JP2022506485A5 - - Google Patents
Info
- Publication number
- JP2022506485A5 JP2022506485A5 JP2021523881A JP2021523881A JP2022506485A5 JP 2022506485 A5 JP2022506485 A5 JP 2022506485A5 JP 2021523881 A JP2021523881 A JP 2021523881A JP 2021523881 A JP2021523881 A JP 2021523881A JP 2022506485 A5 JP2022506485 A5 JP 2022506485A5
- Authority
- JP
- Japan
- Prior art keywords
- defects
- images
- defect
- image
- product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862754880P | 2018-11-02 | 2018-11-02 | |
| US62/754,880 | 2018-11-02 | ||
| US16/572,971 | 2019-09-17 | ||
| US16/572,971 US11468553B2 (en) | 2018-11-02 | 2019-09-17 | System and method for determining type and size of defects on blank reticles |
| PCT/US2019/059291 WO2020092856A1 (en) | 2018-11-02 | 2019-11-01 | System and method for determining type and size of defects on blank reticles |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022506485A JP2022506485A (ja) | 2022-01-17 |
| JP2022506485A5 true JP2022506485A5 (https=) | 2022-10-27 |
| JP7355817B2 JP7355817B2 (ja) | 2023-10-03 |
Family
ID=70458860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021523881A Active JP7355817B2 (ja) | 2018-11-02 | 2019-11-01 | ブランクレチクル上の欠陥のタイプおよびサイズを判定するためのシステムおよび方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11468553B2 (https=) |
| JP (1) | JP7355817B2 (https=) |
| KR (2) | KR20210069736A (https=) |
| CN (1) | CN112955732B (https=) |
| IL (1) | IL282249B2 (https=) |
| TW (1) | TWI805857B (https=) |
| WO (1) | WO2020092856A1 (https=) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11568331B2 (en) * | 2011-09-26 | 2023-01-31 | Open Text Corporation | Methods and systems for providing automated predictive analysis |
| US11380516B2 (en) | 2017-04-13 | 2022-07-05 | Fractilia, Llc | System and method for generating and analyzing roughness measurements and their use for process monitoring and control |
| US10176966B1 (en) | 2017-04-13 | 2019-01-08 | Fractilia, Llc | Edge detection system |
| US10522322B2 (en) | 2017-04-13 | 2019-12-31 | Fractilia, Llc | System and method for generating and analyzing roughness measurements |
| US12142454B2 (en) | 2017-04-13 | 2024-11-12 | Fractilla, LLC | Detection of probabilistic process windows |
| US11580289B2 (en) * | 2018-11-30 | 2023-02-14 | Asml Netherlands B.V. | Method for determining patterning device pattern based on manufacturability |
| US20210133670A1 (en) | 2019-11-05 | 2021-05-06 | Strong Force Vcn Portfolio 2019, Llc | Control tower and enterprise management platform with a machine learning/artificial intelligence managing sensor and the camera feeds into digital twin |
| AU2020379834A1 (en) | 2019-11-05 | 2022-06-09 | Strong Force Vcn Portfolio 2019, Llc | Control tower and enterprise management platform for value chain networks |
| WO2021092260A1 (en) | 2019-11-05 | 2021-05-14 | Strong Force Vcn Portfolio 2019, Llc | Control tower and enterprise management platform for value chain networks |
| US11769242B2 (en) | 2020-05-21 | 2023-09-26 | Kla Corporation | Mode selection and defect detection training |
| US11774371B2 (en) | 2020-05-22 | 2023-10-03 | Kla Corporation | Defect size measurement using deep learning methods |
| US11900589B2 (en) * | 2020-05-29 | 2024-02-13 | Boe Technology Group Co., Ltd. | Detection device of display panel and detection method thereof, electronic device and readable medium |
| WO2021243360A1 (en) * | 2020-05-29 | 2021-12-02 | Lam Research Corporation | Automated visual-inspection system |
| US11328410B2 (en) * | 2020-08-03 | 2022-05-10 | KLA Corp. | Deep generative models for optical or other mode selection |
| EP3961335B1 (en) * | 2020-08-28 | 2024-07-17 | Siemens Aktiengesellschaft | System, apparatus and method for estimating remaining useful life of a bearing |
| CN112085722B (zh) * | 2020-09-07 | 2024-04-09 | 凌云光技术股份有限公司 | 一种训练样本图像获取方法及装置 |
| US20220122038A1 (en) * | 2020-10-20 | 2022-04-21 | Kyndryl, Inc. | Process Version Control for Business Process Management |
| US20220270212A1 (en) * | 2021-02-25 | 2022-08-25 | Kla Corporation | Methods for improving optical inspection and metrology image quality using chip design data |
| CN113109369A (zh) * | 2021-05-22 | 2021-07-13 | 盐城市盐都区荣海实验器材厂 | 一种载玻片的生产制备工艺 |
| US12026680B2 (en) * | 2021-09-01 | 2024-07-02 | Caterpillar Inc. | System and method for inferring machine failure, estimating when the machine will be repaired, and computing an optimal solution |
| CN113850766B (zh) * | 2021-09-10 | 2024-10-22 | 浙江博星工贸有限公司 | 凸轮轴表面缺陷检测方法、装置及计算机可读存储介质 |
| US20230153843A1 (en) * | 2021-11-12 | 2023-05-18 | Oracle International Corporation | System to combine intelligence from multiple sources that use disparate data sets |
| US12586171B2 (en) * | 2021-11-17 | 2026-03-24 | Communications Test Design, Inc. | Methods and systems for grading devices |
| TWI799083B (zh) * | 2022-01-14 | 2023-04-11 | 合晶科技股份有限公司 | 自動光學缺陷檢測裝置及方法 |
| JP2023129970A (ja) * | 2022-03-07 | 2023-09-20 | セイコーエプソン株式会社 | 印刷画像の欠陥判別装置、およびその判別方法 |
| US12406372B2 (en) * | 2022-05-10 | 2025-09-02 | Canon Medical Systems Corporation | Image processing apparatus, a method of processing image data, and a computer program product |
| US12581914B2 (en) * | 2022-06-09 | 2026-03-17 | Onto Innovation Inc. | Optical metrology with nuisance feature mitigation |
| WO2024091840A1 (en) * | 2022-10-25 | 2024-05-02 | PTO Genius, LLC | Systems and methods for exhaustion mitigation and organization optimization |
| CN115713487A (zh) * | 2022-10-26 | 2023-02-24 | 上海船舶工艺研究所(中国船舶集团有限公司第十一研究所) | 用于x射线焊缝图像的缺陷识别方法、设备和存储介质 |
| US20240144464A1 (en) * | 2022-10-28 | 2024-05-02 | Applied Materials, Inc. | Classification of defect patterns of substrates |
| JPWO2024181209A1 (https=) * | 2023-02-27 | 2024-09-06 | ||
| DE102023108878A1 (de) | 2023-04-06 | 2024-10-10 | Audi Aktiengesellschaft | Verfahren und Vorrichtung zum Prüfen einer flexiblen Leiterplatte, insbesondere bei Herstellung, auf Fehler |
| US12586085B2 (en) * | 2023-07-03 | 2026-03-24 | Ebay Inc. | Method for determining authenticity of hanging images and deformation analysis of authenticity of item based on authentication score transgressing authenticity threshold |
| US20250117915A1 (en) * | 2023-10-06 | 2025-04-10 | Applied Materials, Inc. | Optical inspection-based automatic defect classification |
| US20250363617A1 (en) * | 2024-05-24 | 2025-11-27 | Kla Corporation | System and method for defect detection using deep learning-based image segmentation |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5161052B2 (ja) | 2008-12-04 | 2013-03-13 | オリンパス株式会社 | 顕微鏡システム、標本観察方法およびプログラム |
| US20040081350A1 (en) | 1999-08-26 | 2004-04-29 | Tadashi Kitamura | Pattern inspection apparatus and method |
| US6999614B1 (en) * | 1999-11-29 | 2006-02-14 | Kla-Tencor Corporation | Power assisted automatic supervised classifier creation tool for semiconductor defects |
| US6798515B1 (en) * | 2001-11-29 | 2004-09-28 | Cognex Technology And Investment Corporation | Method for calculating a scale relationship for an imaging system |
| US7162073B1 (en) | 2001-11-30 | 2007-01-09 | Cognex Technology And Investment Corporation | Methods and apparatuses for detecting classifying and measuring spot defects in an image of an object |
| US9002497B2 (en) | 2003-07-03 | 2015-04-07 | Kla-Tencor Technologies Corp. | Methods and systems for inspection of wafers and reticles using designer intent data |
| JP2007024737A (ja) * | 2005-07-20 | 2007-02-01 | Hitachi High-Technologies Corp | 半導体の欠陥検査装置及びその方法 |
| US7747062B2 (en) * | 2005-11-09 | 2010-06-29 | Kla-Tencor Technologies Corp. | Methods, defect review tools, and systems for locating a defect in a defect review process |
| JP4890096B2 (ja) | 2006-05-19 | 2012-03-07 | 浜松ホトニクス株式会社 | 画像取得装置、画像取得方法、及び画像取得プログラム |
| US20070280526A1 (en) * | 2006-05-30 | 2007-12-06 | Irfan Malik | Determining Information about Defects or Binning Defects Detected on a Wafer after an Immersion Lithography Process is Performed on the Wafer |
| US7831083B1 (en) * | 2006-07-13 | 2010-11-09 | Kla-Tencor Technologies Corporation | Image quality monitoring for substrate inspection |
| US8045145B1 (en) * | 2007-06-06 | 2011-10-25 | Kla-Tencor Technologies Corp. | Systems and methods for acquiring information about a defect on a specimen |
| JP2013072788A (ja) * | 2011-09-28 | 2013-04-22 | Hitachi High-Technologies Corp | 基板表面欠陥検査方法および検査装置 |
| US9775506B2 (en) * | 2012-11-08 | 2017-10-03 | The Johns Hopkins University | System and method for detecting and classifying severity of retinal disease |
| JP5948262B2 (ja) * | 2013-01-30 | 2016-07-06 | 株式会社日立ハイテクノロジーズ | 欠陥観察方法および欠陥観察装置 |
| JP5760066B2 (ja) * | 2013-11-06 | 2015-08-05 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置及び欠陥検査方法 |
| US9401016B2 (en) | 2014-05-12 | 2016-07-26 | Kla-Tencor Corp. | Using high resolution full die image data for inspection |
| US10074036B2 (en) * | 2014-10-21 | 2018-09-11 | Kla-Tencor Corporation | Critical dimension uniformity enhancement techniques and apparatus |
| CN104715481B (zh) * | 2015-03-17 | 2017-07-25 | 西安交通大学 | 基于随机森林的多尺度印刷品缺陷检测方法 |
| US9959599B2 (en) * | 2015-06-18 | 2018-05-01 | Sharp Laboratories Of America, Inc. | System for enhanced images |
| TWI797699B (zh) * | 2015-12-22 | 2023-04-01 | 以色列商應用材料以色列公司 | 半導體試樣的基於深度學習之檢查的方法及其系統 |
| US10043261B2 (en) * | 2016-01-11 | 2018-08-07 | Kla-Tencor Corp. | Generating simulated output for a specimen |
| JP6673122B2 (ja) * | 2016-09-29 | 2020-03-25 | 株式会社Sumco | シリコンウェーハの評価方法、シリコンウェーハ製造工程の評価方法およびシリコンウェーハの製造方法 |
| TWI752100B (zh) * | 2016-10-17 | 2022-01-11 | 美商克萊譚克公司 | 用於訓練檢查相關演算法之系統、非暫時性電腦可讀媒體及電腦實施方法 |
| US11047806B2 (en) | 2016-11-30 | 2021-06-29 | Kla-Tencor Corporation | Defect discovery and recipe optimization for inspection of three-dimensional semiconductor structures |
| US10496781B2 (en) * | 2016-12-19 | 2019-12-03 | Kla Tencor Corporation | Metrology recipe generation using predicted metrology images |
| US10964013B2 (en) | 2017-01-10 | 2021-03-30 | Kla-Tencor Corporation | System, method for training and applying defect classifiers in wafers having deeply stacked layers |
| US10565702B2 (en) * | 2017-01-30 | 2020-02-18 | Dongfang Jingyuan Electron Limited | Dynamic updates for the inspection of integrated circuits |
| JP6705777B2 (ja) * | 2017-07-10 | 2020-06-03 | ファナック株式会社 | 機械学習装置、検査装置及び機械学習方法 |
| US10692203B2 (en) * | 2018-02-19 | 2020-06-23 | International Business Machines Corporation | Measuring defectivity by equipping model-less scatterometry with cognitive machine learning |
| US10733723B2 (en) * | 2018-05-22 | 2020-08-04 | Midea Group Co., Ltd. | Methods and system for improved quality inspection |
| US10706525B2 (en) * | 2018-05-22 | 2020-07-07 | Midea Group Co. Ltd. | Methods and systems for improved quality inspection |
-
2019
- 2019-09-17 US US16/572,971 patent/US11468553B2/en active Active
- 2019-10-09 TW TW108136515A patent/TWI805857B/zh active
- 2019-11-01 IL IL282249A patent/IL282249B2/en unknown
- 2019-11-01 WO PCT/US2019/059291 patent/WO2020092856A1/en not_active Ceased
- 2019-11-01 CN CN201980072399.5A patent/CN112955732B/zh active Active
- 2019-11-01 JP JP2021523881A patent/JP7355817B2/ja active Active
- 2019-11-01 KR KR1020217016889A patent/KR20210069736A/ko not_active Ceased
- 2019-11-01 KR KR1020237034866A patent/KR20230147764A/ko active Pending
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