CZ310405B6 - Vodivá pasta polymerního typu, vodivý film a kondenzátorový prvek s pevným elektrolytem - Google Patents
Vodivá pasta polymerního typu, vodivý film a kondenzátorový prvek s pevným elektrolytem Download PDFInfo
- Publication number
- CZ310405B6 CZ310405B6 CZ2024-429A CZ2024429A CZ310405B6 CZ 310405 B6 CZ310405 B6 CZ 310405B6 CZ 2024429 A CZ2024429 A CZ 2024429A CZ 310405 B6 CZ310405 B6 CZ 310405B6
- Authority
- CZ
- Czechia
- Prior art keywords
- polymer
- conductive
- solid electrolyte
- type
- acid
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D129/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Coating compositions based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Coating compositions based on derivatives of such polymers
- C09D129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/022—Electrolytes; Absorbents
- H01G9/025—Solid electrolytes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/022—Electrolytes; Absorbents
- H01G9/025—Solid electrolytes
- H01G9/028—Organic semiconducting electrolytes, e.g. TCNQ
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
- H01G9/0425—Electrodes or formation of dielectric layers thereon characterised by the material specially adapted for cathode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G9/055—Etched foil electrodes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F116/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F116/38—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by a acetal or ketal radical
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/092—Polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
- C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/20—Carboxylic acid amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G2009/05—Electrodes or formation of dielectric layers thereon characterised by their structure consisting of tantalum, niobium, or sintered material; Combinations of such electrodes with solid semiconductive electrolytes, e.g. manganese dioxide
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022076885A JP7540459B2 (ja) | 2022-05-09 | 2022-05-09 | ポリマー型導電性ペースト、導電膜、及び、固体電解コンデンサ素子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CZ2024429A3 CZ2024429A3 (cs) | 2024-12-11 |
| CZ310405B6 true CZ310405B6 (cs) | 2025-05-14 |
Family
ID=88730259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CZ2024-429A CZ310405B6 (cs) | 2022-05-09 | 2023-04-18 | Vodivá pasta polymerního typu, vodivý film a kondenzátorový prvek s pevným elektrolytem |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12384925B2 (https=) |
| JP (1) | JP7540459B2 (https=) |
| KR (1) | KR102847696B1 (https=) |
| CN (1) | CN119096318B (https=) |
| CZ (1) | CZ310405B6 (https=) |
| TW (1) | TWI906615B (https=) |
| WO (1) | WO2023218872A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10162646A (ja) * | 1996-11-28 | 1998-06-19 | Asahi Chem Ind Co Ltd | 導電性樹脂組成物 |
| WO2013111438A1 (ja) * | 2012-01-27 | 2013-08-01 | 昭栄化学工業株式会社 | 固体電解コンデンサ素子、その製造方法及び導電ペースト |
| CN105405490A (zh) * | 2015-12-23 | 2016-03-16 | 东洋油墨Sc控股株式会社 | 激光加工用导电性糊、导电性片材、信号布线的制造方法及电子设备 |
| JP2020500427A (ja) * | 2016-11-15 | 2020-01-09 | エイブイエックス コーポレイション | 高湿度雰囲気中で用いるための固体電解キャパシタ |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008124030A (ja) * | 2007-11-30 | 2008-05-29 | Jsr Corp | 導電性ペースト組成物、転写フィルムおよびプラズマディスプレイパネル |
| JP6247015B2 (ja) * | 2013-04-04 | 2017-12-13 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company | ポリマー型導電性ペースト、及びポリマー型導電性ペーストを用いた電極の製造方法 |
| EP3010870A1 (de) * | 2013-06-05 | 2016-04-27 | CeramTec GmbH | Metallisierung auf keramischen substraten |
| JP6635186B2 (ja) * | 2016-02-29 | 2020-01-22 | 住友金属鉱山株式会社 | 導電性ペースト、電子部品及び積層セラミックコンデンサ |
| WO2018062220A1 (ja) * | 2016-09-30 | 2018-04-05 | Dowaエレクトロニクス株式会社 | 接合材およびそれを用いた接合方法 |
| EP3648115A4 (en) * | 2017-06-30 | 2021-03-24 | Sekisui Chemical Co., Ltd. | CONDUCTIVE PASTE |
| MY209180A (en) * | 2018-12-25 | 2025-06-26 | Sumitomo Metal Mining Co | Conductive paste, electronic component, and laminated ceramic capacitor |
-
2022
- 2022-05-09 JP JP2022076885A patent/JP7540459B2/ja active Active
-
2023
- 2023-04-18 KR KR1020247037809A patent/KR102847696B1/ko active Active
- 2023-04-18 US US18/864,316 patent/US12384925B2/en active Active
- 2023-04-18 CN CN202380039037.2A patent/CN119096318B/zh active Active
- 2023-04-18 WO PCT/JP2023/015416 patent/WO2023218872A1/ja not_active Ceased
- 2023-04-18 CZ CZ2024-429A patent/CZ310405B6/cs unknown
- 2023-05-04 TW TW112116565A patent/TWI906615B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10162646A (ja) * | 1996-11-28 | 1998-06-19 | Asahi Chem Ind Co Ltd | 導電性樹脂組成物 |
| WO2013111438A1 (ja) * | 2012-01-27 | 2013-08-01 | 昭栄化学工業株式会社 | 固体電解コンデンサ素子、その製造方法及び導電ペースト |
| CN105405490A (zh) * | 2015-12-23 | 2016-03-16 | 东洋油墨Sc控股株式会社 | 激光加工用导电性糊、导电性片材、信号布线的制造方法及电子设备 |
| JP2020500427A (ja) * | 2016-11-15 | 2020-01-09 | エイブイエックス コーポレイション | 高湿度雰囲気中で用いるための固体電解キャパシタ |
Also Published As
| Publication number | Publication date |
|---|---|
| US12384925B2 (en) | 2025-08-12 |
| KR102847696B1 (ko) | 2025-08-20 |
| CN119096318B (zh) | 2026-01-02 |
| US20250163279A1 (en) | 2025-05-22 |
| CN119096318A (zh) | 2024-12-06 |
| CZ2024429A3 (cs) | 2024-12-11 |
| WO2023218872A1 (ja) | 2023-11-16 |
| KR20240167095A (ko) | 2024-11-26 |
| TWI906615B (zh) | 2025-12-01 |
| WO2023218872A9 (ja) | 2024-07-04 |
| TW202402975A (zh) | 2024-01-16 |
| JP2023166098A (ja) | 2023-11-21 |
| JP7540459B2 (ja) | 2024-08-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10658120B2 (en) | Solid electrolytic capacitor | |
| EP2808880B1 (en) | Method for manufacturing a solid electrolytic capacitor element using a conductive paste | |
| EP3008735B1 (en) | Photonic sintering of polymer thick film copper conductor compositions | |
| EP3193340A1 (en) | Thin film resistive body and production method for same | |
| EP3032547B2 (en) | A conductive paste containing lead-free glass frit | |
| EP3032546B1 (en) | A conductive paste containing lead-free glass frit | |
| EP3031784A1 (en) | A conductive paste containing lead-free glass frit | |
| EP3032545A1 (en) | A conductive paste containing lead-free glass frit | |
| EP3032544A1 (en) | A conductive paste containing lead-free glass frit | |
| US20180019037A1 (en) | Resistive composition | |
| TWI857203B (zh) | 導電性膏、電極及晶片電阻器 | |
| EP3032543A1 (en) | A conductive paste containing lead-free glass frit | |
| CZ310405B6 (cs) | Vodivá pasta polymerního typu, vodivý film a kondenzátorový prvek s pevným elektrolytem | |
| US20090089990A1 (en) | Method for manufacturing solid electrolytic capacitor | |
| CN115443513A (zh) | 厚膜电阻糊、厚膜电阻体和电子部件 | |
| JP4372032B2 (ja) | 固体電解コンデンサ | |
| WO2000022636A1 (de) | Tantal-elektrolytkondensator | |
| US6551729B2 (en) | Conductive paste and ceramic electronic element using the same | |
| CN115516578A (zh) | 厚膜电阻糊、厚膜电阻体和电子部件 | |
| CN121816626A (zh) | 导电糊料 | |
| CN115516579A (zh) | 厚膜电阻糊、厚膜电阻体和电子部件 | |
| JPS6048091B2 (ja) | 固体電解コンデンサ | |
| JPS6160567B2 (https=) |