JP7823307B2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP7823307B2
JP7823307B2 JP2022116626A JP2022116626A JP7823307B2 JP 7823307 B2 JP7823307 B2 JP 7823307B2 JP 2022116626 A JP2022116626 A JP 2022116626A JP 2022116626 A JP2022116626 A JP 2022116626A JP 7823307 B2 JP7823307 B2 JP 7823307B2
Authority
JP
Japan
Prior art keywords
wiring
layer
electrode
semiconductor device
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022116626A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023071585A (ja
JP2023071585A5 (https=
Inventor
健一 孝井
仁志 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to US17/983,531 priority Critical patent/US12341105B2/en
Priority to EP22206718.3A priority patent/EP4181192A1/en
Priority to CN202211411146.6A priority patent/CN116110870A/zh
Publication of JP2023071585A publication Critical patent/JP2023071585A/ja
Publication of JP2023071585A5 publication Critical patent/JP2023071585A5/ja
Application granted granted Critical
Publication of JP7823307B2 publication Critical patent/JP7823307B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2022116626A 2021-11-11 2022-07-21 半導体装置 Active JP7823307B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US17/983,531 US12341105B2 (en) 2021-11-11 2022-11-09 Semiconductor device
EP22206718.3A EP4181192A1 (en) 2021-11-11 2022-11-10 Semiconductor device
CN202211411146.6A CN116110870A (zh) 2021-11-11 2022-11-11 半导体器件

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021183970 2021-11-11
JP2021183970 2021-11-11

Publications (3)

Publication Number Publication Date
JP2023071585A JP2023071585A (ja) 2023-05-23
JP2023071585A5 JP2023071585A5 (https=) 2025-03-31
JP7823307B2 true JP7823307B2 (ja) 2026-03-04

Family

ID=86409685

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022116626A Active JP7823307B2 (ja) 2021-11-11 2022-07-21 半導体装置

Country Status (1)

Country Link
JP (1) JP7823307B2 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001168268A (ja) 1999-12-07 2001-06-22 Sony Corp 半導体モジュールおよび電子回路装置
JP2004111619A (ja) 2002-09-18 2004-04-08 Yaskawa Electric Corp パワーモジュール

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002026251A (ja) * 2000-07-11 2002-01-25 Toshiba Corp 半導体装置
JP2013041939A (ja) * 2011-08-12 2013-02-28 Sanyo Electric Co Ltd 半導体モジュール及びそれを搭載したインバータ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001168268A (ja) 1999-12-07 2001-06-22 Sony Corp 半導体モジュールおよび電子回路装置
JP2004111619A (ja) 2002-09-18 2004-04-08 Yaskawa Electric Corp パワーモジュール

Also Published As

Publication number Publication date
JP2023071585A (ja) 2023-05-23

Similar Documents

Publication Publication Date Title
US6696764B2 (en) Flip chip type semiconductor device and method of manufacturing the same
US7544537B2 (en) Semiconductor IC-embedded substrate and method for manufacturing same
US10192849B2 (en) Semiconductor modules with semiconductor dies bonded to a metal foil
KR100335454B1 (ko) 반도체칩 모듈용 다층 회로기판 및 그의 제조방법
US8487192B2 (en) Printed wiring board and method for manufacturing the same
JPH07201864A (ja) 突起電極形成方法
US7183190B2 (en) Semiconductor device and fabrication method therefor
JP7666781B2 (ja) 半導体装置
US20100112759A1 (en) Manufacturing method for semiconductor device embedded substrate
JP7666780B2 (ja) 半導体装置
US7915078B2 (en) Manufacturing method for semiconductor device embedded substrate
US12341105B2 (en) Semiconductor device
US12581962B2 (en) Semiconductor device
JP7823307B2 (ja) 半導体装置
CN111613586A (zh) 电子装置及电子装置的制造方法
US10818518B2 (en) Method for manufacturing module component
US11587877B2 (en) Semiconductor device in which peeling off of sealing resin from the wire is suppressed
US20260033371A1 (en) Semiconductor device and method of manufacturing semiconductor device
JP7416607B2 (ja) 半導体装置
US7985619B2 (en) Manufacturing method for semiconductor device embedded substrate
JP2022071925A (ja) 半導体装置および半導体装置の製造方法
JPH06151513A (ja) 多層ｔａｂテープ

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250321

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250321

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20260120

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20260128

R150 Certificate of patent or registration of utility model

Ref document number: 7823307

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150