JP2022524020A - 圧着電気コネクタ - Google Patents
圧着電気コネクタ Download PDFInfo
- Publication number
- JP2022524020A JP2022524020A JP2021552761A JP2021552761A JP2022524020A JP 2022524020 A JP2022524020 A JP 2022524020A JP 2021552761 A JP2021552761 A JP 2021552761A JP 2021552761 A JP2021552761 A JP 2021552761A JP 2022524020 A JP2022524020 A JP 2022524020A
- Authority
- JP
- Japan
- Prior art keywords
- elastic body
- insulating elastic
- extending portion
- extension portion
- electric connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002788 crimping Methods 0.000 title claims abstract description 81
- 239000002184 metal Substances 0.000 claims abstract description 71
- 229910052751 metal Inorganic materials 0.000 claims abstract description 71
- 210000000078 claw Anatomy 0.000 claims description 29
- 239000012790 adhesive layer Substances 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 229920001187 thermosetting polymer Polymers 0.000 claims description 18
- 229920001169 thermoplastic Polymers 0.000 claims description 16
- 239000004416 thermosoftening plastic Substances 0.000 claims description 16
- 239000011247 coating layer Substances 0.000 claims description 14
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- 229920002050 silicone resin Polymers 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 5
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 5
- 150000001336 alkenes Chemical class 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 150000002148 esters Chemical class 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 5
- 229920002647 polyamide Polymers 0.000 claims description 5
- 229920000570 polyether Polymers 0.000 claims description 5
- 239000004814 polyurethane Substances 0.000 claims description 5
- 229920002635 polyurethane Polymers 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 38
- 238000003466 welding Methods 0.000 abstract description 19
- 238000000034 method Methods 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 20
- 238000005452 bending Methods 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 10
- 230000009471 action Effects 0.000 description 5
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 239000012752 auxiliary agent Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
- H01R4/4809—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
- H01R12/718—Contact members provided on the PCB without an insulating housing
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Abstract
【選択図】図2
Description
前記第1の延出部は、前記第1表面に固定され、前記第1表面における投影が前記第1表面を覆い、
前記第2の延出部は、前記第2表面に固定され、前記第2表面における投影が前記第2表面を覆う。
100 絶縁弾性体
111 第1表面
112 第2表面
113 第3表面
114 第4表面
115 第5表面
116 第6表面
117 貫通孔
118 溝穴
119 内芯部
120 外環部
200 導電性金属シート
211 嵌入部
212 第1延出部
213 第2延出部
214 第1係止爪
215 第2係止爪
300 第1基板
400 第2基板
500 接着剤層
600 金属塗布層
700 導電性両面テープ
Claims (10)
- 絶縁弾性体及び導電性金属シートを含み、
前記導電性金属シートは前記絶縁弾性体に嵌め込まれ、且つ前記絶縁弾性体の一組で対向する対角領域から突出する第1延出部と第2延出部を有し、
前記第1延出部と前記第2延出部は、折り曲げられた後に前記絶縁弾性体の対向する表面に固定される
ことを特徴とする圧接電気コネクタ。 - 前記絶縁性弾性体は、互いに平行な第1表面と第2表面と、前記第1表面と前記第2表面とをそれぞれ接続する第3表面と第4表面とを有し、
前記導電性金属シートは、前記第1表面に垂直な横断面に沿ってZ字型となり、
前記第1の延出部は、前記第1表面に固定され、前記第1表面における投影が前記第1表面を覆い、
前記第2の延出部は、前記第2表面に固定され、前記第2表面における投影が前記第2表面を覆う
ことを特徴とする請求項1に記載の圧着電気コネクタ。 - 前記第1延出部および前記第2延出部は、前記絶縁性弾性体の対角方向に沿って前記絶縁性弾性体から突出し、
好ましくは、前記絶縁性弾性体は、対向して配置される第5表面及び第6表面を含み、
前記第5表面は、前記第1表面と前記第3表面とを接続し、且つ前記第2表面に向かう方向に傾斜し、前記第1延出部は前記第5表面から突出し、
前記第6表面は、前記第2表面と前記第4表面とを接続し、且つ前記第1表面に向かう方向に傾斜し、前記第2延出部は前記第6表面から突出する
ことを特徴とする請求項2に記載の圧着電気コネクタ。 - 前記第1延出部は前記第3表面から突出し、前記第2延出部は前記第4表面から突出している
ことを特徴とする請求項2に記載の圧着電気コネクタ。 - 前記絶縁弾性体に2組の貫通孔が設けられ、
前記2組の貫通孔は、前記絶縁弾性体内に埋設された一部の前記導電性金属シートの両側に位置し、且つ前記貫通孔の軸方向が第1表面及び第3表面に平行である
ことを特徴とする請求項2に記載の圧着電気コネクタ。 - 各組の貫通孔は溝穴を含み、
前記溝穴は、前記絶縁弾性体の他の組で対向する対角領域の縁に開口し、
好ましくは、前記第1延出部の前記第3表面から離れる端部に第1係止爪が設けられ、前記第1係止爪はそれに近い前記溝穴に係止されて接続され、
前記第2延出部の前記第4表面から離れる端部に第2係止爪が設けられ、前記第2係止爪はそれに近い前記溝穴に係止されて接続される
ことを特徴とする請求項5に記載の圧着電気コネクタ。 - 前記第1延出部及び前記第2延出部は、前記絶縁性弾性体の対向する表面に接着剤層を介して固定され、
好ましくは、前記接着剤層は、液状のシリカゲルを熱硬化させることにより形成される
ことを特徴とする請求項1~6のいずれか1項に記載の圧着電気コネクタ。 - 前記導電性金属シートは、前記絶縁弾性体と一体に射出成形される
ことを特徴とする請求項1~6のいずれか1項に記載の圧接電気コネクタ。 - 前記第1延出部及び第2延出部の前記絶縁性弾性体から離れる側には、前記導電性金属シートよりも導電性の高い金属塗布層が設けられ、
好ましくは、前記導電性金属シートは、銅シート、鉄シート、又はステンレスシートである
ことを特徴とする請求項1~6のいずれか1項に記載の圧着電気コネクタ。 - 前記絶縁性弾性体は、弾性を有する熱硬化性樹脂部材及び/又は熱可塑性弾性部材であり、
好ましくは、前記熱硬化性樹脂部材は、シリコーン樹脂部材であり、
好ましくは、前記熱可塑性弾性部材は、スチレン系、オレフィン系、ポリエーテルエステル系、ポリウレタン系、ポリアミド系または塩化ビニル系の弾性部材であり、
好ましくは、前記第1延出部または前記第2延出部の前記絶縁弾性体から離れる側に導電性両面テープが設けられ、及び/又は
前記絶縁弾性体は、熱可塑性弾性部材である内芯部と、前記内芯部を囲んで熱硬化性樹脂部材とする外環部と有する
ことを特徴とする請求項1~6のいずれか1項に記載の圧着電気コネクタ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911181567.2 | 2019-11-27 | ||
CN201911181567.2A CN110957603A (zh) | 2019-11-27 | 2019-11-27 | 压接电连接器 |
PCT/CN2020/073615 WO2021103310A1 (zh) | 2019-11-27 | 2020-01-21 | 压接电连接器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022524020A true JP2022524020A (ja) | 2022-04-27 |
JP7239730B2 JP7239730B2 (ja) | 2023-03-14 |
Family
ID=73785311
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021552761A Active JP7239730B2 (ja) | 2019-11-27 | 2020-01-21 | 圧着電気コネクタ |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7239730B2 (ja) |
KR (1) | KR20220071978A (ja) |
CN (1) | CN112106258B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117039575A (zh) * | 2023-08-11 | 2023-11-10 | 深圳市宇盛光电有限公司 | 铜排表面处理遮蔽治具 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63502786A (ja) * | 1986-01-15 | 1988-10-13 | サーキュイット・コンポーネンツ・インコーポレーテッド | 電気回路板相互接続器 |
US6224396B1 (en) * | 1997-07-23 | 2001-05-01 | International Business Machines Corporation | Compliant, surface-mountable interposer |
JP2004047166A (ja) * | 2002-07-09 | 2004-02-12 | Fujitsu Component Ltd | コネクタ及びこれを使用してなるモジュール |
JP2008176973A (ja) * | 2007-01-17 | 2008-07-31 | Matsushita Electric Ind Co Ltd | 接合部材および電子機器 |
JP2015118740A (ja) * | 2013-12-16 | 2015-06-25 | アイシン精機株式会社 | 静電気保護装置 |
JP2016091864A (ja) * | 2014-11-06 | 2016-05-23 | 北川工業株式会社 | 導電部材 |
US20160352032A1 (en) * | 2015-05-26 | 2016-12-01 | Samsung Electronics Co., Ltd. | Electronic device |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5555985U (ja) * | 1978-10-12 | 1980-04-16 | ||
US4793814A (en) * | 1986-07-21 | 1988-12-27 | Rogers Corporation | Electrical circuit board interconnect |
JPH06325810A (ja) * | 1993-03-08 | 1994-11-25 | Whitaker Corp:The | コンタクトモジュール及びそれを使用するピングリッドアレイ |
US20070054512A1 (en) * | 2005-09-08 | 2007-03-08 | International Business Machines Corporation | Topography compensating land grid array interposer |
US7579826B2 (en) * | 2006-12-29 | 2009-08-25 | Soo Ho Lee | Test socket for semiconductor |
FR2923954B1 (fr) * | 2007-11-20 | 2010-02-26 | Schneider Electric Ind Sas | Connexion blindee de deux bornes par contact entre interfaces planes. |
KR100955493B1 (ko) * | 2008-02-18 | 2010-04-30 | 이수호 | 웨이퍼 프로빙 검사용 프로브 카드의 프로브 블록 구조 |
CN207124310U (zh) * | 2017-06-16 | 2018-03-20 | 番禺得意精密电子工业有限公司 | 电连接装置 |
TWI655891B (zh) * | 2018-03-08 | 2019-04-01 | 綠點高新科技股份有限公司 | 電子模組及其製造方法及電子裝置的殼體及其製造方法 |
CN208461005U (zh) * | 2018-06-07 | 2019-02-01 | 东莞市三基电子有限公司 | 一种便捷式夹线固定端子座 |
CN208723959U (zh) * | 2018-09-25 | 2019-04-09 | 苏州昀冢电子科技有限公司 | 一种具有电子元件的基座及音圈马达 |
-
2020
- 2020-01-21 CN CN202080002615.1A patent/CN112106258B/zh active Active
- 2020-01-21 JP JP2021552761A patent/JP7239730B2/ja active Active
- 2020-01-21 KR KR1020227015735A patent/KR20220071978A/ko not_active Application Discontinuation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63502786A (ja) * | 1986-01-15 | 1988-10-13 | サーキュイット・コンポーネンツ・インコーポレーテッド | 電気回路板相互接続器 |
US6224396B1 (en) * | 1997-07-23 | 2001-05-01 | International Business Machines Corporation | Compliant, surface-mountable interposer |
JP2004047166A (ja) * | 2002-07-09 | 2004-02-12 | Fujitsu Component Ltd | コネクタ及びこれを使用してなるモジュール |
JP2008176973A (ja) * | 2007-01-17 | 2008-07-31 | Matsushita Electric Ind Co Ltd | 接合部材および電子機器 |
JP2015118740A (ja) * | 2013-12-16 | 2015-06-25 | アイシン精機株式会社 | 静電気保護装置 |
JP2016091864A (ja) * | 2014-11-06 | 2016-05-23 | 北川工業株式会社 | 導電部材 |
US20160352032A1 (en) * | 2015-05-26 | 2016-12-01 | Samsung Electronics Co., Ltd. | Electronic device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117039575A (zh) * | 2023-08-11 | 2023-11-10 | 深圳市宇盛光电有限公司 | 铜排表面处理遮蔽治具 |
CN117039575B (zh) * | 2023-08-11 | 2024-05-10 | 深圳市宇盛光电有限公司 | 铜排表面处理遮蔽治具 |
Also Published As
Publication number | Publication date |
---|---|
CN112106258A (zh) | 2020-12-18 |
KR20220071978A (ko) | 2022-05-31 |
CN112106258B (zh) | 2023-01-31 |
JP7239730B2 (ja) | 2023-03-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20140144765A1 (en) | Pcb tact switch | |
TW201543754A (zh) | 通訊系統之纜線連接器組件 | |
KR101219004B1 (ko) | 통신 단말기 및 그 제조 방법 | |
WO2021103310A1 (zh) | 压接电连接器 | |
CN109065223B (zh) | 一种信号传输线及其制作方法、终端设备 | |
JP2010283008A (ja) | 電磁波シールドガスケット | |
JP2022524020A (ja) | 圧着電気コネクタ | |
CN107017494B (zh) | 压接连接器、压接连接器的制造方法 | |
CN101192473B (zh) | 表面安装型电解电容器及其制造方法 | |
KR20200142453A (ko) | 부착 강도가 향상된 솔더링이 가능한 전기전도성 개스킷 | |
CN106332479B (zh) | 移动终端、壳体组件及其制造方法 | |
US11373826B2 (en) | Breaker and safety circuit equipped with the same | |
JP6116798B2 (ja) | 構造物および構造物の製造方法 | |
CN111180909B (zh) | 压接电连接器 | |
KR20110096597A (ko) | 세라믹 전자부품 | |
CN111193115B (zh) | 压接电连接器 | |
KR101394459B1 (ko) | 안테나 구조체 및 이의 제조 방법 | |
JP2012034167A (ja) | フィルムアンテナおよびその製造方法 | |
EP3293951A1 (en) | Mobile terminal, housing assembly, and method for manufacturing the same | |
CN205751898U (zh) | 一种触动开关 | |
KR20090063939A (ko) | 내장형 안테나 제조 방법 | |
JP2007123308A (ja) | チョークコイル | |
JP2011171459A (ja) | コイル部品 | |
CN109004396B (zh) | 弹性导电端子及其制造方法 | |
JP2008176973A (ja) | 接合部材および電子機器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210903 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210903 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20220825 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220913 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20221205 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230207 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230302 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7239730 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |