JP2023153197A5 - - Google Patents

Info

Publication number
JP2023153197A5
JP2023153197A5 JP2023128285A JP2023128285A JP2023153197A5 JP 2023153197 A5 JP2023153197 A5 JP 2023153197A5 JP 2023128285 A JP2023128285 A JP 2023128285A JP 2023128285 A JP2023128285 A JP 2023128285A JP 2023153197 A5 JP2023153197 A5 JP 2023153197A5
Authority
JP
Japan
Prior art keywords
alkali
soluble resin
general formula
resin
alkoxypropionamide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023128285A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023153197A (ja
Filing date
Publication date
Priority claimed from JP2019041294A external-priority patent/JP7720679B2/ja
Application filed filed Critical
Publication of JP2023153197A publication Critical patent/JP2023153197A/ja
Publication of JP2023153197A5 publication Critical patent/JP2023153197A5/ja
Pending legal-status Critical Current

Links

JP2023128285A 2018-03-26 2023-08-07 樹脂組成物、樹脂シート、硬化膜 Pending JP2023153197A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018057746 2018-03-26
JP2018057746 2018-03-26
JP2019041294A JP7720679B2 (ja) 2018-03-26 2019-03-07 樹脂組成物、樹脂シート、硬化膜

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2019041294A Division JP7720679B2 (ja) 2018-03-26 2019-03-07 樹脂組成物、樹脂シート、硬化膜

Publications (2)

Publication Number Publication Date
JP2023153197A JP2023153197A (ja) 2023-10-17
JP2023153197A5 true JP2023153197A5 (https=) 2025-11-05

Family

ID=68166460

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019041294A Active JP7720679B2 (ja) 2018-03-26 2019-03-07 樹脂組成物、樹脂シート、硬化膜
JP2023128285A Pending JP2023153197A (ja) 2018-03-26 2023-08-07 樹脂組成物、樹脂シート、硬化膜

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2019041294A Active JP7720679B2 (ja) 2018-03-26 2019-03-07 樹脂組成物、樹脂シート、硬化膜

Country Status (1)

Country Link
JP (2) JP7720679B2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111116401B (zh) * 2019-12-23 2024-07-09 盐城通海生物科技有限公司 一种c7侧链取代的含氟二胺单体的制备方法
CN110981746B (zh) * 2019-12-23 2024-07-12 盐城通海生物科技有限公司 一种c5侧链取代的含氟二胺单体的制备方法
KR102624811B1 (ko) * 2020-01-21 2024-01-16 도레이 카부시키가이샤 포지티브형 감광성 수지 조성물, 경화막, 적층체, 도전 패턴이 형성된 기판, 적층체의 제조 방법, 터치 패널 및 유기 el 표시 장치
KR102669551B1 (ko) * 2020-02-20 2024-05-28 스미또모 베이크라이트 가부시키가이샤 감광성 수지 조성물의 제조 방법
US20240045331A1 (en) * 2020-09-28 2024-02-08 Toray Industries, Inc. Photosensitive resin composition, board with conductive pattern, antenna element, production method for image display device, and production method for touch panel
CN115576171B (zh) * 2022-09-27 2025-04-11 徐州博康信息化学品有限公司 负型感光树脂组合物及固化图案的制备方法
KR20260029282A (ko) * 2023-06-27 2026-03-04 도레이 카부시키가이샤 경화막 및 유기 el 표시 장치

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2844219B2 (ja) * 1988-08-24 1999-01-06 旭化成工業株式会社 低応力ポリイミド前駆体、及びポリイミド複合成形体の製造方法
JPH06337518A (ja) * 1993-05-31 1994-12-06 Toray Ind Inc 感光性ポリイミド前駆体組成物
JP4288796B2 (ja) * 1999-10-29 2009-07-01 日立化成デュポンマイクロシステムズ株式会社 ネガ型感光性樹脂組成物、パターンの製造法及び電子部品
JP2001125266A (ja) * 1999-10-29 2001-05-11 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、パターンの製造法及び電子部品
US6524770B1 (en) * 2000-09-15 2003-02-25 Hitachi Chemical Co., Ltd. Hexaaryl biimidazole compounds as photoinitiators, photosensitive composition and method of manufacturing patterns using the compounds
JP5331469B2 (ja) * 2008-12-10 2013-10-30 出光興産株式会社 β−アルコキシプロピオンアミド類の製造方法
JP2013189411A (ja) * 2012-03-15 2013-09-26 Kohjin Holdings Co Ltd Ｎ−置換−β−アルコキシプロピオン酸アミドの製造方法
JP6935982B2 (ja) * 2014-09-29 2021-09-15 旭化成株式会社 樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置
JP6427383B2 (ja) * 2014-10-21 2018-11-21 旭化成株式会社 樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置
JP2016161894A (ja) * 2015-03-05 2016-09-05 東レ株式会社 感光性樹脂組成物
SG11201708251VA (en) * 2015-04-15 2017-11-29 Toray Industries Heat-resistant resin composition, method for manufacturing heat-resistant resin film, method for manufacturing interlayer insulation film or surface protective film, and method for manufacturing electronic component or semiconductor component
KR102309954B1 (ko) * 2016-03-18 2021-10-08 도레이 카부시키가이샤 경화막 및 포지티브형 감광성 수지 조성물
JP6869529B2 (ja) * 2016-03-30 2021-05-12 Ｋｊケミカルズ株式会社 β−置換プロピオン酸アミド及びＮ−置換（メタ）アクリルアミドの製造方法
SG11201810262XA (en) * 2016-06-15 2018-12-28 Toray Industries Photosensitive resin composition

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