JP2023071585A5 - - Google Patents

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Publication number
JP2023071585A5
JP2023071585A5 JP2022116626A JP2022116626A JP2023071585A5 JP 2023071585 A5 JP2023071585 A5 JP 2023071585A5 JP 2022116626 A JP2022116626 A JP 2022116626A JP 2022116626 A JP2022116626 A JP 2022116626A JP 2023071585 A5 JP2023071585 A5 JP 2023071585A5
Authority
JP
Japan
Prior art keywords
adhesive layer
insulating adhesive
wires
straddle
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022116626A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023071585A (ja
JP7823307B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to US17/983,531 priority Critical patent/US12341105B2/en
Priority to EP22206718.3A priority patent/EP4181192A1/en
Priority to CN202211411146.6A priority patent/CN116110870A/zh
Publication of JP2023071585A publication Critical patent/JP2023071585A/ja
Publication of JP2023071585A5 publication Critical patent/JP2023071585A5/ja
Application granted granted Critical
Publication of JP7823307B2 publication Critical patent/JP7823307B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022116626A 2021-11-11 2022-07-21 半導体装置 Active JP7823307B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US17/983,531 US12341105B2 (en) 2021-11-11 2022-11-09 Semiconductor device
EP22206718.3A EP4181192A1 (en) 2021-11-11 2022-11-10 Semiconductor device
CN202211411146.6A CN116110870A (zh) 2021-11-11 2022-11-11 半导体器件

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021183970 2021-11-11
JP2021183970 2021-11-11

Publications (3)

Publication Number Publication Date
JP2023071585A JP2023071585A (ja) 2023-05-23
JP2023071585A5 true JP2023071585A5 (https=) 2025-03-31
JP7823307B2 JP7823307B2 (ja) 2026-03-04

Family

ID=86409685

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022116626A Active JP7823307B2 (ja) 2021-11-11 2022-07-21 半導体装置

Country Status (1)

Country Link
JP (1) JP7823307B2 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4135284B2 (ja) 1999-12-07 2008-08-20 ソニー株式会社 半導体モジュールおよび電子回路装置
JP2002026251A (ja) * 2000-07-11 2002-01-25 Toshiba Corp 半導体装置
JP3994381B2 (ja) 2002-09-18 2007-10-17 株式会社安川電機 パワーモジュール
JP2013041939A (ja) * 2011-08-12 2013-02-28 Sanyo Electric Co Ltd 半導体モジュール及びそれを搭載したインバータ

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