JP2022163028A - カメラモジュール及びこれを含む光学機器 - Google Patents
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Abstract
Description
Claims (18)
- 基板と、
光感知素子及び複数の発光ダイオードを含む面発光レーザー(Vertical Cavity Surface Emitting Laser)を含む発光部と、
レンズバレル及びイメージセンサーを含む受光部と、
前記発光部を収容するケースと、
前記ケースに結合され、前記発光ダイオード上に配置される拡散部と、
前記基板及び前記イメージセンサーと結合される回路基板と、
前記発光部と前記基板を電気的に連結する第1ワイヤと、
前記基板と前記回路基板を電気的に連結する第2ワイヤと、を含み、
前記発光部は、前記基板の上面に配置され、前記基板から前記拡散部の方向に突出する側壁を含み、
前記側壁は、前記基板の前記上面の辺のいずれか一辺で開放する開口を有する、深さ情報測定カメラ。 - 前記ケースは、前記受光部を収容する、請求項1に記載の深さ情報測定カメラ。
- 前記ケースは、前記回路基板と結合され、
前記拡散部は、前記発光部から離隔している、請求項1又は2に記載の深さ情報測定カメラ。 - 前記基板と前記イメージセンサーは、前記回路基板の上面に付着される、請求項1~3のいずれか一項に記載の深さ情報測定カメラ。
- 前記回路基板の下に配置され、前記回路基板と結合される金属材の補強部材をさらに含む、請求項1~4のいずれか一項に記載の深さ情報測定カメラ。
- 前記回路基板は、前記イメージセンサーが配置される第2開口を含み、
前記イメージセンサーは、前記補強部材と結合される、請求項5に記載の深さ情報測定カメラ。 - 前記ケースは、
前記発光部を収容する第1ケースと、
前記受光部を収容する第2ケースと、を含み、
前記第1ケースと前記第2ケースは、互いに離隔しており、
前記拡散部は、前記第1ケースに結合され、
前記回路基板は、
前記第1ケースの下に配置される第1回路基板と、
前記第2ケースの下に配置され、前記第1回路基板から離隔している第2回路基板と、を含み、
前記基板は、前記第1回路基板上に配置され、
前記イメージセンサーは、前記第2回路基板上に配置される、請求項1~6のいずれか一項に記載の深さ情報測定カメラ。 - 前記側壁は、
前記基板の第1短辺に隣接して配置される第1側壁と、
前記基板の前記第1短辺の反対側に位置する第2短辺に隣接して配置される第2側壁と、を含み、
前記側壁の前記開口は、前記第1短辺と前記第2短辺との間に位置する前記基板の第1長辺で開放する、請求項1~7のいずれか一項に記載の深さ情報測定カメラ。 - 前記基板の前記上面から前記側壁の上端までの高さは、前記発光ダイオードの上面より高い、請求項1~8のいずれか一項に記載の深さ情報測定カメラ。
- 前記回路基板は、前記基板が配置される第1開口を含む、請求項5に記載の深さ情報測定カメラ。
- 前記基板と前記発光ダイオードとの間に配置される導電性接着部材を含む、請求項1~10のいずれか一項に記載の深さ情報測定カメラ。
- 前記拡散部は、ズームレンズ又は液体レンズである、請求項1~11のいずれか一項に記載の深さ情報測定カメラ。
- 前記光感知素子は、フォトダイオードであり、
前記フォトダイオードは、前記発光ダイオードから発生する光を感知する、請求項1~12のいずれか一項に記載の深さ情報測定カメラ。 - 前記基板の厚さは、前記イメージセンサーの厚さより大きい、請求項1~13のいずれか一項に記載の深さ情報測定カメラ。
- 前記レンズバレルは、前記ケースに結合され、
前記イメージセンサーは、前記レンズバレルの下に配置される、請求項1~13のいずれか一項に記載の深さ情報測定カメラ。 - 前記拡散部は、前記発光部から発散される光の画角を変更させる、請求項1~15のいずれか一項に記載の深さ情報測定カメラ。
- 基板及び前記基板上に配置される発光ダイオードを含む発光部と、
レンズバレル及びイメージセンサーを含む受光部と、
前記発光部を収容するケースと、
前記ケースに結合され、前記発光部上に配置される拡散部と、
前記基板及び前記イメージセンサーと結合される回路基板と、を含み、
前記発光部は、前記基板の上面に配置され、前記基板から前記拡散部に向かって突出する側壁を含み、
前記側壁は、前記基板の上面の辺のいずれか一辺で開放する開口を有する、深さ情報測定カメラ。 - 第1回路基板及び前記第1回路基板から分離される第2回路基板と、
前記第1回路基板上に配置される基板と、
前記基板上に配置される発光素子及び光感知素子と、
前記基板と前記発光素子との間に配置される導電性接着部材と、
前記第2回路基板上に配置されるイメージセンサーと、
前記第1回路基板上に配置され、前記基板及び前記発光素子を収容する第1ケースと、
前記第1ケースに配置され、前記発光素子から発散される発散光の画角を変更させる拡散部と、
前記基板の上面に配置され、前記基板から前記拡散部の方向に突出する側壁と、を含み、
前記基板は、AlN基板であり、
前記基板は、第1端子及び第2端子を含み、
前記発光素子は、複数の赤外線発光ダイオードを含む面発光レーザーであり、
前記発光素子は、第1電極及び第2電極を含み、
前記第1電極は、前記基板の第1端子とワイヤを介して連結され、
前記第2電極は、前記基板の第2端子と前記導電性接着部材を介して電気的に連結され、
前記側壁は、前記基板の前記上面の辺のうちのいずれか一辺で開放する開口を有する、深さ情報測定カメラ。
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KR1020180031913A KR102488006B1 (ko) | 2018-03-20 | 2018-03-20 | 카메라 모듈 및 이를 포함하는 광학 기기 |
KR10-2018-0031913 | 2018-03-20 | ||
PCT/KR2019/003095 WO2019182305A1 (ko) | 2018-03-20 | 2019-03-18 | 카메라 모듈 및 이를 포함하는 광학 기기 |
JP2020550145A JP7108043B2 (ja) | 2018-03-20 | 2019-03-18 | カメラモジュール及びこれを含む光学機器 |
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WO2020038179A1 (zh) * | 2018-08-24 | 2020-02-27 | 宁波舜宇光电信息有限公司 | 电路板组件及其半成品、泛光灯、摄像模组及其应用 |
US20230076838A1 (en) * | 2020-02-13 | 2023-03-09 | Lg Innotek Co., Ltd. | Camera module |
WO2021177692A1 (ko) * | 2020-03-03 | 2021-09-10 | 엘지이노텍 주식회사 | 거리 측정 카메라 장치 |
KR20210112822A (ko) * | 2020-03-06 | 2021-09-15 | 엘지이노텍 주식회사 | 카메라 모듈 |
US11543526B2 (en) * | 2020-06-09 | 2023-01-03 | Stmicroelectronics (Research & Development) Limited | Compact depth sensor module |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07159538A (ja) * | 1993-12-07 | 1995-06-23 | Copal Co Ltd | 光照射式測距装置 |
JP2003179093A (ja) * | 2001-12-12 | 2003-06-27 | Nissan Motor Co Ltd | 半導体モジュールの製造方法および半導体モジュール |
JP2004071366A (ja) * | 2002-08-07 | 2004-03-04 | Omron Corp | 光電センサ |
JP2014167387A (ja) * | 2011-06-24 | 2014-09-11 | Sanyo Electric Co Ltd | 物体検出装置および情報取得装置 |
US20150229912A1 (en) * | 2014-02-10 | 2015-08-13 | Microsoft Corporation | Vcsel array for a depth camera |
JP2016534343A (ja) * | 2013-08-14 | 2016-11-04 | フーフ・ヒュルスベック・ウント・フュルスト・ゲーエムベーハー・ウント・コンパニー・カーゲーHuf Hulsbeck & Furst Gmbh & Co. Kg | 自動車の操作ジェスチャを認識するためのセンサ構成 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10214437A (ja) * | 1997-01-31 | 1998-08-11 | Toshiba Corp | 光学ユニット及びその製造方法 |
KR100594149B1 (ko) * | 2004-10-12 | 2006-06-28 | 삼성전자주식회사 | 카메라 렌즈 어셈블리의 손떨림 보정 장치 |
US7821569B2 (en) * | 2006-02-10 | 2010-10-26 | Lumos Technology Co., Ltd. | Converter lens attachment with built-in light source for compact digital camera |
CN101738701A (zh) * | 2008-11-26 | 2010-06-16 | 富士迈半导体精密工业(上海)有限公司 | 摄像装置 |
JP5734236B2 (ja) * | 2011-05-17 | 2015-06-17 | 株式会社新川 | ワイヤボンディング装置及びボンディング方法 |
JP2013041931A (ja) * | 2011-08-12 | 2013-02-28 | Ricoh Co Ltd | 光学素子パッケージ、面発光レーザモジュール、光走査装置及び画像形成装置 |
KR20130086749A (ko) * | 2012-01-26 | 2013-08-05 | 삼성전자주식회사 | 발광다이오드 패키지 및 그 제조방법 |
KR20130127780A (ko) * | 2012-05-15 | 2013-11-25 | 삼성전기주식회사 | 카메라 모듈 |
JP2014017716A (ja) * | 2012-07-10 | 2014-01-30 | Sharp Corp | 半導体装置およびその製造方法、並びに電子情報機器 |
JP2015206590A (ja) | 2012-08-30 | 2015-11-19 | 三洋電機株式会社 | 情報取得装置および物体検出装置 |
JP2014183396A (ja) | 2013-03-18 | 2014-09-29 | Sharp Corp | 撮像装置、および電子機器 |
KR102086077B1 (ko) * | 2013-10-11 | 2020-03-06 | 엘지이노텍 주식회사 | 광학 렌즈 및 이를 구비한 카메라 모듈 |
JP6193099B2 (ja) * | 2013-11-22 | 2017-09-06 | シャープ株式会社 | 受光デバイスおよび樹脂 |
JP6417970B2 (ja) | 2015-01-28 | 2018-11-07 | ミツミ電機株式会社 | モジュール及びその製造方法 |
EP3070514B1 (en) * | 2015-03-19 | 2020-01-15 | LG Innotek Co., Ltd. | Lens moving apparatus, camera module and mobile device including the same |
US10440348B2 (en) * | 2015-03-24 | 2019-10-08 | University Of Florida Research Foundation, Inc. | Optical privatizing device, system and method of use |
DE102016204148A1 (de) * | 2016-03-14 | 2017-09-14 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Multiaperturabbildungsvorrichtung, Abbildungssystem und Verfahren zum Erfassen eines Objektbereichs |
US11226402B2 (en) * | 2016-06-09 | 2022-01-18 | Ams Sensors Singapore Pte. Ltd. | Optical ranging systems including optical cross-talk reducing features |
KR101792439B1 (ko) * | 2016-10-12 | 2017-10-31 | 삼성전기주식회사 | 카메라 모듈 |
-
2018
- 2018-03-20 KR KR1020180031913A patent/KR102488006B1/ko active IP Right Grant
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07159538A (ja) * | 1993-12-07 | 1995-06-23 | Copal Co Ltd | 光照射式測距装置 |
JP2003179093A (ja) * | 2001-12-12 | 2003-06-27 | Nissan Motor Co Ltd | 半導体モジュールの製造方法および半導体モジュール |
JP2004071366A (ja) * | 2002-08-07 | 2004-03-04 | Omron Corp | 光電センサ |
JP2014167387A (ja) * | 2011-06-24 | 2014-09-11 | Sanyo Electric Co Ltd | 物体検出装置および情報取得装置 |
JP2016534343A (ja) * | 2013-08-14 | 2016-11-04 | フーフ・ヒュルスベック・ウント・フュルスト・ゲーエムベーハー・ウント・コンパニー・カーゲーHuf Hulsbeck & Furst Gmbh & Co. Kg | 自動車の操作ジェスチャを認識するためのセンサ構成 |
US20150229912A1 (en) * | 2014-02-10 | 2015-08-13 | Microsoft Corporation | Vcsel array for a depth camera |
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WO2019182305A1 (ko) | 2019-09-26 |
KR102488006B1 (ko) | 2023-01-12 |
CN111919432B (zh) | 2022-09-09 |
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JP7373027B2 (ja) | 2023-11-01 |
KR20230010269A (ko) | 2023-01-18 |
CN111919432A (zh) | 2020-11-10 |
US20210099618A1 (en) | 2021-04-01 |
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CN115379094B (zh) | 2024-01-12 |
KR20240003431A (ko) | 2024-01-09 |
KR20190110231A (ko) | 2019-09-30 |
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CN115379094A (zh) | 2022-11-22 |
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