JP2023166098A5 - - Google Patents
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- Publication number
- JP2023166098A5 JP2023166098A5 JP2022076885A JP2022076885A JP2023166098A5 JP 2023166098 A5 JP2023166098 A5 JP 2023166098A5 JP 2022076885 A JP2022076885 A JP 2022076885A JP 2022076885 A JP2022076885 A JP 2022076885A JP 2023166098 A5 JP2023166098 A5 JP 2023166098A5
- Authority
- JP
- Japan
- Prior art keywords
- polymer
- conductive paste
- type conductive
- layer
- paste according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 24
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 10
- 239000007787 solid Substances 0.000 claims description 10
- 239000003990 capacitor Substances 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 9
- 239000000654 additive Substances 0.000 claims description 8
- 230000000996 additive effect Effects 0.000 claims description 8
- 239000007784 solid electrolyte Substances 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 239000011230 binding agent Substances 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 5
- ZPJDFKVKOFGAFV-UHFFFAOYSA-N 2-octadecylbutanedioic acid Chemical compound CCCCCCCCCCCCCCCCCCC(C(O)=O)CC(O)=O ZPJDFKVKOFGAFV-UHFFFAOYSA-N 0.000 claims description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims description 4
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- ADVGKWPZRIDURE-UHFFFAOYSA-N 2'-Hydroxyacetanilide Chemical compound CC(=O)NC1=CC=CC=C1O ADVGKWPZRIDURE-UHFFFAOYSA-N 0.000 claims description 2
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 claims description 2
- 239000005711 Benzoic acid Substances 0.000 claims description 2
- 239000005639 Lauric acid Substances 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 235000021355 Stearic acid Nutrition 0.000 claims description 2
- 235000010233 benzoic acid Nutrition 0.000 claims description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 2
- 239000008117 stearic acid Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- -1 silver ions Chemical class 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022076885A JP7540459B2 (ja) | 2022-05-09 | 2022-05-09 | ポリマー型導電性ペースト、導電膜、及び、固体電解コンデンサ素子 |
| US18/864,316 US12384925B2 (en) | 2022-05-09 | 2023-04-18 | Polymer-type conductive paste, conductive film, and solid electrolytic capacitor element |
| PCT/JP2023/015416 WO2023218872A1 (ja) | 2022-05-09 | 2023-04-18 | ポリマー型導電性ペースト、導電膜、及び、固体電解コンデンサ素子 |
| CN202380039037.2A CN119096318B (zh) | 2022-05-09 | 2023-04-18 | 聚合物型导电性糊剂、导电膜和固体电解电容器元件 |
| KR1020247037809A KR102847696B1 (ko) | 2022-05-09 | 2023-04-18 | 폴리머형 도전성 페이스트, 도전막 및 고체 전해 콘덴서 소자 |
| CZ2024-429A CZ310405B6 (cs) | 2022-05-09 | 2023-04-18 | Vodivá pasta polymerního typu, vodivý film a kondenzátorový prvek s pevným elektrolytem |
| TW112116565A TWI906615B (zh) | 2022-05-09 | 2023-05-04 | 聚合物型導電性糊、導電膜、及固體電解電容元件 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022076885A JP7540459B2 (ja) | 2022-05-09 | 2022-05-09 | ポリマー型導電性ペースト、導電膜、及び、固体電解コンデンサ素子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023166098A JP2023166098A (ja) | 2023-11-21 |
| JP2023166098A5 true JP2023166098A5 (https=) | 2024-07-18 |
| JP7540459B2 JP7540459B2 (ja) | 2024-08-27 |
Family
ID=88730259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022076885A Active JP7540459B2 (ja) | 2022-05-09 | 2022-05-09 | ポリマー型導電性ペースト、導電膜、及び、固体電解コンデンサ素子 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12384925B2 (https=) |
| JP (1) | JP7540459B2 (https=) |
| KR (1) | KR102847696B1 (https=) |
| CN (1) | CN119096318B (https=) |
| CZ (1) | CZ310405B6 (https=) |
| TW (1) | TWI906615B (https=) |
| WO (1) | WO2023218872A1 (https=) |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10162646A (ja) * | 1996-11-28 | 1998-06-19 | Asahi Chem Ind Co Ltd | 導電性樹脂組成物 |
| JP2008124030A (ja) * | 2007-11-30 | 2008-05-29 | Jsr Corp | 導電性ペースト組成物、転写フィルムおよびプラズマディスプレイパネル |
| US9287054B2 (en) * | 2012-01-27 | 2016-03-15 | Shoei Chemical Inc. | Solid electrolytic capacitor element, method for manufacturing same, and conductive paste |
| JP6247015B2 (ja) * | 2013-04-04 | 2017-12-13 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ | ポリマー型導電性ペースト、及びポリマー型導電性ペーストを用いた電極の製造方法 |
| EP3010870A1 (de) * | 2013-06-05 | 2016-04-27 | CeramTec GmbH | Metallisierung auf keramischen substraten |
| CN105405490A (zh) * | 2015-12-23 | 2016-03-16 | 东洋油墨Sc控股株式会社 | 激光加工用导电性糊、导电性片材、信号布线的制造方法及电子设备 |
| JP6635186B2 (ja) * | 2016-02-29 | 2020-01-22 | 住友金属鉱山株式会社 | 導電性ペースト、電子部品及び積層セラミックコンデンサ |
| WO2018062220A1 (ja) * | 2016-09-30 | 2018-04-05 | Ｄｏｗａエレクトロニクス株式会社 | 接合材およびそれを用いた接合方法 |
| US10475591B2 (en) * | 2016-11-15 | 2019-11-12 | Avx Corporation | Solid electrolytic capacitor for use in a humid atmosphere |
| EP3648115A4 (en) * | 2017-06-30 | 2021-03-24 | Sekisui Chemical Co., Ltd. | CONDUCTIVE PASTE |
| MY209180A (en) * | 2018-12-25 | 2025-06-26 | Sumitomo Metal Mining Co | Conductive paste, electronic component, and laminated ceramic capacitor |
-
2022
- 2022-05-09 JP JP2022076885A patent/JP7540459B2/ja active Active
-
2023
- 2023-04-18 KR KR1020247037809A patent/KR102847696B1/ko active Active
- 2023-04-18 US US18/864,316 patent/US12384925B2/en active Active
- 2023-04-18 CN CN202380039037.2A patent/CN119096318B/zh active Active
- 2023-04-18 WO PCT/JP2023/015416 patent/WO2023218872A1/ja not_active Ceased
- 2023-04-18 CZ CZ2024-429A patent/CZ310405B6/cs unknown
- 2023-05-04 TW TW112116565A patent/TWI906615B/zh active
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