JP2023024280A5 - - Google Patents

Download PDF

Info

Publication number
JP2023024280A5
JP2023024280A5 JP2022097797A JP2022097797A JP2023024280A5 JP 2023024280 A5 JP2023024280 A5 JP 2023024280A5 JP 2022097797 A JP2022097797 A JP 2022097797A JP 2022097797 A JP2022097797 A JP 2022097797A JP 2023024280 A5 JP2023024280 A5 JP 2023024280A5
Authority
JP
Japan
Prior art keywords
sputtering target
multiple sputtering
support tube
free space
polygonal support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022097797A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023024280A (ja
Filing date
Publication date
Application filed filed Critical
Publication of JP2023024280A publication Critical patent/JP2023024280A/ja
Publication of JP2023024280A5 publication Critical patent/JP2023024280A5/ja
Pending legal-status Critical Current

Links

JP2022097797A 2021-08-04 2022-06-17 多連スパッタリングターゲット Pending JP2023024280A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021120332.5 2021-08-04
DE102021120332 2021-08-04

Publications (2)

Publication Number Publication Date
JP2023024280A JP2023024280A (ja) 2023-02-16
JP2023024280A5 true JP2023024280A5 (enExample) 2025-06-24

Family

ID=82839102

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022097797A Pending JP2023024280A (ja) 2021-08-04 2022-06-17 多連スパッタリングターゲット

Country Status (5)

Country Link
US (1) US20230044831A1 (enExample)
EP (1) EP4131332A1 (enExample)
JP (1) JP2023024280A (enExample)
CN (1) CN115704088A (enExample)
TW (1) TW202307240A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202500780A (zh) * 2023-06-22 2025-01-01 德商Ｆｈｒ設備製造有限公司 真空塗佈系統及以增加的塗佈率塗佈基板之方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4443318A (en) * 1983-08-17 1984-04-17 Shatterproof Glass Corporation Cathodic sputtering apparatus
DE19830223C1 (de) * 1998-07-07 1999-11-04 Techno Coat Oberflaechentechni Vorrichtung und Verfahren zum mehrlagigen PVD - Beschichten von Substraten
JP2003183827A (ja) * 2001-12-19 2003-07-03 Yamaguchi Technology Licensing Organization Ltd 薄膜作製装置
DE10213043B4 (de) 2002-03-22 2008-10-30 Von Ardenne Anlagentechnik Gmbh Rohrmagnetron und seine Verwendung
BE1018645A5 (fr) 2007-09-24 2011-06-07 Ardenne Anlagentech Gmbh Systeme de magnetron avec support de cible blinde.

Similar Documents

Publication Publication Date Title
JP6990705B2 (ja) ナノコーティング装置用の遊星回転棚装置
JP6209286B2 (ja) 成膜装置及び成膜ワーク製造方法
CN103498128B (zh) 磁控溅射镀膜装置及镀膜方法
JP4536584B2 (ja) 回転可能なマグネトロンの大面積アセンブリを有するコーター
CN215440660U (zh) 蒸镀装置以及蒸镀设备
CN110760809B (zh) 一种用于电子束物理气相沉积制备热障涂层的夹持装置
JP2023024280A5 (enExample)
CN206599606U (zh) 一种实现五面镀膜的蒸发镀膜机
TW201348482A (zh) 供濺鍍沉積的微型可旋轉式濺鍍裝置
CN103849843A (zh) 一种具有五靶头的磁控共溅射设备
CN105002470B (zh) 一种镀膜方法及掩模夹具
JP7003034B2 (ja) レンズのコーティングのための装置、方法および使用
TW200539372A (en) Drive-mechanism for a vacuum-processing apparatus
JP2023024280A (ja) 多連スパッタリングターゲット
CN111020498A (zh) 一种具有双加工方式的自冷却真空镀膜机
TWI481734B (zh) A sputtering film forming method for a workpiece having a three-dimensional shape, and a device for use therefor
JP2017503080A (ja) 大気圧未満の圧力でロータとコレクタとの間に電気的接続を有する回転可能なターゲットのエンドブロック
CN110923656B (zh) 一种用于真空镀膜的前叉挂具
CN208136324U (zh) 一种真空镀膜装置
JPH0350832B2 (enExample)
CN110423993A (zh) 一种镀膜治具
TWI506150B (zh) 電弧離子鍍膜裝置
CN106222621B (zh) 一种磁控溅射装置及磁控溅射方法
JP4921320B2 (ja) 真空成膜装置
JP2673725B2 (ja) 成膜装置