JP2023002551A - ビードブラストを用いない表面のテクスチャリング - Google Patents
ビードブラストを用いない表面のテクスチャリング Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/355—Texturing
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
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Abstract
Description
Claims (15)
- 半導体処理チャンバで使用するためのコンポーネントの表面にテクスチャを提供するためのシステムであって、
処理領域を含むエンクロージャ、
前記処理領域に配置され、支持面を備える支持体、
光子の流れを生成するための光子光源、
前記光子光源から光子の前記流れを受け取るように前記光子光源に動作可能に結合された光学モジュールであって、
前記光子光源から生成された光子の前記流れから光子のビームを生成するためのビーム変調器、および
前記コンポーネントの前記表面に光子の前記ビームを走査するためのビームスキャナ、
を備える光学モジュール、ならびに
前記ビームスキャナから光子の前記ビームを受け取り、約345nmから約1100nmの範囲の波長の光子の前記ビームを前記コンポーネントの前記表面に分配して、前記コンポーネント上に複数のフィーチャを形成するためのレンズ、
を備えるシステム。 - 前記レンズが、光子の前記ビームを水平に前記コンポーネントの前記表面に向かって分配するように構成されている、請求項1に記載のシステム。
- 前記レンズが、光子の前記ビームを垂直に前記コンポーネントの前記表面に向かって分配するように構成されている、請求項1に記載のシステム。
- 前記コンポーネントが、前記レンズと前記支持体の間に配置され、前記処理領域が、クラス1環境として維持され、前記支持体の前記支持面と前記レンズが、前記クラス1環境内に配置され、前記処理領域が、大気圧とほぼ同等の圧力を備え、前記システムが、前記コンポーネントを前記クラス1環境内に導入し、または前記コンポーネントを前記クラス1環境から取り除くためのコンベヤを、さらに備える、請求項1に記載のシステム。
- 前記ビームスキャナが、ラインバイラインパターンまたはスズメパターンを使用して、前記コンポーネントの前記表面に光子の前記ビームを走査するように構成されている、請求項1に記載のシステム。
- 前記光学モジュールが、前記コンポーネントの前記表面に光子の前記ビームを走査している間、光子の前記ビームをパルス化するように構成されている、請求項1に記載のシステム。
- 光子の前記ビームが、
約7μmから約100μmの範囲のビーム径、
約10psから約30nsの範囲のパルス幅、および
約10KHzから約200KHzの範囲のパルス繰り返し率、
を備える、請求項6に記載のシステム。 - 形成される前記フィーチャが、くぼみ、隆起、またはそれらの組み合わせを含む、請求項1に記載のシステム。
- 半導体処理チャンバで使用するためのコンポーネントの表面にテクスチャを提供する方法であって、
光子の流れを生成すること、
光子の前記流れをビームに成形すること、
大気圧とほぼ同等の圧力を有する周囲空気または窒素のガス濃度を含む処理領域を通して、前記コンポーネントの前記表面に向かって光子の前記ビームを走査すること、および
前記コンポーネントの前記表面に光子の前記ビームを分配して、前記表面上に複数のフィーチャを形成すること、
を含む方法。 - 前記半導体処理チャンバを前記コンポーネントとともに組み立てること、および前記半導体処理チャンバ内で半導体を処理すること、をさらに含む、請求項9に記載の方法。
- クラス1環境として維持されたエンクロージャ内に前記コンポーネントを配置することを、さらに含み、前記配置することが、コンベヤを使用して前記コンポーネントを前記クラス1環境内に運ぶことを含む、請求項9に記載の方法。
- 分配することが、光子の前記ビームを水平に前記コンポーネントの前記表面に向かって分配することを含む、請求項9に記載の方法。
- 前記コンポーネントの前記表面に光子の前記ビームを走査している間、光子の前記ビームをパルス化することを、さらに含み、光子の前記ビームが、約345nmから約1100nmの範囲の波長を含み、形成される前記フィーチャが、くぼみ、隆起、またはそれらの組み合わせを含む、請求項9に記載の方法。
- 半導体処理チャンバで使用するためのコンポーネントの表面にテクスチャを提供するためのシステムであって、
大気圧とほぼ同等の圧力を有するクラス1環境として維持された処理領域を含むエンクロージャ、
前記処理領域に配置され、支持面を備える支持体、
光子の流れを生成するための光子光源、
前記光子光源から光子の前記流れを受け取るように前記光子光源に動作可能に結合された光学モジュールであって、
前記光子光源から生成された光子の前記流れから光子のビームを生成するためのビーム変調器、および
前記コンポーネントの前記表面に光子の前記ビームを走査するためのビームスキャナ、
を備える光学モジュール、ならびに
前記ビームスキャナから光子の前記ビームを受け取り、前記コンポーネントの前記表面に約345nmから約1100nmの範囲の波長の光子の前記ビームを分配して、前記コンポーネント上に複数のフィーチャを形成するように、前記処理領域に配置されたレンズ、
を備えるシステム。 - 前記レンズが、光子の前記ビームを水平に前記コンポーネントの前記表面に向かって分配するように構成されている、請求項14に記載のシステム。
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JP2020555829A JP7239607B2 (ja) | 2018-04-17 | 2019-03-20 | ビードブラストを用いない表面のテクスチャリング |
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