JP2022181820A5 - - Google Patents

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Publication number
JP2022181820A5
JP2022181820A5 JP2021088991A JP2021088991A JP2022181820A5 JP 2022181820 A5 JP2022181820 A5 JP 2022181820A5 JP 2021088991 A JP2021088991 A JP 2021088991A JP 2021088991 A JP2021088991 A JP 2021088991A JP 2022181820 A5 JP2022181820 A5 JP 2022181820A5
Authority
JP
Japan
Prior art keywords
wiring
predetermined direction
metal body
insulating substrates
surface metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021088991A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022181820A (ja
JP7585969B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2021088991A priority Critical patent/JP7585969B2/ja
Priority claimed from JP2021088991A external-priority patent/JP7585969B2/ja
Priority to PCT/JP2022/018371 priority patent/WO2022249811A1/ja
Publication of JP2022181820A publication Critical patent/JP2022181820A/ja
Publication of JP2022181820A5 publication Critical patent/JP2022181820A5/ja
Priority to JP2024193985A priority patent/JP7736147B2/ja
Application granted granted Critical
Publication of JP7585969B2 publication Critical patent/JP7585969B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2021088991A 2021-05-27 2021-05-27 半導体装置 Active JP7585969B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021088991A JP7585969B2 (ja) 2021-05-27 2021-05-27 半導体装置
PCT/JP2022/018371 WO2022249811A1 (ja) 2021-05-27 2022-04-21 半導体装置
JP2024193985A JP7736147B2 (ja) 2021-05-27 2024-11-05 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021088991A JP7585969B2 (ja) 2021-05-27 2021-05-27 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024193985A Division JP7736147B2 (ja) 2021-05-27 2024-11-05 半導体装置

Publications (3)

Publication Number Publication Date
JP2022181820A JP2022181820A (ja) 2022-12-08
JP2022181820A5 true JP2022181820A5 (cg-RX-API-DMAC7.html) 2023-03-09
JP7585969B2 JP7585969B2 (ja) 2024-11-19

Family

ID=84228689

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021088991A Active JP7585969B2 (ja) 2021-05-27 2021-05-27 半導体装置
JP2024193985A Active JP7736147B2 (ja) 2021-05-27 2024-11-05 半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024193985A Active JP7736147B2 (ja) 2021-05-27 2024-11-05 半導体装置

Country Status (2)

Country Link
JP (2) JP7585969B2 (cg-RX-API-DMAC7.html)
WO (1) WO2022249811A1 (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7400774B2 (ja) 2021-05-27 2023-12-19 株式会社デンソー 半導体装置
JP7512954B2 (ja) 2021-05-27 2024-07-09 株式会社デンソー 半導体装置
JP7552503B2 (ja) 2021-05-27 2024-09-18 株式会社デンソー 半導体装置
JP7509084B2 (ja) 2021-05-27 2024-07-02 株式会社デンソー 半導体装置
JP7400773B2 (ja) 2021-05-27 2023-12-19 株式会社デンソー 半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012146760A (ja) * 2011-01-11 2012-08-02 Calsonic Kansei Corp パワー半導体モジュール
JP2013219290A (ja) * 2012-04-12 2013-10-24 Panasonic Corp 半導体装置
JP6319137B2 (ja) * 2015-02-26 2018-05-09 株式会社デンソー 半導体装置及びその製造方法
JP6908012B2 (ja) * 2018-10-01 2021-07-21 株式会社デンソー 半導体モジュール
JP7248133B2 (ja) * 2019-09-13 2023-03-29 株式会社デンソー 半導体装置

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