TW202307240A - 多濺鍍靶材 - Google Patents
多濺鍍靶材 Download PDFInfo
- Publication number
- TW202307240A TW202307240A TW111128522A TW111128522A TW202307240A TW 202307240 A TW202307240 A TW 202307240A TW 111128522 A TW111128522 A TW 111128522A TW 111128522 A TW111128522 A TW 111128522A TW 202307240 A TW202307240 A TW 202307240A
- Authority
- TW
- Taiwan
- Prior art keywords
- carrier tube
- sputtering
- free space
- polygonal
- sputtering target
- Prior art date
Links
- 238000005477 sputtering target Methods 0.000 title claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 239000000463 material Substances 0.000 claims abstract description 34
- 238000000576 coating method Methods 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000004544 sputter deposition Methods 0.000 claims description 33
- 239000000498 cooling water Substances 0.000 claims description 3
- 238000001755 magnetron sputter deposition Methods 0.000 abstract 1
- 238000000151 deposition Methods 0.000 description 10
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 7
- 239000013077 target material Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011365 complex material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
- H01J37/3429—Plural materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102021120332 | 2021-08-04 | ||
| DE102021120332.5 | 2021-08-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202307240A true TW202307240A (zh) | 2023-02-16 |
Family
ID=82839102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111128522A TW202307240A (zh) | 2021-08-04 | 2022-07-29 | 多濺鍍靶材 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230044831A1 (enExample) |
| EP (1) | EP4131332A1 (enExample) |
| JP (1) | JP2023024280A (enExample) |
| CN (1) | CN115704088A (enExample) |
| TW (1) | TW202307240A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024260745A1 (de) * | 2023-06-22 | 2024-12-26 | Fhr Anlagenbau Gmbh | Vakuumbeschichtungsanlage und verfahren zum beschichten von substraten mit erhöhter beschichtungsrate |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4443318A (en) * | 1983-08-17 | 1984-04-17 | Shatterproof Glass Corporation | Cathodic sputtering apparatus |
| DE19830223C1 (de) * | 1998-07-07 | 1999-11-04 | Techno Coat Oberflaechentechni | Vorrichtung und Verfahren zum mehrlagigen PVD - Beschichten von Substraten |
| JP2003183827A (ja) * | 2001-12-19 | 2003-07-03 | Yamaguchi Technology Licensing Organization Ltd | 薄膜作製装置 |
| DE10213043B4 (de) | 2002-03-22 | 2008-10-30 | Von Ardenne Anlagentechnik Gmbh | Rohrmagnetron und seine Verwendung |
| US20090078572A1 (en) | 2007-09-24 | 2009-03-26 | Von Ardenne Anlagentechnik Gmbh | Magnetron end-block with shielded target mounting assembly |
-
2022
- 2022-06-17 JP JP2022097797A patent/JP2023024280A/ja active Pending
- 2022-07-29 TW TW111128522A patent/TW202307240A/zh unknown
- 2022-08-02 US US17/816,781 patent/US20230044831A1/en not_active Abandoned
- 2022-08-03 CN CN202210927169.6A patent/CN115704088A/zh active Pending
- 2022-08-04 EP EP22188642.7A patent/EP4131332A1/de not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| EP4131332A1 (de) | 2023-02-08 |
| CN115704088A (zh) | 2023-02-17 |
| US20230044831A1 (en) | 2023-02-09 |
| JP2023024280A (ja) | 2023-02-16 |
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