JP2022151000A - Substrate, detection device, and detection module - Google Patents

Abstract

To provide a substrate which can hardly be distorted.SOLUTION: A substrate (1) pertaining to the present disclosure is a laminate, comprising: a plurality of insulating layers (11C), a plurality of metal layers (18) positioned between the plurality of insulating layers, and a first mount part (12) on which an X-ray detection element is mounted and a second mount part (13) on which an electronic element is mounted. The substrate (1) is provided with a plurality of via conductors (16) that connect the first mount part (12) and the second mount part (13) sides together via the metal layers (18) and includes at least one via conductor aggregate (16A) in which the plurality of via conductors (16) are linearly arranged in a row in the lamination direction of the plurality of insulating layers (11C). At least some of the plurality of metal layers (18) connected to the via conductor aggregate (16A) extend in mutually different directions from the via conductors.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to a substrate for mounting an X-ray detection element, a detection device, and a detection module.

2. Description of the Related Art Conventionally, a detection element mounting substrate and a detection device are known, in which an X-ray detection element is mounted on the main surface of an insulating substrate. Patent Document 1 discloses a configuration in which a plurality of vias for attenuating X-rays are arranged inside an insulating layer of such a substrate for mounting a detecting element.

JP 2004-265883 A

When the X-ray detection device operates, the X-ray detection elements or other electronic elements generate heat. Therefore, it is desired to reduce the possibility that the substrate on which the X-ray detection element is mounted is distorted due to heat generation.

A substrate according to an aspect of the present disclosure is a laminate, and includes a plurality of insulating layers, a plurality of metal layers positioned between the plurality of insulating layers, and a first mounting portion on which an X-ray detection element is mounted. and a second mounting portion opposite to the first mounting portion on which an electronic element is mounted, a side on which the first mounting portion is positioned, and a side on which the second mounting portion is positioned, with the metal layer interposed therebetween. at least one via-conductor aggregate in which the plurality of via-conductors are arranged linearly in the lamination direction of the plurality of insulating layers; and in the laminate, At least some of the plurality of metal layers connected to the via-conductor assembly extend in different directions from the via-conductor assembly.

According to one aspect of the present disclosure, distortion of the substrate due to heat generation can be reduced.

1 is a cross-sectional view of a detection device according to an embodiment of the present disclosure; FIG. 1 is a top view of a detection device according to an embodiment of the present disclosure; FIG. FIG. 3 is a bottom view of a detection device according to an embodiment of the present disclosure; 2 is an enlarged cross-sectional view of a main part indicated by region R in FIG. 1; FIG. FIG. 3 is a schematic plan view showing the arrangement of metal layers when a region S in FIG. 2 is seen through from above. 1A and 1B are a perspective view and a schematic plan view showing a configuration of linearly arranged via conductors and a metal layer connected to the via conductors; FIG. FIG. 2 is a schematic plan view showing a configuration example of a metal layer according to an embodiment of the present disclosure; FIG. 2 is a schematic plan view showing a configuration example of linearly arranged via conductors and a metal layer connected to the via conductors; FIG. 4 is a schematic plan view showing another configuration example of linearly arranged via conductors and metal layers connected to the via conductors; FIG. 4 is a schematic plan view showing a configuration example of metal layers at the same position in the stacking direction of insulating layers. FIG. 3 is a schematic plan view showing the arrangement of metal layers when the substrate is seen through from above.

[Embodiment]
Exemplary embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

FIG. 1 is a sectional view taken along line II of the detection device 100 shown in FIG. FIG. 2 is a top view of the detection device 100 of this embodiment. FIG. 3 is a bottom view of the detection device 100. FIG.

In the attached drawings, it is assumed that the substrate 1 and the detection device 100 are mounted on the XY plane in a virtual XYZ space. In this specification, the upward direction means the positive direction of the imaginary Z-axis. Note that the distinction between upper and lower sides in the following description is for convenience, and does not limit the upper and lower sides when the substrate 1 and the like are actually used. Further, the thickness direction of the substrate 1 means the direction of the Z-axis.

As shown in FIG. 1, the detection device 100 includes a substrate 1, a detection element 2 mounted on a first surface 11A of the substrate 1, and an electronic element 3 mounted on a second surface 11B of the substrate 1. The detection device 100 can be connected using solder, for example, on a module substrate that constitutes the detection module.

A substrate 1 is a substrate on which a detection element 2 is mounted. The configuration of the substrate 1 will be detailed below.

The detection element 2 is an X-ray detection element that converts X-rays incident on the substrate 1 into electrical signals. The detection element 2 has, for example, a scintillator that converts X-rays into light and a photodiode that converts light into an electrical signal. That is, the X-rays incident on the detection device 100 are converted into light by the scintillator, and the converted light is converted into electrical signals by the photodiodes.

The electronic element 3 is an element that detects an electrical signal output from the detection element 2 and processes it as information, and is an integrated circuit device, for example. The detection element 2 and the electronic element 3 are connected to the electrodes of the detection element 2 or the electrodes of the electronic element 3 via a connection member 4 such as a solder bump, a gold bump, or a conductive resin (such as an anisotropic conductive resin). It is mounted on the substrate 1 by being electrically and mechanically connected to the wiring pattern 17 .

(Structure of substrate 1)
As shown in FIG. 1, the substrate 1 according to this embodiment is a laminate including an insulating substrate 11 configured by laminating a plurality of insulating layers 11C. The insulating substrate 11 has a first surface 11A (upper surface), a second surface 11B (lower surface), and side surfaces. The insulating substrate 11 has a first mounting portion 12 on which the detection element 2 is mounted on the first surface 11A. The insulating substrate 11 also has a second mounting portion 13 on which the electronic element 3 is mounted on a second surface 11B opposite to the first surface 11A. In other words, the substrate 1 includes a plurality of insulating layers 11C positioned between the first mounting portion 12 and the second mounting portion 13. As shown in FIG.

In FIG. 1, the insulating layer 11C on the side of the first surface 11A and the insulating layer 11C on the side of the second surface 11B (the length in the Z-axis direction) are thick, and the other insulating layers 11C are thin. . Also, the thickness of the insulating layer 11C between the metal layers is the same. However, the thickness of each insulating layer 11C included in the substrate 1 is not limited to this configuration. For example, the insulating layers 11C may all have the same thickness, or all may have different thicknesses. By adjusting the thickness of each insulating layer 11C, the position in the Z-axis direction of the metal layer 18 arranged between the insulating layers 11C can be adjusted. The number of insulating layers 11C included in the substrate 1 is also not limited to the example shown in FIG.

The substrate 1 comprises a plurality of metal layers 18 positioned between a plurality of insulating layers 11C. In addition, the substrate 1 connects the side where the first mounting portion 12 is located and the side where the second mounting portion 13 is located of the insulating substrate 11 configured by a plurality of insulating layers 11C through the metal layer 18. A plurality of via conductors 16 are provided.

A plurality of via conductors 16 included in the substrate 1 can be arranged on the substrate 1 so as to form a plurality of "aggregates of via conductors arranged in a straight line (hereinafter referred to as via conductor aggregates)". For example, as shown in FIG. 4, via-conductor assembly 16A is composed of five via-conductors 16 linearly aligned in the thickness direction of substrate 1 . Further, as shown in FIGS. 1 to 3, when the substrate 1 is viewed from above, the via-conductor aggregates 16A are arranged in a grid pattern. 2 and 3 indicate the positions of via-conductor aggregates 16A on substrate 1 when seen from above.

As shown in FIGS. 2 and 3, the substrate 1 includes 7 rows of via-conductor aggregates 16A in the X-axis direction and 4 rows in the Y-axis direction, for a total of 28 via-conductor aggregates 16A. The number of aggregates 16A is not limited to this.

The insulating substrate 11 has, for example, a rectangular plate-like shape when viewed from above, that is, in a direction perpendicular to the first surface 11A. The insulating substrate 11 functions as a support for supporting the detection element 2 and the electronic element 3 .

For the insulating substrate 11, ceramics such as aluminum oxide sintered body (alumina ceramics), aluminum nitride sintered body, silicon nitride sintered body, mullite sintered body, or glass ceramics sintered body can be used. can. If the insulating substrate 11 is, for example, an aluminum oxide sintered body, raw material powder such as aluminum oxide (Al ₂ O ₃ ), silicon oxide (SiO ₂ ), magnesium oxide (MgO), calcium oxide (CaO), etc. A slurry is prepared by adding and mixing an appropriate organic binder and solvent. A ceramic green sheet is produced by forming this slurry into a sheet by employing a conventionally well-known doctor blade method, calender roll method, or the like. Next, this ceramic green sheet is subjected to an appropriate punching process, and a plurality of ceramic green sheets are laminated to form a green body. produced.

A wiring pattern 17 for electrically connecting to the detection element 2 is provided on the first surface 11A of the insulating substrate 11 . A wiring pattern 17 for electrically connecting to the electronic element 3 is provided on the second surface 11B of the insulating substrate 11 .

Via conductors 16 and metal layer 18 are provided inside insulating substrate 11 . The wiring pattern 17 on the first surface 11</b>A and the wiring pattern 17 on the second surface are electrically connected via the via conductors 16 and the metal layer 18 .

The metal layer 18 and the wiring pattern 17 are, for example, metal powder metallization containing tungsten (W), molybdenum (Mo), manganese (Mn) or the like as main components. For example, when the insulating substrate 11 is made of an aluminum oxide sintered body, the metal layer 18 and the wiring pattern 17 are formed as follows. First, a metallized paste obtained by adding and mixing a suitable organic binder, solvent, etc. to a high-melting-point metal powder such as W, Mo or Mn is applied to a ceramic green sheet for the insulating substrate 11 in advance in a predetermined pattern by screen printing. Apply printing. After that, the pattern is deposited at a predetermined position of the insulating substrate 11 by firing at the same time as the ceramic green sheet for the insulating substrate 11 .

For the via conductors 16, for example, first, through holes for the via conductors 16 are formed in the ceramic green sheet for the insulating substrate 11 by punching with a mold or punching, laser processing, or other processing method. After that, the through holes are filled with the metallizing paste for the via conductors 16 by the above-described printing means, and the through holes are formed by firing together with the ceramic green sheets for the insulating substrate 11 . The metallized paste is prepared by adding an appropriate solvent and binder to the metal powder described above and kneading them to adjust the viscosity to an appropriate level. In addition, in order to increase the bonding strength with the insulating substrate 11, glass powder or ceramic powder may be included. The via conductor 16 has, for example, a circular shape in plan view from the Z-axis direction. That is, in the substrate 1 of this embodiment, the via conductors 16 are cylindrical. However, the shape of via conductor 16 is not limited to a columnar shape, and may be, for example, a prismatic shape.

Metal layer 18 is arranged to connect via conductors 16 and shield X-rays that pass through substrate 1 . By covering the region overlapping with the second mounting portion 13 in planar see-through with a plurality of metal layers 18, X-rays incident from the side of the first surface 11A are transmitted through the substrate 1 and irradiated to the electronic element 3. can be reduced. As a result, the detecting device 100 can suppress functional deterioration of the electronic element 3 due to X-rays, and can satisfactorily detect and process electrical signals. Also, the metal layer 18 is arranged on the adjacent insulating layer 11C and can electrically connect the via conductors 16 forming one circuit.

(Structure of Via Conductors 16 Arranged Linearly and Metal Layer 18)
The configuration of a plurality of linearly arranged via conductors 16 (via conductor aggregate 16A) and a plurality of metal layers 18 connected to the via conductor aggregate 16A will be described below with reference to FIGS. 4 to 9. FIG.

FIG. 4 is an enlarged cross-sectional view of a main part indicated by region R in FIG. In the example shown in FIG. 4, five via conductors 16 are arranged linearly in the thickness direction of substrate 1 to form via conductor assembly 16A. Each via conductor 16 is connected via four metal layers 18 (18A1, 18A2, 18A3, 18A4) located between the plurality of insulating layers 11C. That is, the plurality of via conductors 16 connect the first surface 11A and the second surface 11B of the insulating substrate 11 composed of the plurality of insulating layers 11C via the plurality of metal layers 18 . In the drawings below, the member number 18An denotes a metal layer connected to the via conductors 16 included in the via-conductor assembly 16A, and is the n-th metal layer counted from the first surface 11A side. ing.

FIG. 5 is a diagram showing the arrangement of the metal layers 18A1 to 18A4 when the area S in FIG. 2 is viewed from above. In other words, FIG. 5 is a plan perspective view of insulating substrate 11 in the direction in which five via conductors 16 are arranged in a straight line. For the sake of simplicity, FIG. 5 omits members other than the metal layers 18A1 to 18A4. Via conductor assembly 16A is located in the central portion of the group of metal layers 18A1 to 18A4.

FIG. 6 is a perspective view showing a configuration of five linearly arranged via conductors 16 and metal layers 18A1 to 18A4. A diagram indicated by reference numeral 601 in FIG. 6 is a diagram in which the metal layers 18A1 to 18A4 are arranged in order from the first surface 11A side. 5 and 6 is a connection portion between the metal layer 18 and the via conductor 16. As shown in FIGS. Also, the center of the connection portion T is defined as the connection position between the metal layer 18 and the via conductor 16 .

As shown in FIGS. 5 and 6, metal layers 18A1-18A4 connected to via-conductor assembly 16A extend in different directions from via-conductors 16 included in via-conductor assembly 16A.

Further, as shown in FIG. 5, for example, metal layer 18A1 (first metal layer) and metal layer 18A2 (second metal layer) are formed by rotating metal layer 18A1 around via-conductor assembly 16A. In this case, it overlaps with the metal layer 18A2 when viewed through the substrate 1 from above.

Furthermore, as shown in FIG. 5, the metal layers 18A1 to 18A4 are in a positional relationship in which each metal layer 18 is periodically rotated about the via-conductor assembly 16A when viewed through the substrate 1 from above.

When the detection device 100 operates, the detection element 2 or the electronic element 3 generates heat. The substrate 1 includes an insulating layer 11C made of ceramic, for example, and via conductors 16 and metal layers 18, which are metal conductors. Therefore, heat generated by the operation of the X-ray detection device may cause stress due to the difference in thermal expansion.

With the above configuration, even when the detecting element 2 or the electronic element 3 generates heat, the stress due to the difference in thermal expansion between the insulating layer 11C, the via conductors 16 and the metal layer 18 is dispersed. This reduces the possibility that the substrate 1 on which the X-ray detection element is mounted is distorted.

(Configuration example of metal layer 18)
FIG. 7 is a plan view showing a configuration example of the metal layer 18. As shown in FIG. The metal layer 18 (G) indicated by reference numeral 701 in FIG. 7 has a substantially square shape, and the connection portion T is provided at a position (first position) near one corner of the square. In the metal layer 18 (H) indicated by reference numeral 702 in FIG. 7, the connecting portion T is located between two adjacent corners of the square and separated from the sides between the two corners (second position). is provided in the metal layer 18A. It should be noted that, in the subsequent drawings, those with (G) at the end of the member number indicate that the metal layer (first metal layer) provided with the connection portion T at the first position. showing. On the other hand, (H) at the end of the member number indicates that the connection portion T is the metal layer (second metal layer) provided at the second position.

Also, the distance L2 between the center of the connection portion T and the outer edge of the metal layer 18(G) is shorter than the distance L1 between the center of the connection portion T and the center P of the metal layer 18(G). The same applies to the metal layer 18(H). Since L2 is shorter than L1, the metal layer 18 can be significantly displaced with respect to the via conductor, and the stress generated between the metal layer and the insulating layer can be effectively dispersed.

In addition, the shape of the metal layer 18 is not limited to a square shape, and may be, for example, a rectangular shape, a polygonal shape, a circular shape, or the like.

(Structure of Metal Layer 18An (Modified Example))
1 to 6 show an example in which four metal layers 18 are connected to via conductor assembly 16A (n=4). However, the number of via conductors 16 and metal layers 18 is not limited to this example.

FIG. 8 is a diagram showing a configuration example of a plurality of metal layers 18 (metal layers 18An) connected to linearly arranged via conductors 16 (via conductor aggregate 16A). FIG. 8 shows the case of n=8, and is a diagram in which the metal layers 18An are arranged in order from the first surface 11A side, like the reference numeral 601 in FIG. As shown in FIG. 8, the plurality of metal layers 18 connected to the plurality of linearly arranged via conductors 16 include metal layers 18 having different connection positions (positions of connection portions T) with the via conductors. It may be More specifically, as shown in FIG. 8, a set of metal layers 18An(G) (a set of first metal layers) in which the position of the connection portion T is at the first position and a set of metal layers 18An(G) at the second position. A set of metal layers 18An(H) (a set of second metal layers) may be included.

FIG. 9 is a diagram showing another configuration example of the metal layer 18An. FIG. 9 is also a diagram in which the metal layers 18An are arranged in order from the first surface 11A side, similarly to the reference numeral 601 in FIG. As shown in FIG. 9, the metal layer 18An(G) whose connection part T position is the first position and the metal layer 18An(H) whose connection part T is the second position may be alternately arranged.

(Regarding metal layers 18 at the same position in the stacking direction of substrate 1)
The metal layers 18 at the same position in the stacking direction of the substrate 1 will be described below with reference to FIG.

As described above, the substrate 1 has a plurality of sets of via conductors 16 arranged linearly.

Of the plurality of metal layers 18 included in the substrate 1, the metal layers located at the same position in the stacking direction (Z-axis direction) of the insulating layer 11C are focused.

Reference numerals 1001 to 1004 in FIG. 10 are schematic plan views showing configuration examples of the metal layers 18 at the same positions in the stacking direction of the insulating layer 11C. Counting from the first surface 11A side, reference numeral 1001 indicates the first layer, reference numeral 1001 indicates the second layer, reference numeral 1003 indicates the third layer, and reference numeral 1004 indicates the fourth layer. For the sake of simplicity, only metal layers 18 connected to 16 groups of via conductors 16 arranged linearly on substrate 1 are shown.

As shown in FIG. 10, the metal layer 18An (third metal layer) and the metal layer 18Bn (fourth metal layer) at the same position in the stacking direction are not connected to each other. A metal layer 18An represents an n-th metal layer connected to the via conductors 16 included in the first via-conductor aggregate 16A. A metal layer 18Bn indicates an n-th metal layer connected to the via conductors 16 included in the second via-conductor aggregate 16B.

With this configuration, the metal layers at the same position in the stacking direction do not overlap with each other, so the stress generated between the metal conductor and the insulating layer 11C is easily dispersed. In addition, since different via conductor aggregates are not electrically connected to each other, electrical signals can be accurately transmitted.

Also, the metal layer 18An (third metal layer) and the metal layer 18Bn (fourth metal layer) located at the same position in the lamination direction are connected to the first via conductor set. It is positioned in the same direction with respect to the body 16A or the second via conductor assembly 16B. In other words, each metal layer 18 at the same position in the stacking direction has the connection portion T at the same position in plan view.

With this configuration, the metal layers connected to the plurality of via-conductor aggregates are dispersedly arranged at the same position in the stacking direction of the insulating layers, so that the stress generated between the metal conductors and the insulating layers is dispersed. easier to be Further, since the metal layers 18 are arranged in a well-balanced manner at the same position in the stacking direction of the insulating layer 11C, the homogeneity of the substrate is improved.

(Regarding the metal layer 18 when the substrate 1 is viewed through the plane)
Below, the metal layer 18 when the board|substrate 1 is planarly seen through is demonstrated using FIG.

FIG. 11 is a schematic plan view showing the metal layer 18 when the substrate 1 is viewed through the plane. In FIG. 11, for the sake of simplicity, attention is focused on the first via-conductor assembly 16A, the second via-conductor assembly 16B, the third via-conductor assembly 16C, and the fourth via-conductor assembly 16D. Only the metal layers 18 connected to these sets are shown. A metal layer 18Cn represents an n-th metal layer connected to the via conductors 16 included in the third via-conductor aggregate 16C. A metal layer 18Dn indicates an n-th metal layer connected to the via conductors 16 included in the fourth via-conductor aggregate 16D.

As shown in FIG. 11, at least part of metal layer 18An connected to first via-conductor assembly 16A and at least part of metal layer 18Bn connected to second via-conductor assembly 16B. are overlapped when the substrate 1 is seen through the plane. This is the same for adjacent via conductor aggregates. In FIG. 11, hatched areas Q indicate overlapping portions of the metal layers 18 connected to adjacent via conductor aggregates. Further, similarly to the example shown in FIG. 5, the first via-conductor assembly 16A is located in the central portion of the group of metal layers 18A1 to 18A4. Similarly, the second via-conductor assembly 16B is located in the center of the group of metal layers 18B1-18B4, the third via-conductor assembly 16C is located in the center of the group of metal layers 18C1-18C4, The fourth via-conductor aggregate 16D is located in the center of the group of metal layers 18D1-18D4.

With this configuration, the plurality of metal layers connected to the adjacent via-conductor aggregates have portions that overlap each other when the laminate is viewed through the plan view, so that the X-ray shielding effect can be enhanced.

In the above-described embodiment, the plurality of via conductors 16 connecting the first surface 11A side and the second surface 11B side of the insulating substrate 11 are all arranged in a straight line. At least part of 16 should just be arranged in a straight line. For example, the insulating substrate 11 may include a first insulating substrate including linearly arranged via conductors and a second insulating substrate for routing wiring according to the size of the electronic element 3 . The second insulating substrate may include via conductors 16 and internal wiring layers therein.

[Additional notes]
The invention according to the present disclosure has been described above based on the drawings and examples. However, the invention according to the present disclosure is not limited to each embodiment described above. That is, the invention according to the present disclosure can be variously modified within the scope shown in the present disclosure, and the embodiments obtained by appropriately combining the technical means disclosed in different embodiments can also be applied to the invention according to the present disclosure. Included in the technical scope. In other words, it should be noted that a person skilled in the art can easily make various variations or modifications based on this disclosure. Also, note that these variations or modifications are included within the scope of this disclosure.

Reference Signs List 1 Substrate 11 Insulating substrate 11A First surface 11B Second surface 11C Insulating layer 12 First mounting portion 13 Second mounting portion 16 Via conductors 16A, 16B, 16C, 16D Via conductor assembly 17 Wiring pattern 18 Metal layer 2 Detecting element 3 Electronic element 100 Detecting device

Claims (10)

A laminate,
a plurality of insulating layers;
a plurality of metal layers positioned between the plurality of insulating layers;
a first mounting portion on which an X-ray detection element is mounted and a second mounting portion on which an electronic element is mounted, on the opposite side of the first mounting portion;
a plurality of via conductors connecting the side on which the first mounting portion is located and the side on which the second mounting portion is located through the metal layer;
having at least one via-conductor assembly in which the plurality of via-conductors are arranged linearly in the stacking direction of the plurality of insulating layers;
In the laminate, at least a portion of the plurality of metal layers connected to the via-conductor assembly extends in different directions from the via-conductor assembly. The plurality of metal layers connected to the via-conductor assembly includes a first metal layer and a second metal layer, and the first metal layer rotates about the via-conductor assembly as an axis. 2. The substrate according to claim 1, which overlaps said second metal layer in plan view of said substrate when said substrate is in a plan view. 3. The plurality of metal layers connected to the via-conductor assembly according to claim 2, wherein each metal layer has a positional relationship in which each metal layer is periodically rotated around the via-conductor assembly as an axis in plan perspective view of the substrate. substrate. The plurality of metal layers connected to the via-conductor assembly includes a set of a first metal layer whose connection position with the via conductor in the metal layer is a first position and a second metal layer set whose connection position with the via conductor is a second position. 4. A substrate according to any one of claims 1 to 3, comprising a set of metal layers of . comprising a plurality of the via-conductor assemblies, including a first via-conductor assembly and a second via-conductor assembly;
the plurality of metal layers includes a third metal layer and a fourth metal layer;
In the plurality of metal layers located at the same position in the stacking direction of the insulating layers, the third metal layer connected to the first via-conductor aggregate and the third metal layer connected to the second via-conductor aggregate 5. A substrate according to any one of claims 1 to 4, wherein the fourth metal layer is not connected. comprising a plurality of the via-conductor assemblies, including a first via-conductor assembly and a second via-conductor assembly;
At least part of the plurality of metal layers connected to the first via-conductor assembly, and the plurality of metal layers connected to the second via-conductor assembly adjacent to the first via-conductor assembly 6. The substrate according to any one of claims 1 to 5, wherein at least a portion of the layer overlaps with the laminate when seen from above. comprising a plurality of the via-conductor assemblies, including a first via-conductor assembly and a second via-conductor assembly;
the plurality of metal layers includes a third metal layer and a fourth metal layer;
In the plurality of metal layers located at the same position in the stacking direction of the insulating layers, the third metal layer connected to the first via-conductor aggregate and the third metal layer connected to the second via-conductor aggregate and said fourth metal layer is positioned in the same direction with respect to said first via-conductor assembly or said second via-conductor assembly to which each metal layer is connected. 7. The substrate according to any one of 1 to 6. In at least some of the plurality of metal layers, a distance between a connection position with the via conductor and an outer edge of the metal layer is shorter than a distance between the connection position and the center of the metal layer. Item 8. The substrate according to any one of Items 1 to 7. A substrate according to any one of claims 1 to 8;
an X-ray detection element mounted on the first mounting portion;
and an electronic element mounted on the second mounting portion. a module substrate;
A detection module according to claim 9 connected to said module substrate via solder.

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