JP2023000660A - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP2023000660A
JP2023000660A JP2021101611A JP2021101611A JP2023000660A JP 2023000660 A JP2023000660 A JP 2023000660A JP 2021101611 A JP2021101611 A JP 2021101611A JP 2021101611 A JP2021101611 A JP 2021101611A JP 2023000660 A JP2023000660 A JP 2023000660A
Authority
JP
Japan
Prior art keywords
light
light emitting
emitting device
emitted
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021101611A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023000660A5 (zh
Inventor
紀子 二瓶
Noriko Nihei
佳織 立花
Yoshiori Tachibana
吉鎬 梁
Ji-Hao Liang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP2021101611A priority Critical patent/JP2023000660A/ja
Priority to PCT/JP2022/022775 priority patent/WO2022264850A1/ja
Priority to CN202280041661.1A priority patent/CN117461152A/zh
Publication of JP2023000660A publication Critical patent/JP2023000660A/ja
Publication of JP2023000660A5 publication Critical patent/JP2023000660A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
JP2021101611A 2021-06-18 2021-06-18 発光装置 Pending JP2023000660A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021101611A JP2023000660A (ja) 2021-06-18 2021-06-18 発光装置
PCT/JP2022/022775 WO2022264850A1 (ja) 2021-06-18 2022-06-06 発光装置
CN202280041661.1A CN117461152A (zh) 2021-06-18 2022-06-06 发光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021101611A JP2023000660A (ja) 2021-06-18 2021-06-18 発光装置

Publications (2)

Publication Number Publication Date
JP2023000660A true JP2023000660A (ja) 2023-01-04
JP2023000660A5 JP2023000660A5 (zh) 2024-06-24

Family

ID=84526392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021101611A Pending JP2023000660A (ja) 2021-06-18 2021-06-18 発光装置

Country Status (3)

Country Link
JP (1) JP2023000660A (zh)
CN (1) CN117461152A (zh)
WO (1) WO2022264850A1 (zh)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9024340B2 (en) * 2007-11-29 2015-05-05 Nichia Corporation Light emitting apparatus and method for producing the same
JP5397944B2 (ja) * 2009-11-11 2014-01-22 日東電工株式会社 蛍光体含有複合シート
JP2013197530A (ja) * 2012-03-22 2013-09-30 Sharp Corp 光源、発光装置、バックライト用光源、表示装置、および光源の製造方法
JP7111939B2 (ja) * 2017-04-28 2022-08-03 日亜化学工業株式会社 発光装置及びその製造方法
JP7233301B2 (ja) * 2019-05-29 2023-03-06 スタンレー電気株式会社 半導体発光装置
JP7282620B2 (ja) * 2019-07-04 2023-05-29 シャープ福山レーザー株式会社 画像表示素子
CN112967980B (zh) * 2020-08-13 2021-12-24 重庆康佳光电技术研究院有限公司 芯片转移组件及其制作方法、芯片转移方法

Also Published As

Publication number Publication date
CN117461152A (zh) 2024-01-26
WO2022264850A1 (ja) 2022-12-22

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