JP2023022522A - Processing device - Google Patents

Abstract

To provide a processing device configured so as to prevent processing water from leaking and enable loads acting on processing/feeding means to reduce.SOLUTION: A processing device includes holding means 4 that holds a work-piece, processing means that applies processing while supplying processing water to the work-piece held by the holding means 4, and processing/feeding means that processes and feeds the holding means 4. The holding means 4 includes a chuck table 10 with a holding surface for holding the work-piece, a slider plate 12 made of nonmagnetic materials that supports the chuck table 10 slidably, and a magnetic body that magnetizes the chuck table 10 through the slider plate 12. The processing/feeding means comprises a guide rail that extends in a processing/feeding direction to support the magnetic body slidably, and a driving part that moves the magnetic body supported on the guide rail.SELECTED DRAWING: Figure 3

Description

The present invention relates to a processing apparatus including processing means for processing a workpiece while supplying processing water to the workpiece.

A wafer in which a plurality of devices such as ICs and LSIs are partitioned by dividing lines and formed on the surface is divided into individual device chips by a dicing machine, and each of the divided device chips is applied to electrical equipment such as mobile phones and personal computers. used.

The dicing apparatus includes holding means for holding a workpiece, machining means for cutting the workpiece while supplying machining water to the workpiece held by the holding means, and machining feed means for machining and feeding the holding means. include. The holding means has bellows on both sides in the machining feed direction, and is configured to prevent machining water from leaking to the machining feed means by the bellows (see Patent Document 1, for example).

Japanese Patent Application Laid-Open No. 2004-186361

However, when machining the work piece, there are cases where the offcuts of the work piece fall on the bellows and make a hole. There is a problem that

In addition, since the bellows expands and contracts, a load is applied to the processing feeding means, which causes damage to the ball screw or linear motor constituting the processing feeding means.

SUMMARY OF THE INVENTION An object of the present invention, which has been made in view of the above facts, is to provide a processing apparatus capable of preventing the leakage of processing water and reducing the load applied to the processing feeding means.

According to the present invention, the following processing apparatus for solving the above problems is provided. That is, the processing apparatus comprises holding means for holding a workpiece, machining means for machining the workpiece while supplying machining water to the workpiece held by the holding means, and machining for feeding the holding means. feeding means, wherein the holding means comprises a chuck table having a holding surface for holding the workpiece, a non-magnetic slider plate for slidably supporting the chuck table, and the chuck table. a magnet magnetically attracted via a slider plate, the processing feed means comprising: a guide rail extending in the processing feed direction and slidably supporting the magnet; and the guide rail supported by the guide rail. and a driving unit for moving the magnet.

Preferably, a drainage channel for draining processing water is formed on the outer circumference of the slider plate. It is desirable that the drive section for moving the magnet has a ball screw, an electric motor for rotating the ball screw, and a female screw provided on the magnet and engaged with the ball screw. A drive unit for moving the magnet may be composed of a linear motor. It is preferable that a plurality of ejection holes for ejecting fluid are formed in the bottom surface of the chuck table, and the fluid ejected from the ejection holes forms a fluid layer between the chuck table and the slider plate. Advantageously, the working means is a cutting means having a rotatable cutting blade.

The processing apparatus of the present invention comprises holding means for holding a workpiece, machining means for machining the workpiece while supplying machining water to the workpiece held by the holding means, and machining feed for machining and feeding the holding means. holding means comprising a chuck table having a holding surface for holding a workpiece; a non-magnetic slider plate for slidably supporting the chuck table; a magnet magnetically attracted through a plate, the processing feed means comprising: a guide rail extending in the processing feed direction and slidably supporting the magnet; and the magnet supported by the guide rail. and a drive unit for moving the body, it is possible to prevent machining water from leaking without arranging bellows on both sides of the holding means in the machining and feeding direction, and to reduce the load on the machining and feeding means.

1 is a perspective view of a processing apparatus constructed in accordance with the present invention; FIG. FIG. 2 is a perspective view of a main part of the processing apparatus shown in FIG. 1; FIG. 2 is a perspective view of the holding means shown in FIG. 1; (a) A perspective view of the chuck table shown in FIG. 1 as seen from above, (b) A perspective view of the chuck table shown in FIG. 1 as seen from below. FIG. 2 is a perspective view of the slider plate shown in FIG. 1;

A preferred embodiment of a processing apparatus constructed according to the present invention will be described below with reference to the drawings.

(Processing device 2)
Referring to FIGS. 1 and 2, a processing apparatus generally indicated by reference numeral 2 includes holding means 4 for holding a workpiece, and machining water being supplied to the workpiece held by the holding means 4. It includes processing means 6 for processing, and processing feed means 8 (see FIG. 2) for processing and feeding the holding means 4 in the X-axis direction indicated by the arrow X in FIG. The Y-axis direction indicated by arrow Y in FIG. 1 is a direction orthogonal to the X-axis direction, and the Z-axis direction indicated by arrow Z in FIG. 1 is a vertical direction orthogonal to each of the X-axis direction and the Y-axis direction. . Also, the XY plane defined by the X-axis direction and the Y-axis direction is substantially horizontal.

(Workpiece)
FIG. 1 also shows a wafer W as a workpiece. The wafer W in the illustrated embodiment is attached to a dicing tape T whose peripheral edge is fixed to an annular frame F, and is supported by the annular frame F via the dicing tape T. As shown in FIG. Although the reference numerals are omitted, the surface of the wafer W is partitioned into a plurality of rectangular regions by grid-like dividing lines, and devices such as ICs and LSIs are formed in each of the plurality of rectangular regions.

(Holding means 4)
As shown in FIGS. 2 and 3, the holding means 4 includes a chuck table 10 (see FIG. 3) having a holding surface for holding the workpiece, and a non-magnetic slider for slidably supporting the chuck table 10 . It includes a plate 12 (see FIG. 3) and a magnet body 14 (see FIG. 2) that magnetically attaches the chuck table 10 via the slider plate 12 .

(Chuck table 10 of holding means 4)
3 and 4, the chuck table 10 of the illustrated embodiment includes a circular substrate 16 made of a nonmagnetic material, a cylindrical portion 18 extending upward from the upper surface of the substrate 16, and a cylindrical portion 18 extending upward from the upper surface of the substrate 16. and a porous circular suction chuck 20 located at the upper end of 18 .

As shown in FIG. 4(b), a circular permanent magnet 22 is provided at the center of the lower surface of the substrate 16. As shown in FIG. The diameter of circular permanent magnet 22 is smaller than the diameter of substrate 16 . A plurality of permanent magnets 24 are arranged in a ring as a whole on the periphery of the lower surface of the substrate 16 . The plurality of permanent magnets 24 are arranged so that S poles and N poles appear alternately on the lower surface side of the substrate 16 .

A plurality of ejection holes 26 are provided on the lower surface of the substrate 16 between the circular permanent magnet 22 and the plurality of permanent magnets 24 . The plurality of ejection holes 26 are provided at intervals in the circumferential direction, and are arranged in an annular shape as a whole. As shown in FIG. 3 , the plurality of ejection holes 26 are connected to fluid supply means 30 via flexible tubes 28 .

When fluid (water or air) is supplied from the fluid supply means 30 , the fluid is ejected from the ejection holes 26 to form a fluid layer between the lower surface of the substrate 16 of the chuck table 10 and the upper surface of the slider plate 12 . is formed, and the chuck table 10 slightly floats above the upper surface of the slider plate 12 by the amount of the fluid layer formed.

A plurality of (four in the illustrated embodiment) clamps 32 are arranged on the outer periphery of the cylindrical portion 18 . As shown in FIG. 3, clamp 32 is connected to compressed air supply means 36 via flexible tube 34 . The clamp 32 is positioned at a fixing position for fixing the annular frame F and a release position for releasing the fixing of the annular frame F by compressed air supplied from the compressed air supply means 36 . The clamp 32 may be positioned between the fixed position and the released position by an electric actuator.

As shown in FIG. 3, the suction chuck 20 is connected to suction means 40 via a flexible tube 38. As shown in FIG. In the chuck table 10 , the suction means 40 generates a suction force on the upper surface of the suction chuck 20 , thereby sucking and holding the workpiece such as the wafer W placed on the upper surface of the suction chuck 20 . Thus, the upper surface of the suction chuck 20 serves as a holding surface for holding the workpiece.

(Slider plate 12 of holding means 4)
The slider plate 12 of the holding means 4 will be described with reference to FIGS. 3 and 5. FIG. The slider plate 12 of the illustrated embodiment has a rectangular shape and is fixed with the longitudinal direction of the slider plate 12 aligned with the X-axis direction.

Since the slider plate 12 slidably supports the chuck table 10, it is preferably made of a material having a relatively low coefficient of friction, such as polytetrafluoroethylene (PTFE). Alternatively, the slider plate 12 may be formed by using a relatively strong material such as fiber reinforced plastic (FRP) as a substrate and coating the substrate with a low-friction material such as PTFE. The thickness of the slider plate 12 is such that scraps of the workpiece that fall during processing do not cause cracks that may cause water leakage. It has a thickness that can be worn (for example, about 10 mm).

As will be understood by referring to FIGS. 3 and 5, the outer periphery of the slider plate 12 is formed with a drainage channel 42 for draining the processing water. The illustrated drainage channel 42 is a groove that is lower than the upper surface of the slider plate 12 , and a drain hose 44 is connected to the downstream side of the drainage channel 42 . The processing water used during processing flows over the upper surface of the slider plate 12 into the drainage channel 42 and is then discharged through the drain hose 44 . Thus, in the processing apparatus 2 of the illustrated embodiment, the slider plate 12 prevents the processing water from leaking.

(Magnet body 14 of holding means 4)
The magnets 14 of the holding means 4 are arranged below the slider plate 12 . As shown in FIG. 2 , the magnet body 14 has a movable table 46 arranged to be movable in the X-axis direction, and a cylindrical main portion 48 fixed on the movable table 46 . The main portion 48 is made of a non-magnetic material. A circular magnet 50 that attracts the circular permanent magnet 22 of the chuck table 10 is arranged on the upper surface of the main portion 48 . Circular magnet 50 may be a permanent magnet or an electromagnet. The diameter of circular magnet 50 is smaller than the diameter of magnet body 14 . Annular linear motors 52 are provided on the periphery of the upper surface of the magnet body 14 so as to correspond to the plurality of permanent magnets 24 of the chuck table 10 . The linear motor 52 is composed of a plurality of electromagnets arranged in a ring.

In the magnet body 14 , the chuck table 10 is magnetically attached from below via the slider plate 12 by the attraction between the circular magnet 50 and the circular permanent magnet 22 of the chuck table 10 . Also, the magnet body 14 generates a magnetic rotational force through interaction between the plurality of electromagnets of the linear motor 52 and the plurality of permanent magnets 24 of the chuck table 10, and rotates the chuck table 10 with the Z-axis direction as the axis. to rotate.

The upper surface of the magnet body 14 may be in contact with the lower surface of the slider plate 12 , but a gap may be provided between the upper surface of the magnet body 14 and the lower surface of the slider plate 12 . However, since the chuck table 10 is magnetically attached by the magnets 14 via the slider plate 12, it is preferable that the gap between the magnets 14 and the slider plate 12 is as small as possible (for example, about 0.1 mm).

(Processing means 6)
The processing means 6 will be described with reference to FIG. The processing means 6 includes a Y-axis movable member 56 mounted on a base 54 so as to be movable in the Y-axis direction, a Y-axis feed means 58 for indexing and feeding the Y-axis movable member 56 in the Y-axis direction, It includes a Z-axis movable member 60 movably attached to the Y-axis movable member 56, and Z-axis feeding means 62 for cutting and feeding the Z-axis movable member 60 in the Z-axis direction.

The Y-axis feeding means 58 has a ball screw 64 extending in the Y-axis direction on the base 54 and an electric motor 66 for rotating the ball screw 64 . The ball screw 64 is screwed into a female thread (not shown) provided at the bottom of the Y-axis movable member 56 .

The Y-axis feeding means 58 converts the rotary motion of the electric motor 66 into linear motion by means of the ball screw 64 and transmits it to the Y-axis movable member 56 . The movable member 56 is indexed and fed in the Y-axis direction.

The Z-axis feeding means 62 has a ball screw (not shown) attached to the Y-axis movable member 56 and extending in the Z-axis direction, and an electric motor 70 for rotating the ball screw. A ball screw of the Z-axis feeding means 62 is screwed into a female thread (not shown) formed in the Z-axis movable member 60 .

In the Z-axis feeding means 62, the rotary motion of the electric motor 70 is converted into linear motion by a ball screw, transmitted to the Z-axis movable member 60, and a pair of guide rails 72 provided on the Y-axis movable member 56 (only one ), the Z-axis movable member 60 is cut and fed in the Z-axis direction.

Continuing the description with reference to FIG. 2, a spindle housing 74 extending in the Y-axis direction is fixed to the Z-axis movable member 60 . A spindle 76 is rotatably mounted on the spindle housing 74, and an electric motor (not shown) for rotating the spindle 76 is mounted. An annular cutting blade 78 for cutting a workpiece such as a wafer W is fixed to the tip of the spindle 76 . Thus, the processing means 6 of the illustrated embodiment is configured as a cutting means having a rotatable cutting blade 78 .

A blade cover 80 that partially covers the cutting blade 78 is attached to the tip of the spindle housing 74. The blade cover 80 has a nozzle 82 that supplies machining water to the portion being cut by the cutting blade 78. is provided. Although not shown, the nozzle 82 is connected to a machining water supply means.

(Processing sending means 8)
As shown in FIG. 2, the processing feeding means 8 of the illustrated embodiment extends in the X-axis direction, which is the processing feeding direction, and includes a guide rail 84 that slidably supports the magnet body 14 of the holding means 4, a guide and a drive unit 86 for moving the magnet 14 supported by the rails 84 . A pair of guide rails 84 are provided on the upper surface of the base 54 at intervals in the Y-axis direction.

The driving portion 86 of the processing feeding means 8 includes a ball screw 88 extending in the X-axis direction between a pair of guide rails 84, an electric motor 90 for rotating the ball screw 88, and a ball mounted on the movable base 46 of the magnet body 14. It has an internal thread 92 into which the screw 88 is threaded.

The processing/feeding means 8 converts the rotary motion of the electric motor 90 into linear motion by the ball screw 88, transmits the linear motion to the magnet 14, and processes and feeds the magnet 14 along the guide rail 84 in the X-axis direction. The driving section 86 of the processing feeding means 8 may be composed of a linear motor.

As described above, the magnet body 14 to be processed and fed by the processing and feeding means 8 is magnetically attached to the chuck table 10 through the slider plate 12. Therefore, when the magnet body 14 is processed and fed in the X-axis direction, the magnet The chuck table 10 is processed and fed in the X-axis direction together with the body 14 .

In the illustrated embodiment, the bellows are not arranged on both sides of the chuck table 10, and the bellows do not expand or contract when the chuck table 10 is moved by the drive section 86 of the processing feed means 8. 8, the load on the drive unit 86 is reduced.

Further, when the chuck table 10 is moved by the drive unit 86 of the processing feed means 8 , the fluid ejected from the ejection holes 26 of the chuck table 10 causes the lower surface of the substrate 16 of the chuck table 10 and the upper surface of the slider plate 12 to move. A fluid layer is preferably formed therebetween. As a result, the load applied to the driving portion 86 of the processing feed means 8 when the chuck table 10 moves is further reduced.

As shown in FIG. 1, the processing apparatus 2 further includes imaging means 94 for imaging the workpiece held on the chuck table 10 of the holding means 4, display means 96 for displaying the image picked up by the imaging means 94, A vertically movable cassette table 100 on which a cassette 98 containing a plurality of workpieces is placed, and workpieces before processing are pulled out from the cassette 98 and carried out to a temporary placement table 102, and the processing is positioned on the temporary placement table 102.例文帳に追加loading/unloading means 104 for loading the finished workpiece into the cassette 98; A cleaning means 108 for cleaning the processed workpiece and a second transfer means 110 for transferring the processed workpiece from the chuck table 10 to the cleaning means 108 are provided.

When performing a required cutting process on a wafer W as an object to be processed using the processing apparatus 2 as described above, first, the unprocessed wafer W is pulled out from the cassette 98 onto the temporary placement table 102 by the loading/unloading means 104 . . Next, the wafer W is transferred from the temporary placement table 102 to the chuck table 10 positioned at the transfer position (position shown in FIG. 1) by the first transfer means 106 and placed on the upper surface of the suction chuck 20 .

After the wafer W is placed on the upper surface of the adsorption chuck 20 , the suction means 40 is operated to generate a suction force on the upper surface of the adsorption chuck 20 to hold the wafer W by suction on the upper surface of the adsorption chuck 20 . Compressed air is supplied from the compressed air supply means 36 to the plurality of clamps 32 to position each clamp 32 at a fixed position, and the annular frame F is fixed by each clamp 32 .

After the wafer W is held by suction and the annular frame F is fixed, the drive section 86 of the processing feed means 8 is operated to move the chuck table 10 together with the magnet body 14 below the imaging means 94 . When moving the chuck table 10 , fluid is ejected from the ejection holes 26 of the chuck table 10 to form a fluid layer between the lower surface of the substrate 16 of the chuck table 10 and the upper surface of the slider plate 12 .

During cutting, which will be described later, it prevents chips from entering between the lower surface of the substrate 16 of the chuck table 10 and the upper surface of the slider plate 12, and promotes the flow of chips into the drainage channel 42. In view of this, it is desirable that the fluid ejected from the ejection holes 26 is water.

Next, the image pickup means 94 picks up an image of the wafer W, and based on the image picked up by the image pickup means 94, the direction of the wafer W is adjusted, and the dividing line, which is the area to be cut, is aligned in the X-axis direction. At this time, by rotating the chuck table 10 by the linear motor 52 of the magnet 14, the direction of the wafer W is adjusted so that the line to be divided is aligned with the X-axis direction.

After adjusting the orientation of the wafer W, the chuck table 10 is moved below the processing means 6 by the driving portion 86 of the processing feeding means 8 . Next, the cutting edge of the cutting blade 78 rotated at high speed is caused to cut into the dividing line of the wafer W, and while supplying machining water from the nozzle 82 to the portion where the cutting edge of the cutting blade 78 is cut, the processing feed means 8 is fed. , the chuck table 10 is processed and fed in the X-axis direction. As a result, the division line of the wafer W can be subjected to a required cutting process.

Next, cutting is repeated while indexing and feeding the cutting blade 78 in the Y-axis direction by the Y-axis feeding means 58 by the interval in the Y-axis direction of the scheduled dividing lines, and all of the scheduled dividing lines aligned in the X-axis direction. Apply cutting along. Further, after rotating the chuck table 10 by 90 degrees by the linear motor 52 of the magnet body 14, cutting and indexing are repeated, and all of the planned division lines perpendicular to the previously cut division line are processed. Apply cutting along.

After the wafer W is subjected to the required cutting process, the chuck table 10 is moved to the transfer position by the drive unit 86 of the processing feed means 8, and then the wafer is transferred from the chuck table 10 to the cleaning means 108 by the second transport means 110. W is conveyed and the wafer W is cleaned by the cleaning means 108 . Then, the first transport means 106 transports the wafer W from the cleaning means 108 to the temporary placement table 102 , and the loading/unloading means 104 transports the wafer W from the temporary placement table 102 to the cassette 98 .

As described above, the processing apparatus 2 of the illustrated embodiment prevents processing water from leaking by means of the slider plate 12 without arranging bellows on both sides of the chuck table 10 in the processing feed direction (X-axis direction). there is In addition, since the bellows are not arranged on both sides of the chuck table 10 in the processing apparatus 2, the bellows do not expand or contract when the chuck table 10 is moved by the drive unit 86 of the processing feed means 8, and the processing can be fed. The load on the drive 86 of the means 8 is reduced.

In the illustrated embodiment, an example in which the processing means 6 is configured as a cutting means has been described, but the processing means of the present invention may be a grinding means for grinding the workpiece or a polishing means for polishing the workpiece. It may be a means or the like.

2: processing device 4: holding means 6: processing means 8: processing feeding means 10: chuck table 12: slider plate 14: magnet body 26: jet hole 42: drainage channel 78: cutting blade 84: guide rail (processing feeding means)
86: Driving unit (processing feeding means)
88: Ball screw (driving part of processing feeding means)
90: Electric motor (driving unit of processing feed means)
92: female screw (driving part of processing feeding means)

Claims (6)

A processing device,
holding means for holding a workpiece, machining means for machining the workpiece while supplying machining water to the workpiece held by the holding means, and machining feeding means for machining and feeding the holding means,
The holding means includes a chuck table having a holding surface for holding the workpiece, a non-magnetic slider plate for slidably supporting the chuck table, and the chuck table magnetically attached via the slider plate. and a magnet body that
The processing feed means includes a guide rail extending in the processing feed direction and slidably supporting the magnet, and a driving section for moving the magnet supported by the guide rail. 2. A processing apparatus according to claim 1, wherein a drainage channel for draining processing water is formed on the outer circumference of said slider plate. 2. The processing according to claim 1, wherein the drive unit for moving the magnet has a ball screw, an electric motor for rotating the ball screw, and a female screw disposed on the magnet and engaged with the ball screw. Device. 2. The processing apparatus according to claim 1, wherein the driving portion for moving the magnet is composed of a linear motor. 2. The processing according to claim 1, wherein a plurality of ejection holes for ejecting fluid are formed in the bottom surface of said chuck table, and fluid ejected from said ejection holes forms a fluid layer between said chuck table and said slider plate. Device. 2. The processing apparatus according to claim 1, wherein said processing means is cutting means having a rotatable cutting blade.

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