JP2023079194A5 - - Google Patents
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- JP2023079194A5 JP2023079194A5 JP2022186762A JP2022186762A JP2023079194A5 JP 2023079194 A5 JP2023079194 A5 JP 2023079194A5 JP 2022186762 A JP2022186762 A JP 2022186762A JP 2022186762 A JP2022186762 A JP 2022186762A JP 2023079194 A5 JP2023079194 A5 JP 2023079194A5
- Authority
- JP
- Japan
- Prior art keywords
- structural unit
- formula
- derived
- halogen atom
- represented
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 229920001721 polyimide Polymers 0.000 claims 12
- 125000005843 halogen group Chemical group 0.000 claims 11
- 239000009719 polyimide resin Substances 0.000 claims 6
- 150000000000 tetracarboxylic acids Chemical class 0.000 claims 6
- 150000004985 diamines Chemical class 0.000 claims 5
- 125000003545 alkoxy group Chemical group 0.000 claims 4
- 125000000217 alkyl group Chemical group 0.000 claims 4
- 125000003118 aryl group Chemical group 0.000 claims 4
- 125000004432 carbon atom Chemical group C* 0.000 claims 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 4
- 125000004104 aryloxy group Chemical group 0.000 claims 3
- 150000002430 hydrocarbons Chemical group 0.000 claims 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 3
- 239000004642 Polyimide Substances 0.000 claims 2
- 235000010290 biphenyl Nutrition 0.000 claims 2
- 239000004305 biphenyl Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- 230000009477 glass transition Effects 0.000 claims 1
- 125000000962 organic group Chemical group 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022186762A JP2023079194A (ja) | 2021-11-26 | 2022-11-22 | ポリイミド系樹脂 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021192532A JP7183377B1 (ja) | 2021-11-26 | 2021-11-26 | ポリイミド系樹脂 |
| JP2022186762A JP2023079194A (ja) | 2021-11-26 | 2022-11-22 | ポリイミド系樹脂 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021192532A Division JP7183377B1 (ja) | 2021-11-26 | 2021-11-26 | ポリイミド系樹脂 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023079194A JP2023079194A (ja) | 2023-06-07 |
| JP2023079194A5 true JP2023079194A5 (https=) | 2024-12-03 |
Family
ID=84321887
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021192532A Active JP7183377B1 (ja) | 2021-11-26 | 2021-11-26 | ポリイミド系樹脂 |
| JP2022186762A Pending JP2023079194A (ja) | 2021-11-26 | 2022-11-22 | ポリイミド系樹脂 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021192532A Active JP7183377B1 (ja) | 2021-11-26 | 2021-11-26 | ポリイミド系樹脂 |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP7183377B1 (https=) |
| KR (1) | KR20230078554A (https=) |
| CN (1) | CN116178711A (https=) |
| TW (1) | TW202337958A (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005146025A (ja) | 2003-11-11 | 2005-06-09 | Kaneka Corp | 接着フィルム及びそれから得られるフレキシブル金属張積層板 |
| JP6294116B2 (ja) | 2013-03-29 | 2018-03-14 | 住友電気工業株式会社 | ポリイミド前駆体樹脂組成物、ポリイミド樹脂膜、フレキシブルプリント配線板、回路付きサスペンション及びハードディスクドライブ |
| CN106543720B (zh) | 2016-10-27 | 2019-08-23 | 武汉依麦德新材料科技有限责任公司 | 一种低热膨胀系数的聚酰亚胺薄膜及其制备方法 |
| JP2021161285A (ja) | 2020-03-31 | 2021-10-11 | 株式会社大阪ソーダ | ポリイミド系接着剤 |
| CN112375221B (zh) | 2020-11-27 | 2023-05-02 | 桂林电器科学研究院有限公司 | 一种低介电性聚酰亚胺复合薄膜及其制备方法 |
| CN112409621B (zh) | 2020-11-27 | 2022-09-09 | 桂林电器科学研究院有限公司 | 高强度低介电性聚酰亚胺多层膜及其制备方法 |
| CN112940316B (zh) | 2021-02-19 | 2022-07-29 | 上海八亿时空先进材料有限公司 | 一种聚酰亚胺薄膜及其制备方法与应用 |
| JP7714391B2 (ja) * | 2021-06-30 | 2025-07-29 | 日鉄ケミカル＆マテリアル株式会社 | ポリアミド酸、ポリイミド、ポリイミドフィルム、金属張積層板及び回路基板 |
-
2021
- 2021-11-26 JP JP2021192532A patent/JP7183377B1/ja active Active
-
2022
- 2022-11-22 JP JP2022186762A patent/JP2023079194A/ja active Pending
- 2022-11-24 CN CN202211483429.1A patent/CN116178711A/zh active Pending
- 2022-11-24 TW TW111144995A patent/TW202337958A/zh unknown
- 2022-11-24 KR KR1020220159470A patent/KR20230078554A/ko active Pending
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