JP2023098599A5 - - Google Patents
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- JP2023098599A5 JP2023098599A5 JP2022163154A JP2022163154A JP2023098599A5 JP 2023098599 A5 JP2023098599 A5 JP 2023098599A5 JP 2022163154 A JP2022163154 A JP 2022163154A JP 2022163154 A JP2022163154 A JP 2022163154A JP 2023098599 A5 JP2023098599 A5 JP 2023098599A5
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- JP
- Japan
- Prior art keywords
- plasma processing
- width
- grooves
- ring
- processing apparatus
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Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020220176455A KR20230100629A (ko) | 2021-12-28 | 2022-12-16 | 플라즈마 처리 장치 |
| TW111148421A TW202341228A (zh) | 2021-12-28 | 2022-12-16 | 電漿處理裝置 |
| CN202211639069.XA CN116364516A (zh) | 2021-12-28 | 2022-12-20 | 等离子体处理装置 |
| US18/085,583 US12412735B2 (en) | 2021-12-28 | 2022-12-21 | Plasma processing apparatus |
| US19/295,726 US20250364226A1 (en) | 2021-12-28 | 2025-08-11 | Plasma processing apparatus |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021215091 | 2021-12-28 | ||
| JP2021215091 | 2021-12-28 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023098599A JP2023098599A (ja) | 2023-07-10 |
| JP2023098599A5 true JP2023098599A5 (enExample) | 2025-03-04 |
| JP7825538B2 JP7825538B2 (ja) | 2026-03-06 |
Family
ID=87072356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022163154A Active JP7825538B2 (ja) | 2021-12-28 | 2022-10-11 | プラズマ処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7825538B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202601866A (zh) * | 2024-02-29 | 2026-01-01 | 日商東京威力科創股份有限公司 | 基板處理系統及搬運機械臂之教導方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6888007B2 (ja) | 2016-01-26 | 2021-06-16 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | ウェハエッジリングの持ち上げに関する解決 |
| JP6859426B2 (ja) | 2018-08-13 | 2021-04-14 | ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ | エッジリングの位置決めおよびセンタリング機構を組み込んだプラズマシース調整のための交換可能および／または折りたたみ式エッジリングアセンブリ |
| JP7134104B2 (ja) | 2019-01-09 | 2022-09-09 | 東京エレクトロン株式会社 | プラズマ処理装置およびプラズマ処理装置の載置台 |
| JP7550603B2 (ja) | 2020-03-03 | 2024-09-13 | 東京エレクトロン株式会社 | プラズマ処理システム及びエッジリングの交換方法 |
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2022
- 2022-10-11 JP JP2022163154A patent/JP7825538B2/ja active Active
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