JP2022546849A5 - - Google Patents

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Publication number
JP2022546849A5
JP2022546849A5 JP2022515124A JP2022515124A JP2022546849A5 JP 2022546849 A5 JP2022546849 A5 JP 2022546849A5 JP 2022515124 A JP2022515124 A JP 2022515124A JP 2022515124 A JP2022515124 A JP 2022515124A JP 2022546849 A5 JP2022546849 A5 JP 2022546849A5
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JP
Japan
Prior art keywords
illumination
symmetric
weighing
profile
target
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2022515124A
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English (en)
Japanese (ja)
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JP7451687B2 (ja
JP2022546849A (ja
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Priority claimed from US16/996,328 external-priority patent/US11359916B2/en
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Publication of JP2022546849A publication Critical patent/JP2022546849A/ja
Publication of JP2022546849A5 publication Critical patent/JP2022546849A5/ja
Application granted granted Critical
Publication of JP7451687B2 publication Critical patent/JP7451687B2/ja
Active legal-status Critical Current
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JP2022515124A 2019-09-09 2020-08-31 オーバレイ計測用格子ターゲット構造の暗視野イメージング Active JP7451687B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201962897548P 2019-09-09 2019-09-09
US62/897,548 2019-09-09
US202063036760P 2020-06-09 2020-06-09
US63/036,760 2020-06-09
US16/996,328 US11359916B2 (en) 2019-09-09 2020-08-18 Darkfield imaging of grating target structures for overlay measurement
US16/996,328 2020-08-18
PCT/US2020/048668 WO2021050305A1 (en) 2019-09-09 2020-08-31 Darkfield imaging of grating target structures for overlay measurement

Publications (3)

Publication Number Publication Date
JP2022546849A JP2022546849A (ja) 2022-11-09
JP2022546849A5 true JP2022546849A5 (https=) 2023-08-15
JP7451687B2 JP7451687B2 (ja) 2024-03-18

Family

ID=74850983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022515124A Active JP7451687B2 (ja) 2019-09-09 2020-08-31 オーバレイ計測用格子ターゲット構造の暗視野イメージング

Country Status (7)

Country Link
US (1) US11359916B2 (https=)
EP (1) EP4025901A4 (https=)
JP (1) JP7451687B2 (https=)
KR (2) KR20220054877A (https=)
CN (1) CN114341594B (https=)
TW (1) TWI845754B (https=)
WO (1) WO2021050305A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11309202B2 (en) * 2020-01-30 2022-04-19 Kla Corporation Overlay metrology on bonded wafers
US11526086B2 (en) 2021-03-08 2022-12-13 Kla Corporation Multi-field scanning overlay metrology
DE102021205328B3 (de) 2021-05-26 2022-09-29 Carl Zeiss Smt Gmbh Verfahren zur Bestimmung einer Abbildungsqualität eines optischen Systems bei Beleuchtung mit Beleuchtungslicht innerhalb einer zu vermessenden Pupille und Metrologiesystem dafür
US11688717B2 (en) * 2021-08-26 2023-06-27 Taiwan Semiconductor Manufacturing Company, Ltd. Mechanical wafer alignment detection for bonding process
US12032300B2 (en) * 2022-02-14 2024-07-09 Kla Corporation Imaging overlay with mutually coherent oblique illumination
US12253805B2 (en) 2022-08-11 2025-03-18 Kla Corporation Scatterometry overlay metrology with orthogonal fine-pitch segmentation
TW202530674A (zh) * 2023-09-01 2025-08-01 美商應用材料股份有限公司 用於混合式接合缺陷偵測之多向照明
US12506038B2 (en) * 2024-01-11 2025-12-23 Tokyo Electron Limited Wafer bonding overlay measurement system
US12529878B2 (en) * 2024-03-26 2026-01-20 Kla Corporation High contrast imaging in bonded sample metrology using oblique illumination
US20250306477A1 (en) * 2024-03-27 2025-10-02 Kla Corporation Single grab pupil landscape via outside the objective lens broadband illumination

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7528953B2 (en) * 2005-03-01 2009-05-05 Kla-Tencor Technologies Corp. Target acquisition and overlay metrology based on two diffracted orders imaging
NL1036245A1 (nl) * 2007-12-17 2009-06-18 Asml Netherlands Bv Diffraction based overlay metrology tool and method of diffraction based overlay metrology.
US8681413B2 (en) * 2011-06-27 2014-03-25 Kla-Tencor Corporation Illumination control
US8817273B2 (en) 2012-04-24 2014-08-26 Nanometrics Incorporated Dark field diffraction based overlay
WO2015124397A1 (en) 2014-02-21 2015-08-27 Asml Netherlands B.V. Optimization of target arrangement and associated target
WO2016005167A1 (en) * 2014-07-09 2016-01-14 Asml Netherlands B.V. Inspection apparatus, inspection method and device manufacturing method
CN107111245B (zh) * 2014-12-19 2019-10-18 Asml荷兰有限公司 测量非对称性的方法、检查设备、光刻系统及器件制造方法
CN106611756A (zh) * 2015-10-26 2017-05-03 联华电子股份有限公司 晶片对晶片对接结构及其制作方法
KR20180095932A (ko) 2015-12-23 2018-08-28 에이에스엠엘 네델란즈 비.브이. 메트롤로지 방법 및 장치
WO2017114641A1 (en) * 2015-12-31 2017-07-06 Asml Holding N.V. Method and device for focusing in an inspection system
JP6685821B2 (ja) * 2016-04-25 2020-04-22 キヤノン株式会社 計測装置、インプリント装置、物品の製造方法、光量決定方法、及び、光量調整方法
US10048132B2 (en) * 2016-07-28 2018-08-14 Kla-Tencor Corporation Simultaneous capturing of overlay signals from multiple targets
EP3422103A1 (en) 2017-06-26 2019-01-02 ASML Netherlands B.V. Method of determining a performance parameter of a process
US10663633B2 (en) 2017-06-29 2020-05-26 Taiwan Semiconductor Manufacturing Co., Ltd. Aperture design and methods thereof

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