JP2022138845A - センサを備えた測定ウェーハ、およびその使用方法 - Google Patents

センサを備えた測定ウェーハ、およびその使用方法 Download PDF

Info

Publication number
JP2022138845A
JP2022138845A JP2021038953A JP2021038953A JP2022138845A JP 2022138845 A JP2022138845 A JP 2022138845A JP 2021038953 A JP2021038953 A JP 2021038953A JP 2021038953 A JP2021038953 A JP 2021038953A JP 2022138845 A JP2022138845 A JP 2022138845A
Authority
JP
Japan
Prior art keywords
polishing
wafer
measurement
measurement wafer
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021038953A
Other languages
English (en)
Japanese (ja)
Inventor
良和 加藤
Yoshikazu Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2021038953A priority Critical patent/JP2022138845A/ja
Priority to PCT/JP2022/005597 priority patent/WO2022190771A1/ja
Priority to TW111108117A priority patent/TW202241640A/zh
Publication of JP2022138845A publication Critical patent/JP2022138845A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2021038953A 2021-03-11 2021-03-11 センサを備えた測定ウェーハ、およびその使用方法 Pending JP2022138845A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021038953A JP2022138845A (ja) 2021-03-11 2021-03-11 センサを備えた測定ウェーハ、およびその使用方法
PCT/JP2022/005597 WO2022190771A1 (ja) 2021-03-11 2022-02-14 センサを備えた測定ウェーハ、およびその使用方法
TW111108117A TW202241640A (zh) 2021-03-11 2022-03-07 具備檢測器的量測晶圓、及其使用方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021038953A JP2022138845A (ja) 2021-03-11 2021-03-11 センサを備えた測定ウェーハ、およびその使用方法

Publications (1)

Publication Number Publication Date
JP2022138845A true JP2022138845A (ja) 2022-09-26

Family

ID=83227596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021038953A Pending JP2022138845A (ja) 2021-03-11 2021-03-11 センサを備えた測定ウェーハ、およびその使用方法

Country Status (3)

Country Link
JP (1) JP2022138845A (zh)
TW (1) TW202241640A (zh)
WO (1) WO2022190771A1 (zh)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005159147A (ja) * 2003-11-27 2005-06-16 Trecenti Technologies Inc 化学的機械的研磨用ダミーウエハおよび半導体装置の製造方法
WO2008042903A2 (en) * 2006-10-03 2008-04-10 Kla-Tencor Technologies Corporation Systems for sensing pressure/shear force
JP7052770B2 (ja) * 2019-04-15 2022-04-12 株式会社Sumco 評価体、評価システム、評価体の製造方法、および評価方法

Also Published As

Publication number Publication date
TW202241640A (zh) 2022-11-01
WO2022190771A1 (ja) 2022-09-15

Similar Documents

Publication Publication Date Title
US6926585B2 (en) Pressure control system and polishing apparatus
JP4762647B2 (ja) 研磨装置及び研磨方法
JP2018183820A (ja) 基板の研磨装置
JP2008305875A (ja) 半導体集積回路装置の製造方法
TW201801855A (zh) 研磨裝置及研磨方法
JP2006255851A (ja) 研磨装置
TW202003157A (zh) 使用研磨頭檢測研磨墊的研磨面的方法，以及研磨裝置
WO2014014661A1 (en) Sensors in carrier head of a cm p system
US9573241B2 (en) Polishing apparatus and polishing method
US11904431B2 (en) Method and apparatus for insitu adjustment of wafer slip detection during work piece polishing
US20200035495A1 (en) Chemical-mechanical polishing with variable-pressure polishing pads
JP7033972B2 (ja) 研磨装置
JP7353406B2 (ja) 研磨装置
CN106217234B (zh) 用于抛光衬底的系统和方法
TWI747884B (zh) 具有局部區域速率控制及振盪模式的研磨系統
US20200055160A1 (en) Chemical mechanical polishing method and apparatus
JP4943800B2 (ja) 研磨状況モニタシステム
JP2011143537A (ja) 研磨装置
WO2022190771A1 (ja) センサを備えた測定ウェーハ、およびその使用方法
TW202110580A (zh) 將局部荷重傳達至保持環的輥之異常檢測方法及研磨裝置
US7128637B2 (en) System and method detecting malfunction of pad conditioner in polishing apparatus
US20190126427A1 (en) Substrate processing apparatus
JP5126657B2 (ja) 研磨装置
KR102665604B1 (ko) 연마패드 컨디셔닝 장치
JP2009184088A (ja) 研磨装置