JP2022522424A5 - - Google Patents

Info

Publication number
JP2022522424A5
JP2022522424A5 JP2021549626A JP2021549626A JP2022522424A5 JP 2022522424 A5 JP2022522424 A5 JP 2022522424A5 JP 2021549626 A JP2021549626 A JP 2021549626A JP 2021549626 A JP2021549626 A JP 2021549626A JP 2022522424 A5 JP2022522424 A5 JP 2022522424A5
Authority
JP
Japan
Prior art keywords
stamp
layer
substrate
resist
ultraviolet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021549626A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022522424A (ja
Filing date
Publication date
Priority claimed from US16/290,635 external-priority patent/US20200278605A1/en
Application filed filed Critical
Publication of JP2022522424A publication Critical patent/JP2022522424A/ja
Publication of JP2022522424A5 publication Critical patent/JP2022522424A5/ja
Pending legal-status Critical Current

Links

JP2021549626A 2019-03-01 2020-02-28 スタンプの生成及び硬化のための方法及び装置 Pending JP2022522424A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/290,635 US20200278605A1 (en) 2019-03-01 2019-03-01 Method and apparatus for stamp generation and curing
US16/290,635 2019-03-01
PCT/US2020/020468 WO2020180718A1 (en) 2019-03-01 2020-02-28 Method and apparatus for stamp generation and curing

Publications (2)

Publication Number Publication Date
JP2022522424A JP2022522424A (ja) 2022-04-19
JP2022522424A5 true JP2022522424A5 (enExample) 2023-03-08

Family

ID=72236252

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021549626A Pending JP2022522424A (ja) 2019-03-01 2020-02-28 スタンプの生成及び硬化のための方法及び装置

Country Status (6)

Country Link
US (2) US20200278605A1 (enExample)
EP (1) EP3931638A4 (enExample)
JP (1) JP2022522424A (enExample)
KR (1) KR20210124495A (enExample)
CN (1) CN113508336A (enExample)
WO (1) WO2020180718A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022108922A1 (en) * 2020-11-18 2022-05-27 Applied Materials, Inc. Imprint compositions with passivated nanoparticles and materials and processes for making the same
CA3237104A1 (en) * 2021-11-15 2023-05-19 Jan Matthijs Ter Meulen Imprinting process
US20240168207A1 (en) * 2022-11-23 2024-05-23 Google Llc Fabrication of slanted grating master and working stamp using grayscale lithography and plasma etching
US12572067B2 (en) 2023-03-23 2026-03-10 International Business Machines Corporation Guiding structures for fabrication of angled features in a semiconductor device
US12558835B1 (en) 2023-03-23 2026-02-24 International Business Machines Corporation Fabrication of asymmetric mandrel structures in semiconductor device
US20240319584A1 (en) * 2023-03-23 2024-09-26 International Business Machines Corporation Fabrication of angled mandrel structures in semiconductor device
CN117706667A (zh) * 2023-12-13 2024-03-15 深圳珑璟光电科技有限公司 光栅结构制作方法、光波导和近眼显示装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0580530A (ja) * 1991-09-24 1993-04-02 Hitachi Ltd 薄膜パターン製造方法
DE69524247T2 (de) * 1995-08-04 2002-08-08 International Business Machines Corp., Armonk Stempel für lithographie-verfahren
US6387787B1 (en) * 2001-03-02 2002-05-14 Motorola, Inc. Lithographic template and method of formation and use
US6653030B2 (en) * 2002-01-23 2003-11-25 Hewlett-Packard Development Company, L.P. Optical-mechanical feature fabrication during manufacture of semiconductors and other micro-devices and nano-devices that include micron and sub-micron features
US6943117B2 (en) * 2003-03-27 2005-09-13 Korea Institute Of Machinery & Materials UV nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization
KR100566700B1 (ko) * 2004-01-15 2006-04-03 삼성전자주식회사 반도체 공정에서 포토레지스트 패턴 형성 방법,포토레지스트 패턴 형성용 템플레이트 및 이의 제조 방법.
KR101413233B1 (ko) * 2007-09-14 2014-06-30 삼성전자 주식회사 나노 임프린트 리소그래피 공정
JP2010245130A (ja) * 2009-04-01 2010-10-28 Jsr Corp スタンパ及びこれを用いた光インプリントリソグラフィ方法
JP2010287625A (ja) * 2009-06-09 2010-12-24 Toshiba Corp テンプレート及びパターン形成方法
KR100988935B1 (ko) * 2009-10-28 2010-10-20 한국기계연구원 롤 임프린트 장치
RU2695290C2 (ru) * 2014-12-22 2019-07-22 Конинклейке Филипс Н.В. Способ изготовления штампа с рисунком, штамп с рисунком и способ отпечатывания
EP3481562A4 (en) * 2016-07-08 2019-06-26 University of Massachusetts STRUCTURING OF NANOSTRUCTURES WITH IMPRINT LITHOGRAPHY
JP2020515011A (ja) * 2017-03-17 2020-05-21 ユニバーシティ オブ マサチューセッツ ３ｄマイクロバッテリーおよび電極の直接印刷

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