substrate platform 102 is driven in the Z direction while being shifted in the Y direction by rotating the support member of the substrate platform 102 around a point in contact with the substrate holding section 101 as an axis. The position raised in the Z direction by this drive is set as a transfer position, and when a substrate is transferred between the substrate platform 102 and the substrate transport unit 103, the substrate platform 102 moves to the transfer position. The substrate mounting section 102 holds the substrate by suction when the substrate is held and driven in the Z direction. Further, the substrate mounting section 102 is stored in the substrate holding section 101 together with the supporting member and the member with which the substrate comes into contact, except when transferring the substrate. Therefore, in the example of FIG. 2, the surface of the substrate mounting section 102 constitutes one holding surface for holding a plurality of substrates in the substrate holding section 101. Note that the above-described configuration for driving the substrate mounting section 102 with respect to the substrate holding section 101 is an example, and the present invention is not limited to this configuration.

A method of transferring a plurality of substrates will be described with reference to FIGS. 3 and 4. When carrying in the substrate, in S20, the control device 30 drives the substrate platform 102 to the delivery position. In S21, the substrate transfer unit 103 confirms that the substrate platform 102 is at the transfer position, and as shown in FIG. 102. FIG. 3B shows a state in which a plurality of substrates 16a, 16b, 16c, and 16d are transferred to the substrate platform 102. After the plurality of substrates 16a, 16b, 16c, and 16d are delivered to the substrate platform 102, in S22, the control device 30 drives the substrate platform 102 in the YZ direction. As a result, the plurality of substrates 16a, 16b, 16c, and 16d are transferred to the substrate holding section 101, as shown in FIG. 3(C).

As shown in FIG. 5, the plurality of substrates 16a, 16b, 16c, and 16d held by the substrate holding unit 101 through such a delivery method are held with a positioning error (rotation error) in the θ direction that may be different from each other. It can be done. According to the prior art, before each substrate is exposed to light, the position of the substrate holder is adjusted to correct placement errors. FIG. 6A shows a flowchart of exposure processing for a plurality of substrates according to the prior art.

In S1, the control device 30 controls the substrate transport section 103 to transport a plurality of substrates 16a, 16b, 16c, and 16d. The plurality of substrates 16a, 16b, 16c, and 16d carried in are delivered to the substrate holding section 101 as described above. In S2, the control device 30 uses the camera 18 to measure the position of each board.

In order to expose the substrate 16a in S3, the control device 30 selects a position (hereinafter referred to as "optimal") where there is no misalignment between the pattern on the substrate 16a and the pattern on the mask 13, based on the position measurement result of the substrate 16a in S2. The substrate holder 101 is driven to a certain rotational position. At this time, the control device 30 drives the substrate holder 101 in the θ direction with respect to the stage 100 (θ drive). In S4, the control device 30 performs an exposure process on the substrate 16a. During the exposure process, the substrate holder 101 is locked to the stage 100.

After the exposure process for the substrate 16a is completed, in S5, the control device 30 sets the substrate holder 101 to the optimal rotational position for performing the exposure process for the substrate 16b, based on the position measurement result of the substrate 16b in S2. The θ drive is performed as follows. In S6, the control device 30 performs an exposure process on the substrate 16b with the substrate holding section 101 locked.

After the exposure processing of the substrate 16b is completed, in S7, the control device 30 sets the substrate holder 101 to the optimal rotational position for performing the exposure processing of the substrate 16c, based on the position measurement result of the substrate 16c in S2. The θ drive is performed as follows. In S8, the control device 30 performs an exposure process on the substrate 16c with the substrate holder 101 locked.

After the exposure processing of the substrate 16c is completed, in S9, the control device 30 sets the substrate holder 101 to the optimal rotational position for performing the exposure processing of the substrate 16d, based on the position measurement result of the substrate 16d in S2. The θ drive is performed as follows. In S10, the control device 30 performs an exposure process on the substrate 16d with the substrate holder 101 locked.

In this way, exposure processing is performed on the plurality of substrates 16a, 16b, 16c, and 16d. After the exposure of each substrate is completed, in S11, the control device 30 controls the substrate transport section 103 to transport the plurality of substrates 16a, 16b, 16c, and 16d.

FIG. 7 shows a configuration example of a θ drive mechanism that realizes θ drive. The θ drive mechanism is an example of a drive mechanism that rotates the substrate holder 101 around an axis (Z-axis) that intersects the holding surface of the substrate holder 101. The θ drive mechanism may include a rotation mechanism 204 provided between the substrate holder 101 and the stage 100 and an air cylinder 205. Further, the θ drive mechanism may include a lock mechanism (not shown) that is disposed between the substrate holder 101 and the stage 100 and restricts rotation of the substrate holder 101 in the θ direction by the rotation mechanism 204. In one example, the locking mechanism may include a magnet disposed on one of the mutually opposing surfaces of the substrate holder 101 and the stage 100, and a metal member disposed on the other surface. Due to the magnetic force (magnetic attraction) of the magnet, the substrate holder 101 is attracted to the stage 100 (via the rotation mechanism 204), thereby creating a lock that restricts rotation of the substrate holder 101 relative to the stage 100 in the θ direction. state.

FIG. 6(B) shows specific steps of θ drive in S3, S5, S7, and S9 using the θ drive mechanism of FIG. In S12, the control device 30 unlocks the substrate holding section 101. For example, in the example shown in FIG. 7, an air cylinder 205 blows air between the substrate holding section 101 and the rotation mechanism 204. It is assumed that the aerodynamic force caused by this air blow exceeds the above magnetic force. Therefore, this air blow moves the substrate holder 101 in the +Z direction, thereby unlocking the rotation of the substrate holder 101 in the θ direction with respect to the stage 100, and the rotation of the substrate holder 101 in the θ direction by the rotation mechanism 204. becomes possible.

In the unlocked state, in S13, the control device 30 controls the rotation mechanism 204 to drive the substrate holder 101 in the θ direction. After that, in S14, the control device 30 locks the substrate holding section 101. Specifically, the air cylinder 205 sucks gas between the substrate holding section 101 and the rotation mechanism 204. The substrate holder 101 moves in the -Z direction due to the aerodynamic force, and is attracted to the stage 100 (via the rotation mechanism 204) by the magnetic force (magnetic attraction) of the magnet, and the substrate holder 101 is rotated θ with respect to the stage 100. It becomes a locked state where rotation in the direction is restricted.

In this way, the θ drive includes the unlocking operation by the θ drive mechanism in S12 and the locking operation by the θ drive mechanism in S14, and since these are performed using aerodynamics, there is a certain amount of force that cannot be ignored from the perspective of throughput. Processing time is required. In the conventional exposure process shown in FIG. 6A, it is necessary to perform the θ drive four times until the exposure process of the plurality of substrates 16a, 16b, 16c, and 16d is completed (S3 , S5, S7, S9). Therefore, in conventional exposure processing, the θ driving time is required for the number of substrates.

In contrast, in this embodiment, the number of θ drives is reduced as much as possible. Hereinafter, with reference to the flowcharts of FIGS. 8 to 10, processing related to calculation of the θ drive amount in the embodiment will be described.
In S30, the control device 30 controls the substrate transport unit 103 to transport the plurality of substrates 16a, 16b, 16c, and 16d.
In S31, the control device 30 uses the camera 18 to measure the position of each board relative to the reference position (the position where θ=0).
In S32, the control device 30 calculates the position correction amount for each board based on the position measurement results. The position correction amount is calculated as the rotational direction and amount of rotation of the substrate holding unit 101 that cancels the amount of deviation in the rotational direction of each substrate from the target position.

In S33, the control device 30 determines whether there is a θ drive amount that allows all the substrates to fall within the reference range of the target position with one θ drive. For example, the control device 30 calculates the amount of deviation in the θ direction of each board after θ driving based on the position measurement results for each value of the θ driving amount within the assumed range, and adjusts the positional deviation by the calculated amount of deviation. It is determined whether the board is within the capture range of the camera 18. If there is a θ drive amount in which all the boards fall within the capture range of the camera 18 among the θ drive amounts within the expected range, that θ drive amount will be within the reference range of the target position when all the boards are driven once by the θ drive. It is specified as the θ drive amount that falls within the range. If such a θ drive amount is found, the process proceeds to S34. In S34, the control device 30 stores the specified θ drive amount in the memory.

In S33, if it is determined that there is no θ drive amount that falls within the reference range of the target position in one θ drive for all the substrates, the process proceeds to S50 (FIG. 9). In S50, the control device 30 specifies the θ drive amount at which the maximum number of substrates (for example, 3) that falls within the reference range of the target position in one θ drive. In S51, the control device 30 determines whether the θ drive amount specified in S50 is uniquely determined. If the θ drive amount specified in S50 is uniquely determined, the process proceeds to S54. In S54, the control device 30 stores the θ drive amount specified in S50 in the memory.

If the θ drive amount specified in S50 is not uniquely determined, that is, if there is a plurality of θ drive amounts that result in the maximum number of substrates falling within the reference range of the target position (NO in S51), the process proceeds to S52. . In S52, the control device 30 determines the θ drive amount (for example, θ drive at which the deviation is the minimum) such that the deviation (standard deviation) of the deviation amount of the substrate that does not fall within the reference range of the target position after the θ drive falls within the allowable range. amount). In S53, the control device 30 determines whether the θ drive amount specified in S52 is uniquely determined. If the θ drive amount is uniquely determined, the process proceeds to S54, and the control device 30 stores the θ drive amount specified in S52 in the memory.

In S53, if it is determined that the θ driving amount that does not fall within the standard range of the target position after θ driving and the deviation of the deviation of the substrate within the allowable range cannot be uniquely determined, the process proceeds to S60 (FIG. 10). . In S60, the control device 30 calculates the θ driving amount (for example, the θ driving amount that minimizes the variance) so that the variance of the deviation amount of all the substrates after the θ driving falls within the allowable range. In S61, the control device 30 determines whether the θ drive amount calculated in S60 is uniquely determined. When the θ drive amount is uniquely determined, in S63, the control device 30 stores the θ drive amount in the memory.

If there are a plurality of θ driving amounts in which the variance of the deviation amount of all the substrates falls within the allowable range (NO in S61), the process proceeds to S62. In S62, the control device 30 determines the θ drive amount based on the priority regarding the exposure order. For example, the θ drive amount that prioritizes a high-priority substrate is specified. Thereafter, in S63, the control device 30 stores the θ drive amount specified in S62 in the memory.

FIG. 11 shows a flowchart showing the steps of exposure processing for a plurality of substrates according to this embodiment. This flowchart shows, as an example, the procedure when it is determined in S33 that there is a θ drive amount that allows all the substrates to fall within the reference range of the target position by one θ drive.

In S40, the control device 30 controls the substrate transport unit 103 to transport the plurality of substrates 16a, 16b, 16c, and 16d. In S41, the control device 30 uses the camera 18 to measure the position of each board. However, if a plurality of substrates 16a, 16b, 16c, and 16d have already been carried in for the θ drive amount calculation process in FIGS. 8 to 10 described above, S40 and S41 are skipped.

In S42, the control device 30 performs θ driving of the substrate holder 101 using the θ driving amount stored in the memory in S34. After that, the control device 30 performs the exposure process in the order of the substrates with the highest exposure priority (in the example of FIG. 11, the plurality of substrates 16a, 16b, 16c, and 16d) (S43, S44, S45, S46) . In this case, there is no need to perform individual θ driving between each substrate as in the conventional example shown in FIG. 6(A). After the exposure process for each substrate is completed, in S47, the control device 30 controls the substrate transport section 103 to transport the plurality of substrates 16a, 16b, 16c, and 16d.

According to the above-described exposure processing for each substrate, the θ drive (each operation of unlocking (S12), driving (S13), and locking (S14)) only needs to be performed once, thereby improving throughput.

As described above, FIG. 11 shows, as an example, the procedure when it is determined in S33 that there is a θ drive amount that allows all the substrates to fall within the reference range of the target position by one θ drive. In the following, a case will be described in which there is no θ drive amount that falls within the reference range of the target position in one θ drive for all the substrates. In S50, if the θ drive amount that causes the maximum number of substrates (for example, 3) that fall within the reference range of the target position in one θ drive is specified, in place of S43 to S46 above, Exposure processing is performed sequentially. For other substrates, θ driving is performed using the θ driving amount calculated in S32, and then exposure processing is performed on the substrates. If there are a plurality of substrates that were excluded in S50, the processes of FIGS. 8 to 10 may be re-executed for the plurality of substrates. In this way, in this embodiment, the number of times of θ driving is reduced as much as possible.

The effects of the series of processes explained above will be summarized.
If all the substrates have a θ drive amount that falls within the reference range of the target position with one θ drive (YES in S33), θ drive is performed only once, and then exposure processing is performed on each substrate in sequence. . This improves throughput. Further, according to the present embodiment, there is no need for a mechanism for shifting the mounting timing of each substrate as in the prior art, which is advantageous in terms of manufacturing costs.

If all the substrates are θ-driven only once and there is no θ-drive amount that falls within the reference range of the target position (NO in S33), the following processing is performed.
If the θ drive amount that maximizes the number of substrates that fall within the reference range of the target position in one θ drive is uniquely determined (YES in S51), only one θ drive is performed for those substrates. For other substrates, θ driving is performed individually. If the θ drive amount that maximizes the number of substrates that fall within the reference range of the target position in one θ drive is not uniquely determined (NO in S51), the θ drive amount is determined by a drive pattern that minimizes the number of θ drives. Among them, the value that minimizes the standard deviation of the deviation amount of all the substrates after θ driving is determined (S52). Since θ driving is performed with the determined θ driving amount, the θ driving distance of the substrate holding unit 101 required for θ driving becomes relatively small, and the total time of θ driving can be made shorter than in the conventional example. This improves throughput.

There may be cases where the correction amount that minimizes the standard deviation of the deviation amount of the substrate that does not fall within the reference range of the target position after θ driving cannot be uniquely determined (NO in S53). In that case, the θ driving amount is determined by the standard deviation of the deviation amount of all substrates after θ driving is the minimum among the drive patterns with the minimum number of θ driving, and the variance of the deviation amount of all substrates after θ driving correction. is determined to be the minimum value (S60). Since the θ drive is performed with the determined θ drive amount, the θ drive distance of the substrate holder 101 required for θ drive correction becomes relatively small, and the total time of the θ drive can be made shorter than in the conventional example. possible, and throughput is improved.

<Embodiment of article manufacturing method>
The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing articles such as micro devices such as semiconductor devices and elements having fine structures. The article manufacturing method of the present embodiment includes a step of forming a latent image pattern on a photosensitive agent applied to a substrate using the above exposure device (a step of exposing the substrate), and a step of forming a latent image pattern in this step. and developing the substrate. Additionally, such manufacturing methods include other well-known steps (oxidation, deposition, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method of this embodiment is advantageous in at least one of article performance, quality, productivity, and production cost compared to conventional methods.

The disclosure of this specification includes at least the following exposure apparatus, exposure method, and article manufacturing method.
(Item 1)
An exposure device that exposes a substrate,
a holding part that holds a plurality of substrates arranged on one holding surface;
a measuring unit that measures the amount of positional deviation with respect to a reference position for each of the plurality of substrates held by the holding unit;
a drive mechanism that rotates the holding part around an axis that intersects the holding surface;
a control unit that controls exposure of each of the plurality of substrates held by the holding unit,
The control unit includes:
determining the amount of drive of the drive mechanism based on the amount of positional deviation of each of the plurality of substrates obtained by the measurement;
driving the drive mechanism with the determined drive amount, and then sequentially exposing each of the plurality of substrates;
An exposure device characterized by:
(Item 2)
The control unit includes:
specifying a drive amount by which all of the plurality of substrates fall within a reference range of a target position with one drive of the drive mechanism;
driving the drive mechanism with the specified drive amount, and then sequentially exposing each of the plurality of substrates;
The exposure apparatus according to item 1, characterized in that:
(Item 3)
The control unit includes:
If there is no drive amount that allows all of the plurality of substrates to fall within the reference range of the target position in one drive of the drive mechanism, determine the drive amount that will cause the maximum number of substrates to fall within the reference range in one drive. identify,
driving the driving mechanism with the specified driving amount, and then sequentially exposing each of the substrates falling within the reference range by the driving;
The exposure apparatus according to item 2, characterized in that:
(Item 4)
The control unit includes:
If there are multiple driving amounts that result in the maximum number of substrates falling within the reference range in one drive, the deviation of the positional shift amount of the substrates that do not fall within the reference range in one drive falls within the allowable range. Identify the amount of drive,
driving the driving mechanism with the specified driving amount, and then sequentially exposing each of the substrates falling within the reference range by the driving;
The exposure apparatus according to item 3, characterized in that:
(Item 5)
The control unit includes:
If there are a plurality of driving amounts in which the deviation of the positional deviation of the substrates that does not fall within the reference range in the one drive falls within the tolerance range, the positional deviation of each of the plurality of substrates after the one drive Identify the driving quantity whose variance falls within an acceptable range,
driving the driving mechanism with the specified driving amount, and then sequentially exposing each of the substrates falling within the reference range by the driving;
The exposure apparatus according to item 4, characterized in that:
(Item 6)
The control unit includes:
If there are multiple driving amounts within which the dispersion falls within an allowable range, determining the driving amount based on the priority regarding the exposure order,
driving the driving mechanism with the determined driving amount, and then sequentially exposing each of the substrates falling within the reference range by the driving;
The exposure apparatus according to item 5, characterized in that:
(Item 7)
The drive mechanism is
a rotation mechanism that rotates the holding part around the axis;
a locking mechanism for regulating rotation of the holding part by the rotation mechanism;
air cylinder and
The air cylinder releases the lock by the locking mechanism by blowing air between the holding part and the rotating mechanism, and the rotating mechanism is driven in the unlocked state, thereby locking the holding part. is configured to rotate,
7. The exposure apparatus according to any one of items 1 to 6, characterized in that:
(Item 8)
An exposure method for exposing a substrate,
arranging a plurality of substrates on one holding surface in a holding section that holds the substrates;
measuring the amount of positional deviation with respect to a reference position for each of the plurality of substrates held by the holding unit;
determining a drive amount of a drive mechanism that rotationally drives the holding part around an axis intersecting the holding surface, based on the amount of positional deviation of each of the plurality of substrates obtained by the measurement;
driving the drive mechanism with the determined drive amount, and then sequentially exposing each of the plurality of substrates;
An exposure method characterized by having the following.
(Item 9)
exposing the substrate according to the exposure method described in item 8;
Developing the exposed substrate;
A method for manufacturing an article, comprising: manufacturing an article from the developed substrate.

The invention is not limited to the embodiments described above, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the following claims are hereby appended to disclose the scope of the invention.

10: Exposure device, 11: Exposure light source, 12: Illumination optical system, 13: Mask, 14: Mask stage, 15: Projection optical system, 16: Substrate, 17: Plate stage, 30: Control device

Claims (9)

An exposure device that exposes a substrate,
a holding part that holds a plurality of substrates arranged on one holding surface;
a measuring unit that measures the amount of positional deviation with respect to a reference position for each of the plurality of substrates held by the holding unit;
a drive mechanism that rotates the holding part around an axis that intersects the holding surface;
a control unit that controls exposure of each of the plurality of substrates held by the holding unit,
The control unit includes:
determining the amount of drive of the drive mechanism based on the amount of positional deviation of each of the plurality of substrates obtained by the measurement;
driving the drive mechanism with the determined drive amount, and then sequentially exposing each of the plurality of substrates;
An exposure device characterized by: The control unit includes:
specifying a drive amount by which all of the plurality of substrates fall within a reference range of a target position with one drive of the drive mechanism;
driving the drive mechanism with the specified drive amount, and then sequentially exposing each of the plurality of substrates;
The exposure apparatus according to claim 1, characterized in that: The control unit includes:
If there is no drive amount that allows all of the plurality of substrates to fall within the reference range of the target position in one drive of the drive mechanism, determine the drive amount that will cause the maximum number of substrates to fall within the reference range in one drive. identify,
driving the driving mechanism with the specified driving amount, and then sequentially exposing each of the substrates falling within the reference range by the driving;
The exposure apparatus according to claim 2, characterized in that: The control unit includes:
If there are multiple driving amounts that result in the maximum number of substrates falling within the reference range in one drive, the deviation of the positional shift amount of the substrates that do not fall within the reference range in one drive falls within the allowable range. Identify the amount of drive,
driving the driving mechanism with the specified driving amount, and then sequentially exposing each of the substrates falling within the reference range by the driving;
The exposure apparatus according to claim 3, characterized in that: The control unit includes:
If there are a plurality of driving amounts in which the deviation of the positional deviation of the substrates that does not fall within the reference range in the one drive falls within the tolerance range, the positional deviation of each of the plurality of substrates after the one drive Identify the driving quantity whose variance falls within an acceptable range,
driving the driving mechanism with the specified driving amount, and then sequentially exposing each of the substrates falling within the reference range by the driving;
The exposure apparatus according to claim 4, characterized in that: The control unit includes:
If there are multiple driving amounts within which the dispersion falls within an allowable range, determining the driving amount based on the priority regarding the exposure order,
driving the driving mechanism with the determined driving amount, and then sequentially exposing each of the substrates falling within the reference range by the driving;
The exposure apparatus according to claim 5, characterized in that: The drive mechanism is
a rotation mechanism that rotates the holding part around the axis;
a locking mechanism for regulating rotation of the holding part by the rotation mechanism;
air cylinder and
The air cylinder releases the lock by the locking mechanism by blowing air between the holding part and the rotating mechanism, and the rotating mechanism is driven in the unlocked state, thereby locking the holding part. is configured to rotate,
The exposure apparatus according to any one of claims 1 to 6. An exposure method for exposing a substrate,
arranging a plurality of substrates on one holding surface in a holding section that holds the substrates;
measuring the amount of positional deviation with respect to a reference position for each of the plurality of substrates held by the holding unit;
determining a drive amount of a drive mechanism that rotationally drives the holding part around an axis intersecting the holding surface, based on the amount of positional deviation of each of the plurality of substrates obtained by the measurement;
driving the drive mechanism with the determined drive amount, and then sequentially exposing each of the plurality of substrates;
An exposure method characterized by having the following. exposing the substrate according to the exposure method according to claim 8;
Developing the exposed substrate;
A method for manufacturing an article, comprising: manufacturing an article from the developed substrate.

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