JP2022091496A - Manufacturing method of metal pattern laminated substrate - Google Patents

Manufacturing method of metal pattern laminated substrate Download PDF

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JP2022091496A
JP2022091496A JP2020204364A JP2020204364A JP2022091496A JP 2022091496 A JP2022091496 A JP 2022091496A JP 2020204364 A JP2020204364 A JP 2020204364A JP 2020204364 A JP2020204364 A JP 2020204364A JP 2022091496 A JP2022091496 A JP 2022091496A
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metal
pattern
adhesive
layer
metal layer
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快 岡原
Kai Okahara
博基 家田
Hiroki Ieda
昭 平尾
Akira Hirao
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Nitto Denko Corp
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Nitto Denko Corp
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Priority to JP2020204364A priority Critical patent/JP2022091496A/en
Priority to PCT/JP2021/043308 priority patent/WO2022124094A1/en
Priority to TW110145209A priority patent/TW202231142A/en
Publication of JP2022091496A publication Critical patent/JP2022091496A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Laminated Bodies (AREA)

Abstract

To provide a manufacturing method of a metal pattern laminated substrate that can easily manufacture a metal pattern laminated substrate at low cost.SOLUTION: A manufacturing method of a metal pattern laminated substrate 20 includes a first step of preparing a metal layer laminated plate having an insulating substrate 2, an adhesive layer 3, and a metal layer 4 in order toward one side in the thickness direction, a second step of continuously forming a notch 19 in the adhesive layer 3 and the metal layer 4 to form an adhesive pattern 23 and a metal pattern 24 having the same shape when projected in the thickness direction, and a third step of peeling the adhesive layer 3 other than the adhesive pattern 23 and the metal layer 4 other than the metal pattern 24 from the insulating substrate 2.SELECTED DRAWING: Figure 1

Description

本発明は、金属パターン積層基板の製造方法に関する。 The present invention relates to a method for manufacturing a metal pattern laminated substrate.

絶縁基板と、金属層とを上側に向かって順に備える金属層積層基板が知られている（例えば、下記特許文献１参照。）。特許文献１では、金属層の表面に絶縁基板の材料を塗布および乾燥して、樹脂基板を形成している。特許文献１の金属層は、上記した製造方法に起因して、樹脂基板に対する密着性に優れる。 A metal layer laminated substrate having an insulating substrate and a metal layer in order from the upper side is known (see, for example, Patent Document 1 below). In Patent Document 1, a resin substrate is formed by applying and drying an insulating substrate material on the surface of a metal layer. The metal layer of Patent Document 1 has excellent adhesion to the resin substrate due to the above-mentioned manufacturing method.

特開２０１４－１８１２６８号公報Japanese Unexamined Patent Publication No. 2014-181268

特許文献１に記載の金属層積層基板における金属層から金属パターンに形成するには、例えば、エッチングレジストを金属層の上面に形成する。その後、エッチングレジストから露出する金属層をエッチング液で除去する。その後、エッチングレジストを除去する。これにより、絶縁基板と、金属パターンとを上側に向かって順に備える金属パターン積層基板が製造される。金属パターン積層基板は、種々の分野に用いられる。 In order to form a metal pattern from a metal layer in the metal layer laminated substrate described in Patent Document 1, for example, an etching resist is formed on the upper surface of the metal layer. Then, the metal layer exposed from the etching resist is removed with an etching solution. After that, the etching resist is removed. As a result, a metal pattern laminated substrate having an insulating substrate and a metal pattern in order from the upper side is manufactured. Metal pattern laminated substrates are used in various fields.

一方、金属パターン積層基板を低コストで簡便に製造したい要求がある。しかし、上記した方法では、上記した要求を満足できないという不具合がある。 On the other hand, there is a demand for easy production of a metal pattern laminated substrate at low cost. However, the above method has a problem that the above requirements cannot be satisfied.

本発明は、金属パターン積層基板を低コストで簡便に製造できる金属パターン積層基板の製造方法を提供する。 The present invention provides a method for manufacturing a metal pattern laminated substrate, which can easily manufacture a metal pattern laminated substrate at low cost.

本発明（１）は、絶縁基板と、粘着剤層と、金属層とを厚み方向一方側に向かって順に備える積層体を用意する第１工程と、前記粘着剤層と前記金属層とに切り込みを連続して形成して、厚み方向に投影したときに互いに同一形状の粘着パターンと金属パターンとを形成する第２工程と、前記粘着パターン以外の前記粘着剤層と、前記金属パターン以外の前記金属層とを前記絶縁基板から剥離する第３工程とを備える、金属パターン積層基板の製造方法を含む。 The present invention (1) is a first step of preparing a laminate having an insulating substrate, an adhesive layer, and a metal layer in order toward one side in the thickness direction, and a cut in the adhesive layer and the metal layer. The second step of continuously forming an adhesive pattern and a metal pattern having the same shape when projected in the thickness direction, the adhesive layer other than the adhesive pattern, and the said other than the metal pattern. The present invention includes a method for manufacturing a metal pattern laminated substrate, which comprises a third step of peeling the metal layer from the insulating substrate.

この製造方法によれば、積層体では、粘着剤層が金属層を絶縁基板に粘着させているので、粘着剤層と金属層とに切り込みを連続して形成して、同一形状の粘着パターンと金属パターンとを形成することにより、粘着パターン以外の粘着剤層を、金属パターン以外の金属層とともに、絶縁基板から剥離できる。そのため、この製造方法は、エッチングレジストを配置および除去する必要がない。その結果、この製造方法は、金属パターンを備える金属パターン積層基板を低コストで簡便に製造できる。 According to this manufacturing method, in the laminated body, since the adhesive layer adheres the metal layer to the insulating substrate, cuts are continuously formed in the adhesive layer and the metal layer to obtain an adhesive pattern having the same shape. By forming the metal pattern, the adhesive layer other than the adhesive pattern can be peeled off from the insulating substrate together with the metal layer other than the metal pattern. Therefore, this manufacturing method does not require the placement and removal of the etching resist. As a result, this manufacturing method can easily manufacture a metal pattern laminated substrate having a metal pattern at low cost.

本発明（２）は、第３工程の後に、前記粘着パターンを加熱して、前記粘着パターンの前記絶縁基板に対する粘着力を向上させる第４工程をさらに備える、（１）に記載の金属パターン積層基板の製造方法を含む。 The metal pattern laminating according to (1), further comprising a fourth step of heating the adhesive pattern to improve the adhesive force of the adhesive pattern on the insulating substrate after the third step. Includes a method of manufacturing a substrate.

この製造方法によれば、第４工程で、粘着パターンの絶縁基板に対する粘着力を向上させる。そのため、この製造方法によれば、信頼性に優れる金属パターンを形成できる。 According to this manufacturing method, in the fourth step, the adhesive strength of the adhesive pattern to the insulating substrate is improved. Therefore, according to this manufacturing method, a metal pattern having excellent reliability can be formed.

本発明の方法によれば、金属パターンを備える金属パターン積層基板を低コストで簡便に製造できる。 According to the method of the present invention, a metal pattern laminated substrate provided with a metal pattern can be easily manufactured at low cost.

図１Ａから図１Ｅは、本発明の金属パターン積層基板の製造方法の一実施形態を説明する断面図である。図１Ａが、粘着テープを用意する工程である。図１Ｂが、第１工程である。図１Ｃが第２工程である。図１Ｄが第３工程である。図１Ｅが第４工程である。1A to 1E are cross-sectional views illustrating an embodiment of a method for manufacturing a metal pattern laminated substrate of the present invention. FIG. 1A is a step of preparing an adhesive tape. FIG. 1B is the first step. FIG. 1C is the second step. FIG. 1D is the third step. FIG. 1E is the fourth step.

本発明の金属パターン積層基板の製造方法の一実施形態を、図１Ａから図１Ｅを参照して説明する。金属パターン積層基板２０の製造方法は、第１工程と、第２工程と、第３工程と、第４工程とを備える。 An embodiment of the method for manufacturing a metal pattern laminated substrate of the present invention will be described with reference to FIGS. 1A to 1E. The method for manufacturing the metal pattern laminated substrate 20 includes a first step, a second step, a third step, and a fourth step.

＜第１工程＞
図１Ｂに示すように、第１工程では、積層体の一例としての金属層積層基板１を用意する。 <First step>
As shown in FIG. 1B, in the first step, a metal layer laminated substrate 1 is prepared as an example of the laminated body.

金属層積層基板１は、厚みを有する。金属層積層基板１は、厚み方向において、互いに対向配置される一方面１１と、他方面１２とを有する。金属層積層基板１は、厚み方向に直交する面方向に延びる形状を有する。金属層積層基板１は、絶縁基板２と、粘着剤層３と、金属層４とを厚み方向一方側に向かって順に備える。好ましくは、金属層積層基板１は、絶縁基板２と、粘着剤層３と、金属層４とのみを備える。 The metal layer laminated substrate 1 has a thickness. The metal layer laminated substrate 1 has one surface 11 and the other surface 12 which are arranged to face each other in the thickness direction. The metal layer laminated substrate 1 has a shape extending in a plane direction orthogonal to the thickness direction. The metal layer laminated substrate 1 includes an insulating substrate 2, an adhesive layer 3, and a metal layer 4 in this order toward one side in the thickness direction. Preferably, the metal layer laminated substrate 1 includes only the insulating substrate 2, the pressure-sensitive adhesive layer 3, and the metal layer 4.

絶縁基板２は、金属層積層基板１の他方面１２を形成する。絶縁基板２は、面方向に延びる。絶縁基板２は、厚み方向において、互いに対向配置される絶縁一方面１３と、絶縁他方面１４とを有する。絶縁他方面１４は、上記した他方面１２を形成する。絶縁基板２の材料としては、例えば、樹脂、および、セラミックスが挙げられる。樹脂としては、例えば、ポリイミド樹脂、フェノール樹脂、エポキシ樹脂、ビスマレイミド樹脂、トリアジン樹脂、フッ素樹脂、および、ポリフェニレンオキシド樹脂が挙げられる。セラミックスとしては、例えば、アルミナが挙げられる。絶縁基板２の厚みは、例えば、１０μｍ以上であり、また、例えば、１０００μｍ以下である。 The insulating substrate 2 forms the other surface 12 of the metal layer laminated substrate 1. The insulating substrate 2 extends in the plane direction. The insulating substrate 2 has an insulating one surface 13 and an insulating other surface 14 which are arranged to face each other in the thickness direction. The insulating other surface 14 forms the other surface 12 described above. Examples of the material of the insulating substrate 2 include resin and ceramics. Examples of the resin include a polyimide resin, a phenol resin, an epoxy resin, a bismaleimide resin, a triazine resin, a fluororesin, and a polyphenylene oxide resin. Examples of ceramics include alumina. The thickness of the insulating substrate 2 is, for example, 10 μm or more, and is, for example, 1000 μm or less.

粘着剤層３は、絶縁基板２の絶縁一方面１３に配置されている。具体的には、粘着剤層３は、絶縁一方面１３の全部に接触している。粘着剤層３は、厚み方向において、互いに対向配置される粘着一方面１５と、粘着他方面１６とを有する。粘着剤層３の材料は、限定されない。粘着剤層３の材料としては、例えば、加熱によって粘着力が向上する粘着剤組成物が挙げられる。粘着剤層３の２５℃におけるポリイミド板に対する粘着力は、例えば、１０Ｎ／２５ｍｍ以下であり、また、例えば、１Ｎ／２５ｍｍ以上である。粘着剤層３の上記した材料および粘着力は、例えば、特開２０１４－２２４２２７号公報、および、特開２０２０－２６４８４号公報に記載される。粘着剤層３の厚みは、例えば、１μｍ以上であり、また、例えば、２０μｍ以下である。 The pressure-sensitive adhesive layer 3 is arranged on one insulating surface 13 of the insulating substrate 2. Specifically, the pressure-sensitive adhesive layer 3 is in contact with all of the insulating one-sided surface 13. The pressure-sensitive adhesive layer 3 has a pressure-sensitive adhesive side surface 15 and a pressure-sensitive adhesive side surface 16 which are arranged so as to face each other in the thickness direction. The material of the pressure-sensitive adhesive layer 3 is not limited. Examples of the material of the pressure-sensitive adhesive layer 3 include a pressure-sensitive adhesive composition whose adhesive strength is improved by heating. The adhesive force of the pressure-sensitive adhesive layer 3 to the polyimide plate at 25 ° C. is, for example, 10 N / 25 mm or less, and for example, 1 N / 25 mm or more. The above-mentioned materials and adhesive strength of the pressure-sensitive adhesive layer 3 are described in, for example, Japanese Patent Application Laid-Open No. 2014-224227 and Japanese Patent Application Laid-Open No. 2020-264484. The thickness of the pressure-sensitive adhesive layer 3 is, for example, 1 μm or more, and is, for example, 20 μm or less.

金属層４は、面方向に延びる金属箔である。金属層４は、粘着剤層３の粘着一方面１５に配置されている。具体的には、金属層４は、粘着一方面１５の全部に接触している。金属層４は、厚み方向において、互いに対向配置される金属一方面１７と、金属他方面１８とを有する。金属一方面１７は、上記した一方面１１を形成する。金属層４の材料としては、例えば、銅、アルミニウム、金、ニッケル、チタン、モリブテン、ニオブ、タンタル、ジルコニウム、および、合金が挙げられる。合金としては、例えば、ステンレス、パーマロイ、および、ニクロムが挙げられる。金属層４の材料として、優れた電気伝導性を得る観点から、好ましくは、銅が挙げられる。金属層４の厚みは、例えば、１μｍ以上、好ましくは、１０μｍ以上であり、また、例えば、１０００μｍ以下、好ましくは、１００μｍ以下である。 The metal layer 4 is a metal foil extending in the plane direction. The metal layer 4 is arranged on the adhesive one side 15 of the adhesive layer 3. Specifically, the metal layer 4 is in contact with all of the adhesive one-sided surface 15. The metal layer 4 has a metal one surface 17 and a metal other surface 18 arranged so as to face each other in the thickness direction. The metal one side 17 forms the above-mentioned one side 11. Examples of the material of the metal layer 4 include copper, aluminum, gold, nickel, titanium, molybdenum, niobium, tantalum, zirconium, and alloys. Alloys include, for example, stainless steel, permalloy, and nichrome. As the material of the metal layer 4, copper is preferably mentioned from the viewpoint of obtaining excellent electrical conductivity. The thickness of the metal layer 4 is, for example, 1 μm or more, preferably 10 μm or more, and for example, 1000 μm or less, preferably 100 μm or less.

金属層積層基板１を用意するには、例えば、まず、図１Ａに示す粘着テープ５と、絶縁基板２とを用意する。粘着テープ５は、上記した粘着剤層３と、上記した金属層４とを、厚み方向一方側に向かって順に備える。なお、本願において、テープは、シートおよびフィルムと共通する概念である。テープ、シートおよびフィルムは、峻別されない。粘着テープ５を用意するには、粘着剤層３の材料を金属層４の金属他方面１８に配置する。なお、この粘着剤層３の粘着力は、まだ向上していない。具体的には、粘着剤層３の２５℃におけるポリイミド板に対する粘着力が、例えば、１０Ｎ／２５ｍｍ以下と低い。その後、粘着テープ５を絶縁基板２に貼着する。具体的には、粘着剤層３の粘着他方面１６と、絶縁基板２の絶縁一方面１３とを接触させる。 To prepare the metal layer laminated substrate 1, for example, first, the adhesive tape 5 shown in FIG. 1A and the insulating substrate 2 are prepared. The adhesive tape 5 includes the above-mentioned pressure-sensitive adhesive layer 3 and the above-mentioned metal layer 4 in order toward one side in the thickness direction. In the present application, tape is a concept common to sheets and films. Tapes, sheets and films are not distinct. To prepare the adhesive tape 5, the material of the adhesive layer 3 is arranged on the other metal surface 18 of the metal layer 4. The adhesive strength of the pressure-sensitive adhesive layer 3 has not been improved yet. Specifically, the adhesive strength of the pressure-sensitive adhesive layer 3 to the polyimide plate at 25 ° C. is as low as 10 N / 25 mm or less, for example. After that, the adhesive tape 5 is attached to the insulating substrate 2. Specifically, the adhesive other surface 16 of the adhesive layer 3 and the insulating one surface 13 of the insulating substrate 2 are brought into contact with each other.

第１工程では、上記によって、図１Ｂに示すように、絶縁基板２と、粘着剤層３と、金属層４とを備える金属層積層基板１を用意する。 In the first step, as shown in FIG. 1B, a metal layer laminated substrate 1 including an insulating substrate 2, an adhesive layer 3, and a metal layer 4 is prepared as described above.

金属層積層基板１の厚みは、例えば、１０μｍ以上であり、また、例えば、１５００μｍ以下である。 The thickness of the metal layer laminated substrate 1 is, for example, 10 μm or more, and is, for example, 1500 μm or less.

＜第２工程＞
図１Ｃに示すように、第２工程では、粘着剤層３と金属層４とに切り込み１９を形成する。切り込み１９は、粘着剤層３と金属層４とに連続して形成される。切り込み１９は、厚み方向に沿う。切り込み１９を形成する方法として、例えば、接触式の切断装置、および、非接触式の切断装置が挙げられる。接触式の切断装置は、例えば、トムソン刃またはピナクル刃を含む。非接触式の切断装置としては、レーザ照射装置が挙げられる。 <Second step>
As shown in FIG. 1C, in the second step, a notch 19 is formed in the pressure-sensitive adhesive layer 3 and the metal layer 4. The notch 19 is continuously formed in the pressure-sensitive adhesive layer 3 and the metal layer 4. The notch 19 is along the thickness direction. Examples of the method for forming the notch 19 include a contact type cutting device and a non-contact type cutting device. Contact cutting devices include, for example, Thomson blades or Pinnacle blades. Examples of the non-contact cutting device include a laser irradiation device.

切り込み１９の形成によって、図１Ｄが参照されるように、粘着剤層３に粘着パターン２３が区画され、金属層４に金属パターン２４が区画される。粘着パターン２３と金属パターン２４とは、平面視において同一形状を有する。具体的には、粘着パターン２３は、粘着外周面２８を有する。粘着外周面２８は、粘着パターン２３における粘着一方面１５の外周縁と、粘着パターン２３における粘着他方面１６の外周縁とを、厚み方向に連結する。金属パターン２４は、金属外周面２９を有する。金属外周面２９は、金属パターン２４における金属一方面１７の外周縁と、金属パターン２４における金属他方面１８の外周縁とを厚み方向に連結する。そして、粘着外周面２８と、金属外周面２９とは、面一であって、厚み方向に連続している。つまり、粘着外周面２８と、金属外周面２９とは、平面視において、一致している。粘着パターン２３と金属パターン２４とは、切り込み１９により区画される。粘着パターン２３と金属パターン２４との平面視形状は、金属パターン積層基板２０の用途および目的に応じて適宜設計される。 By forming the notch 19, the pressure-sensitive adhesive pattern 23 is partitioned into the pressure-sensitive adhesive layer 3 and the metal pattern 24 is partitioned into the metal layer 4, as shown in FIG. 1D. The adhesive pattern 23 and the metal pattern 24 have the same shape in a plan view. Specifically, the adhesive pattern 23 has an adhesive outer peripheral surface 28. The adhesive outer peripheral surface 28 connects the outer peripheral edge of the adhesive one surface 15 in the adhesive pattern 23 and the outer peripheral edge of the adhesive other surface 16 in the adhesive pattern 23 in the thickness direction. The metal pattern 24 has a metal outer peripheral surface 29. The metal outer peripheral surface 29 connects the outer peripheral edge of the metal one surface 17 in the metal pattern 24 and the outer peripheral edge of the metal other surface 18 in the metal pattern 24 in the thickness direction. The adhesive outer peripheral surface 28 and the metal outer peripheral surface 29 are flush with each other and are continuous in the thickness direction. That is, the adhesive outer peripheral surface 28 and the metal outer peripheral surface 29 coincide with each other in a plan view. The adhesive pattern 23 and the metal pattern 24 are separated by a notch 19. The plan-view shape of the adhesive pattern 23 and the metal pattern 24 is appropriately designed according to the use and purpose of the metal pattern laminated substrate 20.

＜第３工程＞
図１Ｄに示すように、第３工程では、粘着パターン２３以外の粘着剤層３と、金属パターン２４以外の金属層４とを絶縁基板２から剥離する。第３工程では、次に説明する第４工程の加熱がされていないことから、粘着剤層３の絶縁基板２に対する粘着力が低い場合がある。具体的には、２５℃におけるポリイミド板に対する粘着力が、例えば、１０Ｎ／２５ｍｍ以下である。そのため、粘着パターン２３以外の粘着剤層３における粘着他方面１６は、それに接触する絶縁一方面１３から容易に界面剥離する。一方、第３工程においては、粘着パターン２３と、金属パターン２４とを、絶縁基板２の厚み方向一方側に残す。 <Third step>
As shown in FIG. 1D, in the third step, the pressure-sensitive adhesive layer 3 other than the pressure-sensitive adhesive pattern 23 and the metal layer 4 other than the metal pattern 24 are peeled off from the insulating substrate 2. In the third step, since the heating in the fourth step described below is not performed, the adhesive force of the pressure-sensitive adhesive layer 3 to the insulating substrate 2 may be low. Specifically, the adhesive strength to the polyimide plate at 25 ° C. is, for example, 10 N / 25 mm or less. Therefore, the adhesive other surface 16 in the adhesive layer 3 other than the adhesive pattern 23 is easily interfacially peeled from the insulating one surface 13 in contact with the adhesive other surface 16. On the other hand, in the third step, the adhesive pattern 23 and the metal pattern 24 are left on one side in the thickness direction of the insulating substrate 2.

＜第４工程＞
その後、第４工程では、粘着パターン２３を加熱する。粘着パターン２３の加熱方法は、特に限定されない。例えば、絶縁基板２と、粘着パターン２３と、金属パターン２４とを、加熱炉に投入する。加熱時間および加熱温度は、粘着パターン２３の粘着力が向上する条件に調整される。 <4th step>
Then, in the fourth step, the adhesive pattern 23 is heated. The heating method of the adhesive pattern 23 is not particularly limited. For example, the insulating substrate 2, the adhesive pattern 23, and the metal pattern 24 are put into a heating furnace. The heating time and heating temperature are adjusted to conditions for improving the adhesive strength of the adhesive pattern 23.

第４工程の上記した粘着パターン２３の加熱によって、粘着パターン２３の絶縁基板２および金属パターン２４に対する粘着力が向上する。詳しくは、加熱前の粘着パターン２３の２５℃のポリイミド板に対する粘着力に対する、加熱後の粘着パターン２３の２５℃のポリイミド板に対する粘着力の比は、例えば、１．５以上、好ましくは、２以上であり、また、例えば、１００以下である。より具体的には、加熱後の粘着パターン２３の２５℃のポリイミド板に対する粘着力は、例えば、１５Ｎ／２５ｍｍ以上、好ましくは、２５Ｎ／２５ｍｍ以上であり、また、例えば、１００Ｎ／２５ｍｍ以下ある。加熱後の粘着パターン２３の粘着力の向上の機構は、例えば、特開２０１４－２２４２２７号公報、および、特開２０２０－２６４８４号公報に記載される。 By heating the adhesive pattern 23 described above in the fourth step, the adhesive strength of the adhesive pattern 23 to the insulating substrate 2 and the metal pattern 24 is improved. Specifically, the ratio of the adhesive force of the adhesive pattern 23 before heating to the polyimide plate at 25 ° C. to the adhesive force of the adhesive pattern 23 after heating to the polyimide plate at 25 ° C. is, for example, 1.5 or more, preferably 2. The above, and for example, 100 or less. More specifically, the adhesive force of the adhesive pattern 23 after heating to the polyimide plate at 25 ° C. is, for example, 15 N / 25 mm or more, preferably 25 N / 25 mm or more, and for example, 100 N / 25 mm or less. The mechanism for improving the adhesive strength of the adhesive pattern 23 after heating is described in, for example, Japanese Patent Application Laid-Open No. 2014-224227 and Japanese Patent Application Laid-Open No. 2020-26484.

これによって、絶縁基板２と、加熱後の粘着パターン２３と、金属パターン２４とを備える金属パターン積層基板２０を製造する。 As a result, the metal pattern laminated substrate 20 including the insulating substrate 2, the adhesive pattern 23 after heating, and the metal pattern 24 is manufactured.

＜用途＞
金属パターン積層基板２０の用途は、限定されない。金属パターン積層基板２０の用途として、例えば、プリント基板、シールド層、導電層、および、放熱層などが挙げられる。 <Use>
The use of the metal pattern laminated substrate 20 is not limited. Applications of the metal pattern laminated substrate 20 include, for example, a printed circuit board, a shield layer, a conductive layer, a heat dissipation layer, and the like.

＜作用効果＞
この製造方法によれば、図１Ｃに示すように、金属層積層基板１では、粘着剤層３が金属層４を絶縁基板２に剥離可能に粘着させている。そのため、粘着剤層３と金属層４とに切り込み１９を連続して形成して、同一形状の粘着パターン２３と金属パターン２４とを形成することにより、粘着パターン２３以外の粘着剤層３を、金属パターン２４以外の金属層４とともに、絶縁基板２から剥離できる。そのため、この製造方法は、エッチングレジストを配置および除去する必要がない。なお、特許文献１に記載の金属層は、樹脂基板に対する密着性に優れるので、切り込み後の金属パターン２４を樹脂基板２から剥離できないため、上記したエッチングレジストを用いる必要がある。 <Action effect>
According to this manufacturing method, as shown in FIG. 1C, in the metal layer laminated substrate 1, the pressure-sensitive adhesive layer 3 makes the metal layer 4 detachably adhere to the insulating substrate 2. Therefore, the pressure-sensitive adhesive layer 3 other than the pressure-sensitive adhesive pattern 23 is formed by continuously forming the cuts 19 in the pressure-sensitive adhesive layer 3 and the metal layer 4 to form the pressure-sensitive adhesive pattern 23 and the metal pattern 24 having the same shape. It can be peeled off from the insulating substrate 2 together with the metal layer 4 other than the metal pattern 24. Therefore, this manufacturing method does not require the placement and removal of the etching resist. Since the metal layer described in Patent Document 1 has excellent adhesion to the resin substrate, the metal pattern 24 after cutting cannot be peeled off from the resin substrate 2, so it is necessary to use the etching resist described above.

従って、一実施形態の製造方法は、金属パターン２４を備える金属パターン積層基板２０を低コストで簡便に製造できる。 Therefore, according to the manufacturing method of one embodiment, the metal pattern laminated substrate 20 provided with the metal pattern 24 can be easily manufactured at low cost.

また、この製造方法によれば、図１Ｅに示すように、第４工程で、粘着パターン２３の絶縁基板２に対する粘着力を向上させる。そのため、この製造方法によれば、信頼性に優れる金属パターン２４を形成できる。 Further, according to this manufacturing method, as shown in FIG. 1E, the adhesive force of the adhesive pattern 23 to the insulating substrate 2 is improved in the fourth step. Therefore, according to this manufacturing method, the metal pattern 24 having excellent reliability can be formed.

＜変形例＞
以下の変形例において、上記した一実施形態と同様の部材および工程については、同一の参照符号を付し、その詳細な説明を省略する。また、変形例は、特記する以外、一実施形態と同様の作用効果を奏することができる。さらに、一実施形態およびその変形例を適宜組み合わせることができる。 <Modification example>
In the following modification, the same members and processes as those in the above-described embodiment are designated by the same reference numerals, and detailed description thereof will be omitted. Further, the modified example can exhibit the same action and effect as that of one embodiment, except for special mention. Further, one embodiment and a modification thereof can be appropriately combined.

一実施形態では、図１Ａに示すように、第１工程の金属層積層基板１の用意においてまず、粘着剤層３を金属層４の金属他方面１８に配置し、その後、絶縁基板２を粘着剤層３に貼り合わせる。変形例では、図示しないが、まず、粘着剤層３を絶縁基板２の絶縁一方面１３に配置し、次いで、粘着剤層３に金属層４を貼り合わせる。本発明では、金属層積層基板１の用意において、厚み方向で粘着剤層３を絶縁基板２および金属層４で挟み込めばよい。 In one embodiment, as shown in FIG. 1A, in the preparation of the metal layer laminated substrate 1 in the first step, the adhesive layer 3 is first arranged on the other metal surface 18 of the metal layer 4, and then the insulating substrate 2 is adhered. It is attached to the agent layer 3. In the modified example, although not shown, first, the pressure-sensitive adhesive layer 3 is arranged on one insulating surface 13 of the insulating substrate 2, and then the metal layer 4 is bonded to the pressure-sensitive adhesive layer 3. In the present invention, when preparing the metal layer laminated substrate 1, the pressure-sensitive adhesive layer 3 may be sandwiched between the insulating substrate 2 and the metal layer 4 in the thickness direction.

好ましくは、粘着剤層３を金属層４に配置して、それらを備える粘着テープ５を調製し、その後、粘着テープ５を絶縁基板２に貼り合わせる。 Preferably, the pressure-sensitive adhesive layer 3 is arranged on the metal layer 4, a pressure-sensitive adhesive tape 5 including the pressure-sensitive adhesive layer 3 is prepared, and then the pressure-sensitive adhesive tape 5 is attached to the insulating substrate 2.

変形例の製造方法は、第４工程を備えず、第１工程から第３工程を備える。つまり、第３工程後において、図１Ｄに示すように、絶縁基板２と、粘着パターン２３と、金属パターン２４とを厚み方向一方側に順に備える金属パターン積層基板２０を製品として得る。 The manufacturing method of the modified example does not include the fourth step, but includes the first step to the third step. That is, after the third step, as shown in FIG. 1D, a metal pattern laminated substrate 20 having an insulating substrate 2, an adhesive pattern 23, and a metal pattern 24 in order on one side in the thickness direction is obtained as a product.

好ましくは、製造方法は、第４工程を備える。図１Ｅに示すように、第４工程で、粘着パターン２３の絶縁基板２に対する粘着力を向上させるので、信頼性に優れる金属パターン２４を形成できる。 Preferably, the manufacturing method comprises a fourth step. As shown in FIG. 1E, since the adhesive force of the adhesive pattern 23 to the insulating substrate 2 is improved in the fourth step, the metal pattern 24 having excellent reliability can be formed.

１ 金属層積層基板
２ 絶縁基板
３ 粘着剤層
４ 金属層
１９ 切り込み
２０ 金属パターン積層基板
２３ 粘着パターン
２４ 金属パターン
1 Metal layer laminated board 2 Insulation board 3 Adhesive layer 4 Metal layer 19 Notch 20 Metal pattern Laminated board 23 Adhesive pattern 24 Metal pattern

Claims (2)

絶縁基板と、粘着剤層と、金属層とを厚み方向一方側に向かって順に備える積層体を用意する第１工程と、
前記粘着剤層と前記金属層とに切り込みを連続して形成して、厚み方向に投影したときに互いに同一形状の粘着パターンと金属パターンとを形成する第２工程と、
前記粘着パターン以外の前記粘着剤層と、前記金属パターン以外の前記金属層とを前記絶縁基板から剥離する第３工程とを備える、金属パターン積層基板の製造方法。 The first step of preparing a laminate having an insulating substrate, an adhesive layer, and a metal layer in order toward one side in the thickness direction.
A second step of continuously forming cuts in the pressure-sensitive adhesive layer and the metal layer to form a pressure-sensitive adhesive pattern and a metal pattern having the same shape when projected in the thickness direction.
A method for manufacturing a metal pattern laminated substrate, comprising a third step of peeling the pressure-sensitive adhesive layer other than the pressure-sensitive adhesive pattern and the metal layer other than the metal pattern from the insulating substrate. 第３工程の後に、前記粘着パターンを加熱して、前記粘着パターンの前記絶縁基板に対する粘着力を向上させる第４工程をさらに備える、請求項１に記載の金属パターン積層基板の製造方法。
The method for manufacturing a metal pattern laminated substrate according to claim 1, further comprising a fourth step of heating the adhesive pattern to improve the adhesive force of the adhesive pattern on the insulating substrate after the third step.
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