JP2022159354A - Integrated circuit electrostatic discharge bus structure and related method - Google Patents

Integrated circuit electrostatic discharge bus structure and related method Download PDF

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JP2022159354A
JP2022159354A JP2022123390A JP2022123390A JP2022159354A JP 2022159354 A JP2022159354 A JP 2022159354A JP 2022123390 A JP2022123390 A JP 2022123390A JP 2022123390 A JP2022123390 A JP 2022123390A JP 2022159354 A JP2022159354 A JP 2022159354A
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esd
integrated circuit
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pad groups
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JP7378548B2 (en
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ジグオ・リ
Zhiguo Li
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Yangtze Memory Technologies Co Ltd
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    • H—ELECTRICITY
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0292—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using a specific configuration of the conducting means connecting the protective devices, e.g. ESD buses
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/061—Disposition
    • H01L2224/0612—Layout
    • H01L2224/0613—Square or rectangular array
    • H01L2224/06134—Square or rectangular array covering only portions of the surface to be connected
    • H01L2224/06135—Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48101—Connecting bonding areas at the same height, e.g. horizontal bond
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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    • H01L2224/852—Applying energy for connecting

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  • Engineering & Computer Science (AREA)
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Abstract

PROBLEM TO BE SOLVED: To provide an integrated circuit structure and a related method, and more particularly to an integrated circuit electrostatic discharge bus structure and a related method.
SOLUTION: An integrated circuit ESD bus structure includes a circuit area, a plurality of electrostatic discharge (ESD) buses, a plurality of pad groups connected adjacently to the plurality of ESD buses, a common ESD bus, and a plurality of bonding wires configured to connect the plurality of groups of pads to the common ESD bus.
SELECTED DRAWING: Figure 2
COPYRIGHT: (C)2023,JPO&INPIT

Description

本発明は、集積回路構造および関連方法に関し、より詳細には、集積回路静電気放電バス構造および関連方法に関する。 The present invention relates to integrated circuit structures and related methods, and more particularly to integrated circuit electrostatic discharge bus structures and related methods.

図１に示されるような集積回路静電気放電（以降ＥＳＤと略記）構造１のために、Ｉ／Ｏ（入出力）パッド１２が特定の配列および位置に基づいて複数のチップ端１３内の回路領域１０の周りに配置されており、Ｉ／Ｏパッド１２の配置は一定の範囲内で調節可能である。 For an integrated circuit electrostatic discharge (ESD) structure 1 such as that shown in FIG. 10 and the placement of the I/O pads 12 is adjustable within a certain range.

一般に、Ｉ／Ｏパッド１２間の空きスペースにフィラーセルＦ１およびＦ２を配置し、フィラーセルＦ１およびＦ２を静電気放電（ＥＳＤ）バス１１（例えば、グランドまたは系統電圧に接続されるレイアウトトレース）に接続することが普通であり、これが回路領域１０の各部分を作成し、フィラーセルＦ１およびＦ２が連続ＥＳＤバスに接続されて、集積回路ＥＳＤバス構造１にＥＳＤ保護を提供する。 Typically, filler cells F1 and F2 are placed in the empty space between I/O pads 12 and connected to an electrostatic discharge (ESD) bus 11 (e.g., layout traces connected to ground or grid voltage). It is common to do, which creates portions of circuit area 10, with filler cells F1 and F2 connected to a continuous ESD bus to provide integrated circuit ESD bus structure 1 with ESD protection.

しかしながら、フィラーセルＦ１およびＦ２は、回路領域１０の一部分を集積回路ＥＳＤバス構造１にとって無駄であるとする。更に、矩形形状を有する集積回路ＥＳＤバス構造１の厳しい要件下では、それは、内部回路レイアウト設計に対する柔軟性の欠如をもたらす。 However, filler cells F1 and F2 render a portion of circuit area 10 wasted for integrated circuit ESD bus structure 1. FIG. Moreover, under the stringent requirements of the integrated circuit ESD bus structure 1 having a rectangular shape, it results in lack of flexibility for internal circuit layout design.

更に、不規則形状および種々の面積の回路があるとき、回路領域１０は、不規則形状および種々の面積の回路を含むために増加されなければならず、これは生産費を増加させる。 Moreover, when there are circuits of irregular shape and different areas, the circuit area 10 must be increased to include the circuits of irregular shape and different areas, which increases production costs.

したがって、回路領域を十分に使用する集積回路ＥＳＤバス構造および関連方法を提供することが望ましい。 Therefore, it would be desirable to provide an integrated circuit ESD bus structure and related method that makes efficient use of circuit area.

それゆえに、本発明の目的は、集積回路静電気放電バス構造および関連方法を提供することである。 SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an integrated circuit electrostatic discharge bus structure and related method.

上記技術的目的を達成するために、本発明によれば、集積回路静電気放電（ＥＳＤ）構造が提供され、回路領域と、複数の静電気放電バスと、複数のＥＳＤバスに隣接して接続される複数のパッド群と、共通ＥＳＤバスと、共通ＥＳＤバスに複数のパッド群を接続するように構成される複数のボンディングワイヤとを含む。 To achieve the above technical objectives, according to the present invention, an integrated circuit electrostatic discharge (ESD) structure is provided, adjacently connected to a circuit area, a plurality of electrostatic discharge buses, and a plurality of ESD buses. A plurality of pads, a common ESD bus, and a plurality of bonding wires configured to connect the plurality of pads to the common ESD bus.

上記技術的目的を達成するために、本発明によれば、集積回路静電気放電（ＥＳＤ）構造が提供され、回路領域と、複数の静電気放電（ＥＳＤ）バスと、複数のパッド群と、複数のパッド群の１つを別の１つに接続するように構成される複数のボンディングワイヤとを含む。 To achieve the above technical objectives, according to the present invention, an integrated circuit electrostatic discharge (ESD) structure is provided, comprising a circuit area, a plurality of electrostatic discharge (ESD) buses, a plurality of pad groups, and a plurality of and a plurality of bonding wires configured to connect one of the pads to another.

上記技術的目的を達成するために、本発明によれば、集積回路ＥＳＤバス構造の方法が提供され、回路領域を形成するステップと、回路領域の複数の不連続境界に対応する複数のパッド群を形成するステップと、共通ＥＳＤバスを形成するステップと、複数のチップ端の１つを横切る複数のボンディングワイヤによって共通ＥＳＤバスに複数のパッド群に対応する複数のパッドを接続するステップとを含む。 To achieve the above technical objectives, according to the present invention, a method for integrated circuit ESD bus structure is provided, comprising the steps of forming a circuit area and a plurality of groups of pads corresponding to a plurality of discontinuous boundaries of the circuit area. forming a common ESD bus; and connecting a plurality of pads corresponding to a plurality of pad groups to the common ESD bus by a plurality of bonding wires across one of the plurality of chip edges. .

上記技術的目的を達成するために、本発明によれば、集積回路ＥＳＤバス構造の方法が提供され、回路領域を形成するステップと、回路領域の複数の不連続境界に対応する複数のパッド群を形成するステップと、回路領域を横切る複数のボンディングワイヤの１つによって複数のパッド群の１つを複数のパッド群の別の１つに接続するステップとを含む。 To achieve the above technical objectives, according to the present invention, a method for integrated circuit ESD bus structure is provided, comprising the steps of forming a circuit area and a plurality of groups of pads corresponding to a plurality of discontinuous boundaries of the circuit area. and connecting one of the plurality of pads to another one of the plurality of pads by one of a plurality of bonding wires that traverse the circuit area.

本発明のこれらおよび他の目的は、当業者にとっては、様々な図および図面に示される好ましい実施形態の以下の詳細な説明を読んだ後におそらく明らかになるであろう。 These and other objects of the present invention will likely become apparent to those skilled in the art after reading the following detailed description of the preferred embodiments illustrated in the various figures and drawings.

先行技術に係る集積回路ＥＳＤバス構造の概要図である。1 is a schematic diagram of a prior art integrated circuit ESD bus structure; FIG. 本発明の一実施形態に係る集積回路ＥＳＤバス構造の概要図である。1 is a schematic diagram of an integrated circuit ESD bus structure according to one embodiment of the present invention; FIG. 本発明の一実施形態に係る集積回路ＥＳＤバス構造の概要図である。1 is a schematic diagram of an integrated circuit ESD bus structure according to one embodiment of the present invention; FIG. 本発明の一実施形態に係る集積回路パッケージング工程のフローチャートである。1 is a flowchart of an integrated circuit packaging process according to one embodiment of the invention; 本発明の一実施形態に係る集積回路パッケージング工程のフローチャートである。1 is a flowchart of an integrated circuit packaging process according to one embodiment of the invention;

図２は、本発明の一実施形態に係る集積回路静電気放電（ＥＳＤ）構造２の概要図である。集積回路ＥＳＤバス構造２は、回路領域２０、複数のＥＳＤバスＥ１、Ｅ２およびＥ３、複数のパッド群Ｇ１、Ｇ２およびＧ３、共通ＥＳＤバス２４、ならびに複数のボンディングワイヤ２５を含む。 FIG. 2 is a schematic diagram of an integrated circuit electrostatic discharge (ESD) structure 2 according to one embodiment of the present invention. Integrated circuit ESD bus structure 2 includes circuit area 20, multiple ESD buses E1, E2 and E3, multiple pad groups G1, G2 and G3, common ESD bus 24, and multiple bonding wires 25. FIG.

回路領域２０は複数のチップ端２３によって形成され、例えば、４つのチップ端２３が、回路領域２０を含むように構成される矩形領域を形成する。回路領域２０は複数の不連続境界Ｂ１、Ｂ２およびＢ３を含む。複数のＥＳＤバスＥ１、Ｅ２およびＥ３は、複数の不連続境界Ｂ１、Ｂ２およびＢ３に対応および隣接して、チップ端２３内に形成される。 Circuit area 20 is formed by a plurality of chip edges 23 , for example, four chip edges 23 form a rectangular area configured to contain circuit area 20 . Circuit region 20 includes a plurality of discontinuous boundaries B1, B2 and B3. A plurality of ESD buses E1, E2 and E3 are formed within tip edge 23 corresponding to and adjacent to a plurality of discontinuous boundaries B1, B2 and B3.

複数のパッド群Ｇ１、Ｇ２およびＧ３は、複数のＥＳＤバスＥ１、Ｅ２およびＥ３に隣接および接続して、チップ端２３内に形成される。共通ＥＳＤバス２４はチップ端２３外に形成されるが、これに限定されない。共通ＥＳＤバス２４は、一体に形成されずに、複数の不連続ＥＳＤバス群を含んでよい。複数のボンディングワイヤ２５は、チップ端２３を横切って形成され、共通ＥＳＤバス２４に複数のパッド群Ｇ１、Ｇ２およびＧ３を接続するように構成される。１つの実施形態において、共通ＥＳＤバス２４は、複数のＥＳＤバスＥ１、Ｅ２およびＥ３ならびに複数のパッド群Ｇ１、Ｇ２およびＧ３と平行である。 A plurality of pad groups G1, G2 and G3 are formed within chip edge 23 adjacent to and connected to a plurality of ESD buses E1, E2 and E3. Common ESD bus 24 is formed outside chip edge 23, but is not so limited. The common ESD bus 24 may not be integrally formed, but may include multiple discontinuous ESD bus groups. A plurality of bonding wires 25 are formed across chip edge 23 and configured to connect a plurality of pad groups G1, G2 and G3 to common ESD bus 24. FIG. In one embodiment, common ESD bus 24 is parallel to multiple ESD buses E1, E2 and E3 and multiple pad groups G1, G2 and G3.

複数のパッド群Ｇ１、Ｇ２およびＧ３の各々は少なくとも１つのパッド２２を含んでおり、パッド２２は、グランドまたは系統低電圧に接続される入出力パッドである。複数のボンディングワイヤ２５の少なくとも１つが、少なくとも１つのパッド２２を共通ＥＳＤバス２４に接続するように構成される。１つの実施形態において、複数ボンディングワイヤ２５が、共通ＥＳＤバス２４にパッド群Ｇ１の複数パッド２２を接続するように構成されてよく、これにより、パッド群Ｇ１と共通ＥＳＤバス２４との間の伝導性を強化する多重接続を提供して、ＥＳＤ保護を改善する。 Each of the plurality of pad groups G1, G2 and G3 includes at least one pad 22, which is an input/output pad connected to ground or system low voltage. At least one of the plurality of bonding wires 25 is configured to connect at least one pad 22 to common ESD bus 24 . In one embodiment, bonding wires 25 may be configured to connect pads 22 of pad group G1 to common ESD bus 24, thereby providing conduction between pad group G1 and common ESD bus 24. Provides multiple connections to enhance security and improve ESD protection.

そのような構造では、ボンディングワイヤ２５を通じて共通ＥＳＤバス２４にパッド群Ｇ１、Ｇ２およびＧ３のパッド２２を接続することによって、不連続ＥＳＤバスＥ１、Ｅ２およびＥ３は互いに接続されてよく、これは、集積回路ＥＳＤバス構造２のために連続ＥＳＤバスを形成するのと等価である。結果として、本発明は、先行技術のフィラーセルを排除し得る。加えて、不連続ＥＳＤバスＥ１およびＥ２（または、Ｅ２およびＥ３）間のスペースが回路素子で構成されて、集積回路ＥＳＤバス構造２を十分に使用し得る。 In such a structure, discontinuous ESD buses E1, E2 and E3 may be connected together by connecting pads 22 of pad groups G1, G2 and G3 to a common ESD bus 24 through bonding wires 25, which is Equivalent to forming a continuous ESD bus for the integrated circuit ESD bus structure 2 . As a result, the present invention can eliminate prior art filler cells. In addition, the space between discontinuous ESD buses E1 and E2 (or E2 and E3) can be made up of circuit elements to fully utilize the integrated circuit ESD bus structure 2. FIG.

例えば、図１に示されるＥＳＤバス１１ならびにフィラーセルＦ１およびＦ２は、図２において救済領域ＳＡ１およびＳＡ２と置き換えられる。救済領域ＳＡ１は、ＥＳＤバスＥ１およびＥ２ならびにパッド群Ｇ１およびＧ２のパッド２２に隣接する。救済領域ＳＡ２は、ＥＳＤバスＥ２およびＥ３ならびにパッド群Ｇ２およびＧ３のパッド２２に隣接する。１つの実施形態において、共通ＥＳＤバス２４は、チップ端２３内に、かつ複数のパッド群Ｇ１、Ｇ２およびＧ３ならびに救済領域ＳＡ１およびＳＡ２に隣接して形成される。 For example, ESD bus 11 and filler cells F1 and F2 shown in FIG. 1 are replaced with relief areas SA1 and SA2 in FIG. Relief area SA1 is adjacent to ESD buses E1 and E2 and pads 22 of pad groups G1 and G2. Relief area SA2 is adjacent to ESD buses E2 and E3 and pads 22 of pad groups G2 and G3. In one embodiment, common ESD bus 24 is formed within chip edge 23 and adjacent to a plurality of pad groups G1, G2 and G3 and relief areas SA1 and SA2.

図３は、本発明の一実施形態に係る集積回路ＥＳＤバス構造３の概要図である。集積回路ＥＳＤバス構造３は、回路領域３０、複数のＥＳＤバスＥ１、Ｅ２およびＥ３、複数のパッド群Ｇ１、Ｇ２およびＧ３、ならびに複数のボンディングワイヤ３５を含む。 FIG. 3 is a schematic diagram of an integrated circuit ESD bus structure 3 according to one embodiment of the present invention. Integrated circuit ESD bus structure 3 includes circuit region 30 , multiple ESD buses E 1 , E 2 and E 3 , multiple pad groups G 1 , G 2 and G 3 , and multiple bonding wires 35 .

回路領域３０は複数のチップ端３３によって形成され、例えば、４つのチップ端３３が、回路領域３０を含む矩形領域を形成する。回路領域３０は複数の不連続境界Ｂ１、Ｂ２およびＢ３を含む。複数のＥＳＤバスＥ１、Ｅ２およびＥ３は、複数の不連続境界Ｂ１、Ｂ２およびＢ３に対応および隣接して、チップ端３３内に形成される。 Circuit area 30 is formed by a plurality of chip edges 33 , for example, four chip edges 33 form a rectangular area containing circuit area 30 . Circuit region 30 includes a plurality of discontinuous boundaries B1, B2 and B3. A plurality of ESD buses E1, E2 and E3 are formed within tip end 33 corresponding to and adjacent to a plurality of discontinuous boundaries B1, B2 and B3.

複数の不連続ＥＳＤバスＥ１、Ｅ２およびＥ３は、チップ端３３内に、かつ複数の不連続境界Ｂ１、Ｂ２およびＢ３に隣接して形成される。複数のパッド群Ｇ１、Ｇ２およびＧ３は、複数のＥＳＤバスＥ１、Ｅ２およびＥ３に隣接および接続して、チップ端３３内に形成される。複数のボンディングワイヤ３５は、回路領域３０を横切って形成され、複数のパッド群Ｇ１、Ｇ２およびＧ３を１つの群から別の群に接続するように構成され、例えば、１つのボンディングワイヤ３５がパッド群Ｇ１をパッド群Ｇ２に接続してよく、そして別のボンディングワイヤ３５がパッド群Ｇ２をパッド群Ｇ３に接続してよい。 A plurality of discontinuous ESD buses E1, E2 and E3 are formed within chip edge 33 and adjacent to a plurality of discontinuous boundaries B1, B2 and B3. A plurality of pad groups G1, G2 and G3 are formed in chip edge 33 adjacent to and connected to a plurality of ESD buses E1, E2 and E3. A plurality of bonding wires 35 are formed across the circuit region 30 and configured to connect the plurality of pad groups G1, G2 and G3 from one group to another group, e.g. Group G1 may be connected to pad group G2, and another bonding wire 35 may connect pad group G2 to pad group G3.

複数のパッド群Ｇ１、Ｇ２およびＧ３の各々は複数のパッド３２を含んでおり、パッド３２は、グランドまたは系統低電圧に接続される入出力パッドである。複数のボンディングワイヤ３５は、１つの群のパッド３２を別の群に接続するように構成される。複数のパッド群Ｇ１、Ｇ２およびＧ３の各々は接続パッド（例えば、パッド群Ｇ１の右端のパッド、パッド群Ｇ２の左右端のパッド、およびパッド群Ｇ３の左端のパッド）を含み、複数のボンディングワイヤ３５は、複数のパッド群の１つの接続パッドを複数のパッド群の別の１つの接続パッドに接続するように構成される。例えば、ボンディングワイヤ３５の１つがパッド群Ｇ１の右端のパッド３２をパッド群Ｇ２の左端のパッド３２に接続するように構成され、ボンディングワイヤ３５の１つがパッド群Ｇ２の右端のパッド３２をパッド群Ｇ３の左端のパッド３２に接続するように構成されるが、これに限定されない。 Each of the plurality of pad groups G1, G2 and G3 includes a plurality of pads 32, which are input/output pads connected to ground or system low voltage. A plurality of bonding wires 35 are configured to connect one group of pads 32 to another group. Each of the plurality of pad groups G1, G2 and G3 includes a connection pad (eg, a rightmost pad of pad group G1, a left and right pad of pad group G2, and a leftmost pad of pad group G3), and a plurality of bonding wires. 35 is configured to connect one connection pad of a plurality of pad groups to another connection pad of a plurality of pad groups. For example, one of the bonding wires 35 is configured to connect the rightmost pad 32 of the pad group G1 to the leftmost pad 32 of the pad group G2, and one of the bonding wires 35 connects the rightmost pad 32 of the pad group G2 to the pad group. It is configured to connect to the leftmost pad 32 of G3, but is not so limited.

そのような構造では、パッド群Ｇ１、Ｇ２およびＧ３のパッド３２を１つの群から別の群に接続することによって、不連続ＥＳＤバスＥ１、Ｅ２およびＥ３は互いに接続されてよく、これは、集積回路ＥＳＤバス構造３のために連続ＥＳＤバスを形成するのと等価である。結果として、本発明は、先行技術のフィラーセルを排除し得る。加えて、不連続ＥＳＤバスＥ１およびＥ２（または、Ｅ２およびＥ３）間のスペースが回路素子で構成されて、集積回路ＥＳＤバス構造３を十分に使用し得る。例えば、図１に示されるＥＳＤバス１１ならびにフィラーセルＦ１およびＦ２は、図２において救済領域ＳＡ１およびＳＡ２と置き換えられ、したがって回路領域２０は、その面積を増加させることなく不規則形状および種々の面積の回路を含み得、これが生産費を節約する。 In such a structure, discontinuous ESD buses E1, E2 and E3 may be connected together by connecting pads 32 of pad groups G1, G2 and G3 from one group to another, which is an integrated Equivalent to forming a continuous ESD bus for the circuit ESD bus structure 3 . As a result, the present invention can eliminate prior art filler cells. In addition, the space between discontinuous ESD buses E1 and E2 (or E2 and E3) can be made up of circuit elements to fully utilize the integrated circuit ESD bus structure 3. FIG. For example, ESD bus 11 and filler cells F1 and F2 shown in FIG. 1 are replaced with relief areas SA1 and SA2 in FIG. circuit, which saves production costs.

図４は、本発明の一実施形態に係る集積回路ＥＳＤバス構造工程４のフローチャートである。 FIG. 4 is a flow chart of an integrated circuit ESD bus structure step 4 according to one embodiment of the present invention.

ステップ４０：回路領域を形成する。 Step 40: Form circuit regions.

ステップ４１：複数のチップ端内の回路領域の複数の不連続境界に対応する複数のパッド群を形成する。 Step 41: Form a plurality of pad groups corresponding to a plurality of discontinuous boundaries of circuit regions within a plurality of chip edges.

ステップ４２：複数のチップ端外の共通ＥＳＤバスを形成する。 Step 42: Form multiple off-chip-edge common ESD buses.

ステップ４３：複数のチップ端を横切る複数のボンディングワイヤによって共通ＥＳＤバスに複数のパッド群に対応する複数のパッドを接続する。 Step 43: Connect a plurality of pads corresponding to a plurality of pad groups to a common ESD bus with a plurality of bonding wires across a plurality of chip edges.

ステップ４０で、回路領域が形成され、ステップ４１で、複数のチップ端内の回路領域の複数の不連続境界に対応する複数のパッド群が形成され、ステップ４２で、複数のチップ端外の共通ＥＳＤバスが形成され、そしてステップ４３で、複数のパッド群に対応する複数のパッドが複数のチップ端を横切る複数のボンディングワイヤによって共通ＥＳＤバスに接続される。集積回路ＥＳＤバス構造工程４によって、連続ＥＳＤバスが等価に形成され得、そして先行技術のフィラーセルが省略され得る。 At step 40, a circuit region is formed, at step 41, a plurality of pad groups corresponding to the plurality of discontinuous boundaries of the circuit region within the plurality of chip edges are formed, and at step 42, a plurality of common off-chip edge boundaries are formed. An ESD bus is formed and, at step 43, pads corresponding to groups of pads are connected to a common ESD bus by bonding wires across chip edges. With integrated circuit ESD bus structure step 4, a continuous ESD bus can be equivalently formed and the prior art filler cells can be omitted.

図５は、本発明の一実施形態に係る集積回路ＥＳＤバス構造工程５のフローチャートである。 FIG. 5 is a flowchart of an integrated circuit ESD bus structure step 5 according to one embodiment of the present invention.

ステップ５０：回路領域を形成する。 Step 50: Form circuit regions.

ステップ５１：複数のチップ端内の回路領域の複数の不連続境界に対応する複数のパッド群を形成する。 Step 51: Form a plurality of pad groups corresponding to a plurality of discontinuous boundaries of circuit regions within a plurality of chip edges.

ステップ５２：複数のチップ端内の回路領域を横切る複数のボンディングワイヤによって複数のパッド群の１つおよび別の１つを接続する。 Step 52: Connect one and another of the plurality of pad groups by a plurality of bonding wires across circuit areas within the plurality of chip edges.

ステップ５０で、回路領域が形成され、ステップ５１で、複数のチップ端内の回路領域の複数の不連続境界に対応する複数のパッド群が形成され、そしてステップ５２で、複数のパッド群の１つおよび別の１つが複数のチップ端内の回路領域を横切る複数のボンディングワイヤによって互いに接続される。集積回路ＥＳＤバス構造工程５によって、連続ＥＳＤバスが等価に形成され得、そして先行技術のフィラーセルが省略され得る。 At step 50 a circuit region is formed, at step 51 a plurality of pad groups corresponding to discontinuous boundaries of the circuit region within a plurality of chip edges is formed, and at step 52 one of the plurality of pad groups is formed. One and another are connected together by a plurality of bonding wires that traverse circuit areas within a plurality of chip edges. With integrated circuit ESD bus structure step 5, a continuous ESD bus can be equivalently formed and the prior art filler cells can be omitted.

要約すれば、本発明は、連続ＥＳＤバスを等価に形成するように、ボンディングワイヤを活用して複数のパッド群の複数のパッドを接続する。結果として、本発明は、先行技術のフィラーセルを排除し得る。加えて、不連続ＥＳＤバス間のスペースが回路素子で構成されて、集積回路ＥＳＤバス構造を十分に使用し得る。 In summary, the present invention utilizes bonding wires to connect multiple pads of multiple pad groups to form an equivalent continuous ESD bus. As a result, the present invention can eliminate prior art filler cells. Additionally, the space between the discontinuous ESD buses can be made up of circuit elements to take full advantage of the integrated circuit ESD bus structure.

当業者は、本発明の教示を維持しつつ本装置および方法の多数の変更および修正がなされ得ることを直ちに認めるであろう。したがって、上記開示は、添付の特許請求の範囲によってのみ限定されると解釈されるべきである。 Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the appended claims.

２ 集積回路ＥＳＤバス構造
３ 集積回路ＥＳＤバス構造
２０ 回路領域
２２ パッド
２３ チップ端
２４ 共通ＥＳＤバス
２５ ボンディングワイヤ
３０ 回路領域
３２ パッド
３３ チップ端
３５ ボンディングワイヤ
Ｂ１、Ｂ２、Ｂ３ 不連続境界
Ｅ１、Ｅ２、Ｅ３ ＥＳＤバス
Ｇ１、Ｇ２、Ｇ３ パッド群
ＳＡ１、ＳＡ２ 救済領域 2 integrated circuit ESD bus structure 3 integrated circuit ESD bus structure 20 circuit area 22 pad 23 chip edge 24 common ESD bus 25 bonding wire 30 circuit area 32 pad 33 chip edge 35 bonding wire B1, B2, B3 discontinuous boundary E1, E2, E3 ESD bus G1, G2, G3 Pad group SA1, SA2 Relief area

Claims (17)

回路領域と、
複数のＥＳＤバスと、
前記複数のＥＳＤバスに隣接して接続される複数のパッド群と、
前記複数のパッド群に隣接する共通ＥＳＤバスと、
前記共通ＥＳＤバスに前記複数のパッド群を接続するように構成される複数のボンディングワイヤと
を備える、集積回路構造。 a circuit area;
a plurality of ESD buses;
a plurality of pad groups connected adjacent to the plurality of ESD buses;
a common ESD bus adjacent to the plurality of pad groups;
and a plurality of bonding wires configured to connect the plurality of pads to the common ESD bus. 前記複数のパッド群の各々が少なくとも１つのパッドを含み、前記複数のボンディングワイヤが、前記少なくとも１つのパッドを前記共通ＥＳＤバスに接続するように構成される、請求項１に記載の集積回路構造。 2. The integrated circuit structure of claim 1, wherein each of said plurality of pad groups includes at least one pad, and wherein said plurality of bonding wires are configured to connect said at least one pad to said common ESD bus. . 前記共通ＥＳＤバスが複数の不連続ＥＳＤバス群を含む、請求項１に記載の集積回路構造。 2. The integrated circuit structure of claim 1, wherein said common ESD bus comprises a plurality of discrete ESD bus groups. 前記共通ＥＳＤバスが複数のチップ端外にまたは複数のチップ端内に形成される、請求項１に記載の集積回路構造。 2. The integrated circuit structure of claim 1, wherein said common ESD bus is formed outside a plurality of chip edges or within a plurality of chip edges. 前記回路領域が、前記ＥＳＤバス、前記複数のパッド群に隣接する少なくとも１つの救済領域を含む、請求項１に記載の集積回路構造。 2. The integrated circuit structure of claim 1, wherein said circuit area includes at least one relief area adjacent to said ESD bus and said plurality of pads. 前記共通ＥＳＤバスが前記複数のＥＳＤバスと平行である、請求項１に記載の集積回路構造。 2. The integrated circuit structure of claim 1, wherein said common ESD bus is parallel to said plurality of ESD buses. 回路領域と、
複数のＥＳＤバスと、
前記複数のＥＳＤバスに隣接して接続される複数のパッド群と、
前記複数のパッド群の１つを別の１つに接続するように構成される複数のボンディングワイヤと
を備える、集積回路構造。 a circuit area;
a plurality of ESD buses;
a plurality of pad groups connected adjacent to the plurality of ESD buses;
and a plurality of bonding wires configured to connect one of the plurality of pads to another. 前記回路領域が、前記複数のＥＳＤバスおよび前記複数のパッド群に隣接する少なくとも１つの救済領域を含む、請求項７に記載の集積回路構造。 8. The integrated circuit structure of claim 7, wherein said circuit region includes at least one relief region adjacent said plurality of ESD buses and said plurality of pads. 前記複数のパッド群の各々が接続パッドを含み、前記複数のボンディングワイヤが、前記複数のパッド群の１つの前記接続パッドを前記複数のパッド群の別の１つの前記接続パッドに接続するように構成される、請求項７に記載の集積回路構造。 Each of the plurality of pad groups includes a connection pad, and the plurality of bonding wires connect one of the plurality of pad groups to another of the plurality of pad groups. 8. The integrated circuit structure of claim 7, comprising: 回路領域を形成するステップと、
前記回路領域の複数の不連続境界に対応する複数のパッド群を形成するステップと、
前記複数のパッド群に隣接する共通ＥＳＤバスを形成するステップと、
複数のボンディングワイヤによって前記共通ＥＳＤバスに前記複数のパッド群に対応する複数のパッドを接続するステップと
を含む、集積回路構造の方法。 forming a circuit region;
forming a plurality of pad groups corresponding to a plurality of discontinuous boundaries of the circuit area;
forming a common ESD bus adjacent to the plurality of pads;
connecting a plurality of pads corresponding to the plurality of pad groups to the common ESD bus with a plurality of bonding wires. 前記複数のパッド群の各々が少なくとも１つのパッドを含み、前記複数のボンディングワイヤが、前記少なくとも１つのパッドを前記共通ＥＳＤバスに接続するように構成される、請求項１０に記載の集積回路構造の方法。 11. The integrated circuit structure of claim 10, wherein each of said plurality of pad groups includes at least one pad, and wherein said plurality of bonding wires are configured to connect said at least one pad to said common ESD bus. the method of. 前記共通ＥＳＤバスを複数のチップ端外にまたは複数のチップ端内に形成するステップ
を更に含む、請求項１０に記載の集積回路構造の方法。 11. The integrated circuit structure method of claim 10, further comprising: forming said common ESD bus outside of multiple chip edges or within multiple chip edges. 前記共通ＥＳＤバスが複数のＥＳＤバスと平行である、請求項１０に記載の集積回路構造の方法。 11. The integrated circuit structure method of claim 10, wherein said common ESD bus is parallel to a plurality of ESD buses. 回路領域を形成するステップと、
前記回路領域の複数の不連続境界に対応する複数のパッド群を形成するステップと、
前記回路領域を横切る複数のボンディングワイヤの１つによって前記複数のパッド群の１つを前記複数のパッド群の別の１つに接続するステップと
を含む、集積回路構造の方法。 forming a circuit region;
forming a plurality of pad groups corresponding to a plurality of discontinuous boundaries of the circuit area;
connecting one of said plurality of pad groups to another one of said plurality of pad groups by one of a plurality of bonding wires traversing said circuit area. 前記回路領域が、複数のＥＳＤバスおよび前記複数のパッド群に隣接する少なくとも１つの救済領域を含む、請求項１４に記載の集積回路構造の方法。 15. The integrated circuit structure method of claim 14, wherein said circuit region includes at least one relief region adjacent to a plurality of ESD buses and said plurality of pads. 共通ＥＳＤバスが複数のＥＳＤバスおよび前記複数のパッド群と平行である、請求項１４に記載の集積回路構造の方法。 15. The integrated circuit structure method of claim 14, wherein a common ESD bus is parallel to multiple ESD buses and said multiple groups of pads. 前記複数のパッド群の各々が接続パッドを含み、前記複数のボンディングワイヤが、前記複数のパッド群の１つの前記接続パッドを前記複数のパッド群の別の１つの前記接続パッドに接続するように構成される、請求項１４に記載の集積回路構造の方法。 Each of the plurality of pad groups includes a connection pad, and the plurality of bonding wires connect one of the plurality of pad groups to another of the plurality of pad groups. 15. The integrated circuit structure method of claim 14, comprising:
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