JP2023113338A5 - - Google Patents

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Publication number
JP2023113338A5
JP2023113338A5 JP2022015631A JP2022015631A JP2023113338A5 JP 2023113338 A5 JP2023113338 A5 JP 2023113338A5 JP 2022015631 A JP2022015631 A JP 2022015631A JP 2022015631 A JP2022015631 A JP 2022015631A JP 2023113338 A5 JP2023113338 A5 JP 2023113338A5
Authority
JP
Japan
Prior art keywords
connector
substrate
wiring board
wiring
wiring substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022015631A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023113338A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2022015631A priority Critical patent/JP2023113338A/ja
Priority claimed from JP2022015631A external-priority patent/JP2023113338A/ja
Priority to US18/160,365 priority patent/US12451631B2/en
Publication of JP2023113338A publication Critical patent/JP2023113338A/ja
Publication of JP2023113338A5 publication Critical patent/JP2023113338A5/ja
Pending legal-status Critical Current

Links

JP2022015631A 2022-02-03 2022-02-03 配線基板 Pending JP2023113338A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022015631A JP2023113338A (ja) 2022-02-03 2022-02-03 配線基板
US18/160,365 US12451631B2 (en) 2022-02-03 2023-01-27 Interconnect substrate including substrates and connector disposed in recess

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022015631A JP2023113338A (ja) 2022-02-03 2022-02-03 配線基板

Publications (2)

Publication Number Publication Date
JP2023113338A JP2023113338A (ja) 2023-08-16
JP2023113338A5 true JP2023113338A5 (enExample) 2024-10-25

Family

ID=87432698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022015631A Pending JP2023113338A (ja) 2022-02-03 2022-02-03 配線基板

Country Status (2)

Country Link
US (1) US12451631B2 (enExample)
JP (1) JP2023113338A (enExample)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3510475B2 (ja) * 1998-03-27 2004-03-29 イビデン株式会社 変換モジュール
JP3609801B2 (ja) * 2002-05-24 2005-01-12 株式会社東芝 プリント配線板および回路モジュール
JP4148201B2 (ja) * 2004-08-11 2008-09-10 ソニー株式会社 電子回路装置
JP2010219180A (ja) * 2009-03-16 2010-09-30 Panasonic Corp 電子部品実装構造および電子部品実装方法ならびに基板接続用部品
CN102271459B (zh) * 2010-06-03 2014-09-24 矢崎总业株式会社 布线基板及其制造方法
JP5717279B2 (ja) * 2010-06-03 2015-05-13 矢崎総業株式会社 配線基板及びその製造方法
KR102163059B1 (ko) * 2018-09-07 2020-10-08 삼성전기주식회사 연결구조체 내장기판
JP7421357B2 (ja) 2020-02-05 2024-01-24 新光電気工業株式会社 部品内蔵基板及び部品内蔵基板の製造方法

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