JP2022120551A - 光電変換装置、光電変換システム、移動体 - Google Patents

光電変換装置、光電変換システム、移動体 Download PDF

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Publication number
JP2022120551A
JP2022120551A JP2021017516A JP2021017516A JP2022120551A JP 2022120551 A JP2022120551 A JP 2022120551A JP 2021017516 A JP2021017516 A JP 2021017516A JP 2021017516 A JP2021017516 A JP 2021017516A JP 2022120551 A JP2022120551 A JP 2022120551A
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Japan
Prior art keywords
photoelectric conversion
region
conversion device
surface side
isolation region
Prior art date
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Pending
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JP2021017516A
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English (en)
Japanese (ja)
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JP2022120551A5 (enExample
Inventor
一也 五十嵐
Kazuya Igarashi
一 池田
Hajime Ikeda
駿一 若嶋
Shunichi Wakashima
康平 岡本
Kohei Okamoto
浩一 福田
Koichi Fukuda
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Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2021017516A priority Critical patent/JP2022120551A/ja
Priority to US17/589,177 priority patent/US12191325B2/en
Publication of JP2022120551A publication Critical patent/JP2022120551A/ja
Publication of JP2022120551A5 publication Critical patent/JP2022120551A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • H10F39/8023—Disposition of the elements in pixels, e.g. smaller elements in the centre of the imager compared to larger elements at the periphery
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8057—Optical shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/807—Pixel isolation structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors

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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2021017516A 2021-02-05 2021-02-05 光電変換装置、光電変換システム、移動体 Pending JP2022120551A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021017516A JP2022120551A (ja) 2021-02-05 2021-02-05 光電変換装置、光電変換システム、移動体
US17/589,177 US12191325B2 (en) 2021-02-05 2022-01-31 Apparatus, system, and moving body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021017516A JP2022120551A (ja) 2021-02-05 2021-02-05 光電変換装置、光電変換システム、移動体

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JP2022120551A true JP2022120551A (ja) 2022-08-18
JP2022120551A5 JP2022120551A5 (enExample) 2024-02-09

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US (1) US12191325B2 (enExample)
JP (1) JP2022120551A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023005460A (ja) * 2021-06-29 2023-01-18 ゼタテクノロジーズ株式会社 固体撮像装置、固体撮像装置の製造方法、および電子機器
JP7739558B1 (ja) 2024-03-01 2025-09-16 采▲ぎょく▼科技股▲ふん▼有限公司 画像デバイスおよびその製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230056858A (ko) * 2021-10-20 2023-04-28 삼성전자주식회사 이미지 센서

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001160973A (ja) * 1999-12-02 2001-06-12 Nikon Corp 固体撮像素子及び電子カメラ
JP2001189442A (ja) * 1999-12-28 2001-07-10 Nikon Corp 固体撮像素子及びその製造方法並びにデジタルカメラ
JP2001237404A (ja) * 2000-02-23 2001-08-31 Matsushita Electric Ind Co Ltd 増幅型固体撮像装置
JP2004253568A (ja) * 2003-02-19 2004-09-09 Sony Corp 固体撮像装置及び撮像カメラ
JP2006237315A (ja) * 2005-02-25 2006-09-07 Matsushita Electric Ind Co Ltd 固体撮像装置
JP2009015164A (ja) * 2007-07-06 2009-01-22 Nikon Corp 撮像装置
JP2014116472A (ja) * 2012-12-10 2014-06-26 Canon Inc 固体撮像装置およびその製造方法
JP2015216186A (ja) * 2014-05-09 2015-12-03 ソニー株式会社 固体撮像装置および電子機器
JP2017011207A (ja) * 2015-06-25 2017-01-12 三重富士通セミコンダクター株式会社 固体撮像装置および遮光方法
JP2019140251A (ja) * 2018-02-09 2019-08-22 キヤノン株式会社 光電変換装置、撮像システム、および移動体
JP2020113573A (ja) * 2019-01-08 2020-07-27 キヤノン株式会社 光電変換装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6127869B2 (ja) 2013-09-25 2017-05-17 ソニー株式会社 固体撮像素子及びその駆動方法、並びに電子機器
KR20170006520A (ko) * 2015-07-08 2017-01-18 삼성전자주식회사 광전 변환 소자 내에 위치하는 변환 소자 분리막을 포함하는 이미지 센서

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001160973A (ja) * 1999-12-02 2001-06-12 Nikon Corp 固体撮像素子及び電子カメラ
JP2001189442A (ja) * 1999-12-28 2001-07-10 Nikon Corp 固体撮像素子及びその製造方法並びにデジタルカメラ
JP2001237404A (ja) * 2000-02-23 2001-08-31 Matsushita Electric Ind Co Ltd 増幅型固体撮像装置
JP2004253568A (ja) * 2003-02-19 2004-09-09 Sony Corp 固体撮像装置及び撮像カメラ
JP2006237315A (ja) * 2005-02-25 2006-09-07 Matsushita Electric Ind Co Ltd 固体撮像装置
JP2009015164A (ja) * 2007-07-06 2009-01-22 Nikon Corp 撮像装置
JP2014116472A (ja) * 2012-12-10 2014-06-26 Canon Inc 固体撮像装置およびその製造方法
JP2015216186A (ja) * 2014-05-09 2015-12-03 ソニー株式会社 固体撮像装置および電子機器
JP2017011207A (ja) * 2015-06-25 2017-01-12 三重富士通セミコンダクター株式会社 固体撮像装置および遮光方法
JP2019140251A (ja) * 2018-02-09 2019-08-22 キヤノン株式会社 光電変換装置、撮像システム、および移動体
JP2020113573A (ja) * 2019-01-08 2020-07-27 キヤノン株式会社 光電変換装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023005460A (ja) * 2021-06-29 2023-01-18 ゼタテクノロジーズ株式会社 固体撮像装置、固体撮像装置の製造方法、および電子機器
JP7487151B2 (ja) 2021-06-29 2024-05-20 ゼタテクノロジーズ株式会社 固体撮像装置、固体撮像装置の製造方法、および電子機器
JP7739558B1 (ja) 2024-03-01 2025-09-16 采▲ぎょく▼科技股▲ふん▼有限公司 画像デバイスおよびその製造方法
JP2025138548A (ja) * 2024-03-01 2025-09-25 采▲ぎょく▼科技股▲ふん▼有限公司 画像デバイスおよびその製造方法

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US20220254820A1 (en) 2022-08-11

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