TWI805857B - 用於特性化一樣品之系統及方法 - Google Patents
用於特性化一樣品之系統及方法 Download PDFInfo
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- TWI805857B TWI805857B TW108136515A TW108136515A TWI805857B TW I805857 B TWI805857 B TW I805857B TW 108136515 A TW108136515 A TW 108136515A TW 108136515 A TW108136515 A TW 108136515A TW I805857 B TWI805857 B TW I805857B
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/20—Analysing
- G06F18/24—Classification techniques
- G06F18/241—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches
- G06F18/2413—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches based on distances to training or reference patterns
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/20—Analysing
- G06F18/24—Classification techniques
- G06F18/243—Classification techniques relating to the number of classes
- G06F18/2431—Multiple classes
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N20/00—Machine learning
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N20/00—Machine learning
- G06N20/10—Machine learning using kernel methods, e.g. support vector machines [SVM]
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N20/00—Machine learning
- G06N20/20—Ensemble learning
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/045—Combinations of networks
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/0464—Convolutional networks [CNN, ConvNet]
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/08—Learning methods
- G06N3/09—Supervised learning
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N5/00—Computing arrangements using knowledge-based models
- G06N5/01—Dynamic search techniques; Heuristics; Dynamic trees; Branch-and-bound
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T3/00—Geometric image transformations in the plane of the image
- G06T3/40—Scaling of whole images or parts thereof, e.g. expanding or contracting
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T5/00—Image enhancement or restoration
- G06T5/73—Deblurring; Sharpening
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/60—Analysis of geometric attributes
- G06T7/62—Analysis of geometric attributes of area, perimeter, diameter or volume
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
- G06V10/77—Processing image or video features in feature spaces; using data integration or data reduction, e.g. principal component analysis [PCA] or independent component analysis [ICA] or self-organising maps [SOM]; Blind source separation
- G06V10/776—Validation; Performance evaluation
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V20/00—Scenes; Scene-specific elements
- G06V20/60—Type of objects
- G06V20/69—Microscopic objects, e.g. biological cells or cellular parts
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8883—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges involving the calculation of gauges, generating models
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95676—Masks, reticles, shadow masks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/12—Circuits of general importance; Signal processing
- G01N2201/129—Using chemometrical methods
- G01N2201/1296—Using chemometrical methods using neural networks
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10024—Color image
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10056—Microscopic image
- G06T2207/10061—Microscopic image from scanning electron microscope
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20036—Morphological image processing
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20081—Training; Learning
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20084—Artificial neural networks [ANN]
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V2201/00—Indexing scheme relating to image or video recognition or understanding
- G06V2201/02—Recognising information on displays, dials, clocks
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Software Systems (AREA)
- Data Mining & Analysis (AREA)
- Artificial Intelligence (AREA)
- Evolutionary Computation (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Engineering & Computer Science (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Computing Systems (AREA)
- Mathematical Physics (AREA)
- Medical Informatics (AREA)
- Multimedia (AREA)
- Molecular Biology (AREA)
- Biomedical Technology (AREA)
- Quality & Reliability (AREA)
- Chemical & Material Sciences (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Immunology (AREA)
- Computational Linguistics (AREA)
- Bioinformatics & Computational Biology (AREA)
- Evolutionary Biology (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Biophysics (AREA)
- Databases & Information Systems (AREA)
- Geometry (AREA)
- Signal Processing (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Image Analysis (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Image Processing (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862754880P | 2018-11-02 | 2018-11-02 | |
| US62/754,880 | 2018-11-02 | ||
| US16/572,971 | 2019-09-17 | ||
| US16/572,971 US11468553B2 (en) | 2018-11-02 | 2019-09-17 | System and method for determining type and size of defects on blank reticles |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202029071A TW202029071A (zh) | 2020-08-01 |
| TWI805857B true TWI805857B (zh) | 2023-06-21 |
Family
ID=70458860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108136515A TWI805857B (zh) | 2018-11-02 | 2019-10-09 | 用於特性化一樣品之系統及方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11468553B2 (https=) |
| JP (1) | JP7355817B2 (https=) |
| KR (2) | KR20210069736A (https=) |
| CN (1) | CN112955732B (https=) |
| IL (1) | IL282249B2 (https=) |
| TW (1) | TWI805857B (https=) |
| WO (1) | WO2020092856A1 (https=) |
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| US12142454B2 (en) | 2017-04-13 | 2024-11-12 | Fractilla, LLC | Detection of probabilistic process windows |
| US10176966B1 (en) | 2017-04-13 | 2019-01-08 | Fractilia, Llc | Edge detection system |
| US11380516B2 (en) | 2017-04-13 | 2022-07-05 | Fractilia, Llc | System and method for generating and analyzing roughness measurements and their use for process monitoring and control |
| KR102610060B1 (ko) * | 2018-11-30 | 2023-12-06 | 에이에스엠엘 네델란즈 비.브이. | 제조성에 기초한 패터닝 디바이스 패턴을 결정하기 위한 방법 |
| AU2020379834A1 (en) | 2019-11-05 | 2022-06-09 | Strong Force Vcn Portfolio 2019, Llc | Control tower and enterprise management platform for value chain networks |
| US20210133670A1 (en) | 2019-11-05 | 2021-05-06 | Strong Force Vcn Portfolio 2019, Llc | Control tower and enterprise management platform with a machine learning/artificial intelligence managing sensor and the camera feeds into digital twin |
| WO2021092260A1 (en) | 2019-11-05 | 2021-05-14 | Strong Force Vcn Portfolio 2019, Llc | Control tower and enterprise management platform for value chain networks |
| US11769242B2 (en) | 2020-05-21 | 2023-09-26 | Kla Corporation | Mode selection and defect detection training |
| US11774371B2 (en) | 2020-05-22 | 2023-10-03 | Kla Corporation | Defect size measurement using deep learning methods |
| CN114175093A (zh) * | 2020-05-29 | 2022-03-11 | 京东方科技集团股份有限公司 | 显示面板的检测装置、检测方法、电子装置、可读介质 |
| WO2021243360A1 (en) * | 2020-05-29 | 2021-12-02 | Lam Research Corporation | Automated visual-inspection system |
| US11328410B2 (en) | 2020-08-03 | 2022-05-10 | KLA Corp. | Deep generative models for optical or other mode selection |
| EP3961335B1 (en) * | 2020-08-28 | 2024-07-17 | Siemens Aktiengesellschaft | System, apparatus and method for estimating remaining useful life of a bearing |
| CN112085722B (zh) * | 2020-09-07 | 2024-04-09 | 凌云光技术股份有限公司 | 一种训练样本图像获取方法及装置 |
| US20220122038A1 (en) * | 2020-10-20 | 2022-04-21 | Kyndryl, Inc. | Process Version Control for Business Process Management |
| US20220270212A1 (en) * | 2021-02-25 | 2022-08-25 | Kla Corporation | Methods for improving optical inspection and metrology image quality using chip design data |
| CN113109369A (zh) * | 2021-05-22 | 2021-07-13 | 盐城市盐都区荣海实验器材厂 | 一种载玻片的生产制备工艺 |
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| CN113850766B (zh) * | 2021-09-10 | 2024-10-22 | 浙江博星工贸有限公司 | 凸轮轴表面缺陷检测方法、装置及计算机可读存储介质 |
| US20230153843A1 (en) * | 2021-11-12 | 2023-05-18 | Oracle International Corporation | System to combine intelligence from multiple sources that use disparate data sets |
| US12586171B2 (en) * | 2021-11-17 | 2026-03-24 | Communications Test Design, Inc. | Methods and systems for grading devices |
| TWI799083B (zh) * | 2022-01-14 | 2023-04-11 | 合晶科技股份有限公司 | 自動光學缺陷檢測裝置及方法 |
| JP2023129970A (ja) * | 2022-03-07 | 2023-09-20 | セイコーエプソン株式会社 | 印刷画像の欠陥判別装置、およびその判別方法 |
| US12406372B2 (en) * | 2022-05-10 | 2025-09-02 | Canon Medical Systems Corporation | Image processing apparatus, a method of processing image data, and a computer program product |
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- 2019-11-01 IL IL282249A patent/IL282249B2/en unknown
- 2019-11-01 KR KR1020237034866A patent/KR20230147764A/ko active Pending
- 2019-11-01 JP JP2021523881A patent/JP7355817B2/ja active Active
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- 2019-11-01 CN CN201980072399.5A patent/CN112955732B/zh active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| IL282249A (en) | 2021-05-31 |
| JP7355817B2 (ja) | 2023-10-03 |
| KR20230147764A (ko) | 2023-10-23 |
| JP2022506485A (ja) | 2022-01-17 |
| KR20210069736A (ko) | 2021-06-11 |
| CN112955732B (zh) | 2024-08-20 |
| TW202029071A (zh) | 2020-08-01 |
| WO2020092856A1 (en) | 2020-05-07 |
| IL282249B1 (en) | 2024-10-01 |
| IL282249B2 (en) | 2025-02-01 |
| US20200143528A1 (en) | 2020-05-07 |
| US11468553B2 (en) | 2022-10-11 |
| CN112955732A (zh) | 2021-06-11 |
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