JP2022087015A - Deposition apparatus - Google Patents

Abstract

To improve accessibility during maintenance of a defensive plate.SOLUTION: An in-line type deposition apparatus for depositing onto a substrate, while transporting the substrate, includes a conveyance unit for conveying the substrate, a vapor deposition unit containing a vapor deposition source, and movable to a first position under the conveyance unit, and to a second position displaced in the lateral direction to the first position, and a defensive plate for preventing a vapor deposition material discharged from the vapor deposition source from adhering to an inner wall of the vapor deposition unit, while allowing adhesion to the substrate. The defensive plate is supported by the vapor deposition unit, and is movable to the first position and to the second position.SELECTED DRAWING: Figure 7

Description

The present invention relates to a film forming apparatus.

Conventionally, an in-line type device that processes a substrate while transporting the substrate is known. Patent Document 1 discloses a technique in which a film forming source can be moved from a film forming position in a vacuum chamber to a maintenance position outside the vacuum chamber in an in-line substrate processing apparatus.

Japanese Unexamined Patent Publication No. 2016-14174

By the way, in such a film forming apparatus, a protective plate may be provided in order to suppress the adhesion of the vapor-deposited substance to a member other than the substrate such as a vacuum chamber. In the above-mentioned conventional technique, when the film forming source is moved to the maintenance position, the protective plate stays in the vacuum chamber on the substrate transport side, so that it may be difficult to access the protective plate during maintenance of the protective plate.

The present invention provides a technique for improving accessibility during maintenance of a protective plate.

According to one aspect of the invention
A transport unit that transports the board and
A film formation source unit that includes a vapor deposition source and is movable to a first position below the transport unit and a second position that is laterally displaced with respect to the first position.
Provided with a protective plate that prevents the vapor-deposited substance released from the vapor-film source from adhering to the inner wall of the film-forming source unit while allowing the vapor-film material to adhere to the substrate.
It is an in-line type film forming device that forms a film on the substrate while transporting the substrate.
The adhesive plate is supported by the film-forming source unit and can move to the first position and the second position together with the film-forming source unit.
A film forming apparatus characterized by this is provided.

According to the present invention, accessibility during maintenance of the protective plate can be improved.

The front view which shows typically the film-forming apparatus which concerns on one Embodiment. The side view of the film forming apparatus of FIG. The figure which shows typically the internal structure of the film forming apparatus of FIG. The figure explaining the moving operation of the vapor deposition source unit by a moving unit. The perspective view which shows the structure of the protection plate. The perspective view which shows the structure of the protection plate. (A) to (C) are diagrams schematically showing the arrangement of the protective plate with respect to the transport unit. An operation explanatory diagram of the protective plate. The front view which shows typically the film-forming apparatus which concerns on one Embodiment. The plan view of the film forming apparatus of FIG.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. It should be noted that the following embodiments do not limit the invention according to the claims, and not all combinations of features described in the embodiments are essential to the invention. Two or more of the plurality of features described in the embodiments may be arbitrarily combined. In addition, the same or similar configuration will be given the same reference number, and duplicated explanations will be omitted.

Further, in each figure, the X direction indicates the transport direction of the substrate, the Y direction indicates the width direction of the substrate, and the Z direction indicates the vertical direction.

<First Embodiment>
<Overview of film forming equipment>
FIG. 1 is a front view schematically showing a film forming apparatus 1 according to an embodiment. FIG. 2 is a side view of the film forming apparatus 1 of FIG. FIG. 3 is a diagram schematically showing the internal structure of the film forming apparatus 1 of FIG.

The film forming apparatus 1 is an in-line type film forming apparatus that performs vapor deposition on a substrate while conveying the substrate. The film forming apparatus 1 is used, for example, for manufacturing a display panel of an organic EL display device for a smartphone, and a plurality of the film forming apparatus 1 may be arranged side by side to form a production line thereof.

In the present embodiment, the substrate held in the substrate holding tray 100 is sequentially conveyed to the film forming apparatus 1, and the film forming apparatus 1 deposits organic EL on the conveyed substrate. The substrate is held in the substrate holding tray 100 in a state of being overlapped with the mask in a process upstream of the transfer to the film forming apparatus 1, and is conveyed to the film forming apparatus 1. Therefore, in the film forming apparatus 1, a thin film of a vapor-deposited substance having a predetermined pattern is formed on the substrate by the mask. As the material of the substrate to be vapor-deposited by the film forming apparatus 1, glass, resin, metal or the like can be appropriately selected, and a material in which a resin layer such as polyimide is formed on glass is preferably used. The vapor-deposited substance is a substance such as an organic material or an inorganic material (metal, metal oxide, etc.). The film forming apparatus 1 can be applied to, for example, an electronic device such as a display device (flat panel display or the like), a thin film solar cell, an organic photoelectric conversion element (organic thin film imaging element), or a manufacturing apparatus for manufacturing an optical member or the like. In particular, it is applicable to a manufacturing apparatus for manufacturing an organic EL panel. In the following description, an example in which the film forming apparatus 1 forms a film on a substrate by vacuum deposition will be described, but the mode of the film forming method is not limited to this, and various film forming methods such as sputtering and CVD can be applied. Is.

The film forming apparatus 1 includes a transport unit 2, a vapor deposition source unit 3, a protective plate 6, a moving unit 7, and a frame portion 101.

The frame portion 101 is provided so as to be able to support components such as the transport unit 2 of the film forming apparatus 1. In the example of FIG. 1, the frame portion 101 includes columns and beams, and supports the transport unit 2 and the vacuum pump 102. Further, the frame portion 101 may be provided with a working crane, a passage for the operator to perform maintenance, and the like.

The transport unit 2 transports the substrate. In the present embodiment, the transport unit 2 transports the substrate by transporting the substrate holding tray 100 in a state of holding the substrate. The transfer unit 2 includes a transfer chamber 21 and a transfer roller 22.

The transport unit 2 transports the substrate. In the present embodiment, the transport unit 2 transports the substrate by transporting the substrate holding tray 100 in a state of holding the substrate. The transfer unit 2 includes a transfer chamber 21 and a transfer roller 22.

The transfer chamber 21 is a box-shaped chamber whose inside can be held in a vacuum. The internal space 210 of the transfer chamber 21 is maintained in a vacuum atmosphere or an atmosphere of an inert gas such as nitrogen gas. In this embodiment, the transfer chamber 21 is connected to the vacuum pump 102. In the present specification, the "vacuum" means a state filled with a gas having a pressure lower than the atmospheric pressure, in other words, a depressurized state.

The transfer chamber 21 is formed with a carry-in opening 211 in which the substrate holding tray 100 is carried in and a carry-out opening 212 in which the board holding tray 100 is carried out. Further, a communication opening 213 for communicating the internal space 210 and the internal space 310 of the vapor deposition source chamber 31 is formed in the lower portion of the transfer chamber 21. The carry-in opening 211 and the carry-out opening 212 may be provided with a gate valve or the like (not shown) in order to keep the internal space 210 in a vacuum.

The transfer roller 22 transfers the board holding tray 100 holding the board. The transfer roller 22 is provided in the internal space 210 of the transfer chamber 21. The transport roller 22 is a rotatably supported cylindrical member made of, for example, a metal material. The transfer roller 22 is driven by, for example, an electric motor (not shown) provided outside the transfer chamber 21.

Further, in the present embodiment, a rib 23 for reinforcement is provided in the lower portion of the transport unit 2.

The vapor deposition source unit 3 is a unit (deposition source unit) having a vapor deposition source 32 (deposition source) that discharges a vapor deposition substance to a substrate. In the present embodiment, three thin-film deposition source units 3 are arranged side by side in the transfer direction (X direction) of the substrate with respect to one transfer unit 2. However, the number of the vapor deposition source units 3 can be appropriately set, and may be 2 or less or 4 or more. Further, the vapor deposition source unit 3 is located below the transport unit 2 and is connected to the lower portion of the transport unit 2 when the vapor deposition process is executed. The thin-film deposition unit 3 includes a thin-film deposition source chamber 31 and a thin-film deposition source 32.

The vapor deposition source chamber 31 is a box-shaped chamber whose inside can be held in a vacuum. The internal space 310 of the vapor deposition source chamber 31 can communicate with the internal space 210 of the transfer chamber 21 through the communication opening 311 provided in the upper part of the transfer chamber 21. The internal space 310 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas at the time of operation, similarly to the internal space 210.

The thin-film deposition source 32 releases the vapor-deposited material for film formation on the substrate conveyed by the transfer unit 2. For example, the vapor deposition source 32 includes a plurality of nozzles (not shown) arranged side by side in the Y direction, and the vapor deposition material is discharged from each nozzle. Further, for example, the vapor deposition source 32 includes a storage portion for storing the vapor deposition material and a heater for heating the vapor deposition material stored in the storage portion (both not shown). The thin-film deposition material stored in the storage unit is heated by the heater and vaporized, so that the thin-film deposition material is released from the thin-film deposition source 32.

Further, the vapor deposition source unit 3 may include a shutter that shields the vapor deposition source 32 when the vapor deposition source 32 is not used, an evaporation rate monitor that monitors the amount of evaporation of the vapor deposition material by the vapor deposition source 32, and the like (all not shown).

In this embodiment, as shown in FIG. 4 in detail, the vapor deposition source 32 is configured to be movable by the moving unit 7.

The protective plate 6 prevents the vapor-deposited substance released from the vapor-film deposition source 32 from adhering to the inner wall of the vapor-film deposition source chamber 31 or the transfer chamber 21. For example, the protective plate 6 is supported by the vapor deposition source chamber 31. In the present embodiment, the protective plate 6 is located from the internal space 310 to the internal space 210 so as to cover the vapor deposition source 32, and an opening is formed in the upper portion. With such a configuration, a part of the vapor-deposited substance adheres to the substrate through the opening, while the remaining vapor-film-deposited substance adheres to the adhesive plate 6. In this way, the adhesive plate 6 allows the vapor-deposited substance to adhere to the substrate, while preventing the vapor-deposited substance from adhering to the inner wall of the vapor-film source chamber 31 or the transport chamber 21. The specific configuration of the protective plate 6 will be described later.

In addition to the protective plate 6, the transport chamber 21 or the vapor deposition source chamber 31 may be provided with a protective plate. For example, a protective plate may be provided on the top surface or the side surface of the inside of the transfer chamber 21.

The moving unit 7 is a unit that moves the vapor deposition source unit 3 with respect to the transport unit 2. In the present embodiment, the moving unit 7 is provided below the vapor deposition source unit 3 and moves the vapor deposition source unit 3 in the vertical direction (Z direction) or the lateral direction (Y direction) while supporting the vapor deposition source unit 3. The moving unit 7 includes a lateral moving portion 71 and an elevating portion 72.

The lateral movement unit 71 moves the vapor deposition source unit 3 in the lateral direction (Y direction). In the present embodiment, the lateral moving unit 71 moves the vapor deposition source unit 3 in the width direction (Y direction) of the substrate intersecting the transport direction (X direction) of the substrate. The laterally moving portion 71 includes a guide portion 711 provided on the floor surface and a driving portion 712 for moving the vapor deposition source unit 3 along the guide portion 711. A well-known technique can be appropriately adopted for the drive unit 712, but for example, a drive wheel that can travel on the rail as the guide unit 711 may be rotated by a motor or the like.

The elevating unit 72 elevates and elevates the vapor deposition source unit 3. In the present embodiment, the elevating unit 72 raises and lowers the vapor deposition source unit 3 in the vertical direction (Z direction). The elevating portion 72 includes a vapor deposition source unit support portion 721 that supports the vapor deposition source unit 3 and a drive unit 722 that raises and lowers the vapor deposition source unit support portion 721. A well-known technique can be adopted as the drive unit 722, but the vapor deposition source unit support unit 721 may be raised or lowered by, for example, an electric cylinder or the like.

FIG. 4 is a diagram illustrating a moving operation of the vapor deposition source unit 3 by the moving unit 7.

The state ST1 is a state in which the vapor deposition source unit 3 is located at the connection position POS1 (third position) connected to the transport unit 2. The state ST1 is a state when the film forming apparatus 1 performs vapor deposition on the substrate. In the state ST1, the vapor deposition source unit 3 is located below the transport unit 2, and the lower portion of the transport unit 2 and the upper portion of the vapor deposition source unit 3 are connected to each other.

The state ST2 is a state in which the vapor deposition source unit 3 has moved from the connection position POS1 to the connection disconnection position POS2 (first position) below the connection position POS1. The thin-film deposition source unit 3 moves from the connection position POS1 to the connection disconnection position POS2 in the −Z direction by the elevating portion 72 of the moving unit 7.

The state ST3 is a state in which the vapor deposition source unit 3 has been moved laterally from the disconnection position POS2. In the state ST3, the vapor deposition source unit 3 is located at the maintenance position POS3 (second position) where the maintenance of the transfer unit 2 or the vapor deposition source unit 3 is executed. For example, when performing maintenance of the transfer unit 2, the operator can access the inside of the transfer chamber 21 from the space below the transfer unit 2 created by the lateral movement of the vapor deposition source unit 3. .. Further, for example, when performing maintenance of the vapor deposition source unit 3, by moving the target vapor deposition source unit 3 to the maintenance position POS 3, the operator can move the inside of the vapor deposition source chamber 31 from the longitudinal side surface of the vapor deposition source chamber 31. Can be accessed.

In this embodiment, the mobile unit 7 is provided for each of the plurality of vapor deposition source units 3. Therefore, the film forming apparatus 1 of the present embodiment can move the plurality of vapor deposition source units 3 independently. It should be noted that the plurality of moving units 7 may be synchronized and the plurality of vapor deposition source units 3 may be moved together. Further, a smaller number of moving units 7 than the vapor deposition source unit 3 may be provided, and a plurality of vapor deposition source units 3 may be moved by one moving unit 7.

<Structure of protective plate>
FIG. 5 is a perspective view showing the configuration of the adhesive plate 6, and shows a state when the vapor deposition source unit 3 is connected to the transport unit 2. That is, the state of the protective plate 6 when the vapor deposition source unit 3 is located at the connection position POS 1 is shown. In the present embodiment, the protective plate 6 includes an upper portion 61 and a lower portion 62.

The upper portion 61 includes a plurality of side wall members 611 to 618 forming the side wall thereof. Further, an opening 619 is formed in the upper part of the upper portion 61. The opening 619 is provided so as to face the substrate conveyed by the transfer unit 2 when the vapor deposition process is executed (see FIG. 3). The thin-film deposition material released from the thin-film deposition source 32 passes through this opening 619 and adheres to the substrate. Further, the upper portion 61 includes a connection portion 6110 for connecting to the vapor deposition source chamber 31. The connection portion 6110 is attached to, for example, a frame provided so as to surround the upper portion 61, and the frame is supported by the vapor deposition source chamber 31 to connect to the vapor deposition source chamber 31.

The lower portion 62 includes a plurality of side wall members 621 to 628 that form the side wall thereof. Further, the upper portion 61 includes a connection portion 6210 for connecting to the vapor deposition source chamber 31. The connection portion 6210 is attached to, for example, a frame provided so as to surround the lower portion 62, and the frame is supported by the vapor deposition source chamber 31 to connect to the vapor deposition source chamber 31.

In the present embodiment, the upper portion 61 is movable in the vertical direction with respect to the vapor deposition source chamber 31, for example, because the frame to which the connection portion 6110 is attached is supported so as to be movable in the vertical direction with respect to the vapor deposition source chamber 31. It is provided in. On the other hand, the lower portion 62 is provided in a state where the movement in the vertical direction is restricted with respect to the vapor deposition source chamber 31, for example, by fixing the frame to which the connection portion 6210 is attached to the vapor deposition source chamber 31. That is, the upper portion 61 is provided so as to be relatively movable with respect to the lower portion 62.

FIG. 6 is a perspective view showing the configuration of the protective plate 6, showing a state in which the upper portion 61 is moved downward relative to the lower portion 62. For example, the adhesion plate 6 is located when the connection between the vapor deposition source unit 3 and the transport unit 2 is disconnected, that is, the vapor deposition source unit 3 is located at the disconnection position POS2, the maintenance position POS3, or between them. Occasionally, the state shown in FIG. 6 is obtained.

7 (A) to 7 (C) are views schematically showing the arrangement of the protective plate 6 with respect to the transport unit 2. FIG. 7A shows the arrangement of the protective plate 6 in a state where the vapor deposition source unit 3 is at the connection position POS1. In this state, the upper end of the upper portion 61 is close to the transfer path of the substrate holding tray 100. By approaching the substrate holding tray 100 and the upper end of the upper portion 61, it is possible to more effectively prevent the vapor deposition material that does not adhere to the substrate from adhering to the inner wall of the vapor deposition source chamber 31 or the transfer chamber 21. In this state, the distance from the lower end of the transport unit 2 to the upper end of the protective plate 6 is the distance ΔZ1.

FIG. 7B shows a configuration different from the present embodiment in which the relative positional relationship between the upper portion 61 and the lower portion 62 of the adhesive plate 6 does not change, and the vapor deposition source unit 3 is located at the disconnection position POS 2. It shows the state. Here, when the protective plate 6 is moved from the disconnection position POS2 to the maintenance position POS3 together with the vapor deposition source unit 3, it is necessary to avoid contact between the transport unit 2 and the protective plate 6. In the case of the configuration shown in FIG. 7B, in order to avoid contact between the transport unit 2 and the protective plate 6, the moving distance ΔZ2 of the vapor deposition source unit 3 from the connection position POS1 to the connection disconnection position POS2 is set to the distance ΔZ1. Need to be bigger.

FIG. 7C shows a configuration in which the upper portion 61 of the protective plate 6 moves downward with respect to the lower portion 62, and the vapor deposition source unit 3 is in the disconnection position POS2. In the case of the configuration shown in FIG. 7C, the moving distance ΔZ3 of the vapor deposition source unit 3 from the connection position POS1 required to avoid the contact between the transport unit 2 and the adhesion plate 6 to the connection disconnection position POS2 is a distance. It is smaller than ΔZ1. That is, in the case of the configuration shown in FIG. 7C, the total of the moving distance of the vapor deposition source unit 3 and the moving distance of the upper portion 61 downward with respect to the lower portion 62 may be larger than the distance ΔZ1. .. Therefore, the moving distance ΔZ3 of the vapor deposition source unit 3 becomes smaller than the distance ΔZ1, and as a result, becomes smaller than the moving distance ΔZ2.

As described above, according to the present embodiment, the adhesion plate 6 can move between the connection disconnection position POS2 and the maintenance position POS3 together with the vapor deposition source unit 3. As a result, the protective plate 6 can be pulled out together with the vapor deposition source unit 3, so that the accessibility of the protective plate 6 during maintenance is improved. Therefore, it is possible to more easily carry out the removal of the protective plate 6 or the work on the protective plate 6.

Further, according to the present embodiment, when the protective plate 6 is pulled out together with the vapor deposition source unit 3, the protective plate 6 can move downward with respect to the vapor deposition source unit 3. Furthermore, the upper portion 61 of the protective plate 6 is movable downward with respect to the lower portion 62 and the vapor deposition source unit 3. As a result, when the vapor deposition source unit 3 is moved from the disconnection position POS2 to the maintenance position POS3 together with the adhesion plate 6, contact between the transfer unit 2 and the adhesion plate 6 can be avoided.

Further, according to the present embodiment, the moving distance ΔZ3 of the vapor deposition source unit 3 from the connection position POS1 to the connection disconnection position POS2, which is necessary to avoid contact between the transfer unit 2 and the protective plate 6, is the transfer unit 2. It is smaller than the distance ΔZ1 from the lower end of the surface to the upper end of the protective plate 6. Therefore, the moving distance of the vapor deposition source unit 3 can be reduced as compared with the configuration in which the relative positional relationship between the upper portion 61 and the lower portion 62 of the protective plate 6 does not change as shown in FIG. 7B. .. From another point of view, the structure in which the protective plate 6 can move downward with respect to the vapor deposition source unit 3 avoids contact between the transport unit 2 and the protective plate 6 when the vapor deposition source unit 3 moves. The protective plate 6 can be brought closer to the substrate when the vapor deposition process is executed, while reducing the moving distance ΔZ3 of the vapor deposition source unit 3 required for the deposition process.

<Explanation of the operation of the protective plate>
In the present embodiment, the upper portion 61 of the protective plate 6 moves downward with respect to the lower portion 62 in conjunction with the downward movement of the vapor deposition source unit 3 with respect to the transport unit 2. Hereinafter, the interlocking operation between the vapor deposition source unit 3 and the protective plate 6 will be described. FIG. 8 is an operation explanatory view of the protective plate 6. Specifically, it shows an operation in which the upper portion 61 moves downward relative to the lower portion 62 in conjunction with the movement of the vapor deposition source unit 3 from the connection position POS1 to the connection disconnection position POS2. ..

FIG. 8 shows a moving mechanism 5 for moving the upper portion 61 with respect to the lower portion 62. The moving mechanism 5 includes a movable plate 51, a lever 52, and a guide 53. The movable plate 51 is connected to the upper portion 61 and moves in the vertical direction together with the upper portion 61. The lever 52 is rotatably supported by a shaft member 521 provided in the vapor deposition source chamber 31. At one end of the lever 52, a roller 522 that can move along the guide groove 511 formed in the movable plate 51 is provided. A roller 523 movable along the guide 53 is provided at an end of the lever 52 opposite to the end on which the roller 522 is provided. The guide 53 is provided inside the transfer chamber 21 and includes an upper contact portion 531 and a lower contact portion 532 that come into contact with the roller 523.

In the state where the vapor deposition source unit 3 is at the connection position POS1 (state ST11), the upper portion 61 of the protective plate 6 does not move downward with respect to the lower portion 62 (see FIG. 5). At this time, the position of the roller 523 of the lever 52 is defined by the guide 53 so as to be located below the shaft member 521. Therefore, the roller 522 provided at the end opposite to the end where the roller 523 of the lever 52 is provided engages with the guide groove 511 of the movable plate 51 connected to the upper portion 61 at a position above the shaft member 521. It fits. That is, the upper portion 61 is in a state of being lifted by the lever 52.

In the state where the vapor deposition source unit 3 is descending from the connection position POS1 (state ST12), the lever 52 is rotated clockwise by the guide 53 in the direction shown in the drawing. This rotation is caused by the force applied to the roller 522 by the weight of the upper portion 61 of the lever 52 to the roller 522 via the movable plate 51, or the force applied to the roller 523 from the lower contact portion 532 of the guide 53. Due to this rotation, the upper portion 61 moves downward with respect to the lower portion 62.

Finally, in the state where the vapor deposition source unit 3 is located at the disconnection position POS2 (state ST13), the upper portion 61 moves downward by a predetermined distance with respect to the lower portion 62. This predetermined distance may be a distance required to avoid contact between the transport unit 2 and the protective plate 6, as shown in FIG. 7 (C), for example.

When the vapor deposition source unit 3 moves from the connection disconnection position POS2 to the connection position POS1, the upper portion 61 moves upward with respect to the lower portion 62 by the reverse operation of the above description. Briefly, when the vapor deposition source unit 3 starts to rise from the disconnection position POS2, the roller 523 comes into contact with the guide 53 at a certain height. Then, the lever 52 rotates counterclockwise due to the force received by the roller 523 from the upper contact portion 531 of the guide 53. By this rotation, an upward force from the roller 522 is applied to the guide groove 511 of the movable plate 51, and the movable plate 51 and the upper portion 61 connected to the movable plate 51 move upward with respect to the lower portion 62.

According to the present embodiment, the vertical movement of the vapor deposition source unit 3 and the relative movement of the protective plate 6 with respect to the vapor deposition source unit 3 are linked, so that the protective plate 6 can be moved together with the vapor deposition source unit 3 more easily. Can be made to.

<Other embodiments>
In the above embodiment, the protective plate 6 is moved up and down relative to the vapor deposition source unit 3, but a configuration in which the protective plate 6 does not move up and down with respect to the vapor deposition source unit 3 can also be adopted. However, as in the above embodiment, the adhesion plate 6 moves relative to the vapor deposition source unit 3, so that the vapor deposition source unit 3 necessary for avoiding the interference between the adhesion plate 6 and the transport chamber 21 is required. The amount of descent of the film can be reduced.

Further, in the above embodiment, the protective plate 6 is divided into an upper portion 61 and a lower portion 62, but a configuration in which the protective plate 6 is not divided into upper and lower portions can also be adopted. That is, instead of moving the upper portion 61 with respect to the lower portion 62 and the vapor deposition source unit 3, the entire protective plate 6 may be moved up and down with respect to the vapor deposition source unit 3. However, in the above embodiment, the adhesion plate 6 is divided into an upper portion 61 and a lower portion 62, so that the vapor deposition source unit 3 necessary for avoiding interference between the adhesion plate 6 and the transport chamber 21 is required. The amount of descent of can be reduced.

Specifically, the adhesion plate 6 may be provided at its lower end relatively close to the bottom of the vapor deposition source chamber 31 in order to prevent the vapor deposition material from adhering to the inner wall of the vapor deposition source chamber 31. Therefore, when the entire protective plate 6 is lowered with respect to the vapor deposition source unit 3, the lowering width of the protective plate 6 cannot be made large, and the amount of lowering of the vapor deposition source unit 3 may become large. On the other hand, when the upper portion 61 is lowered with respect to the lower portion 62, the distance from the lower end of the upper portion 61 to the bottom of the vapor deposition source chamber 31 is relatively large, so that the lowering width of the upper portion 61 is large. be able to. Therefore, it is not necessary to increase the amount of descent of the vapor deposition source unit 3 so much. Therefore, by dividing the protective plate 6 into upper and lower parts, it is possible to reduce the amount of descent of the vapor deposition source unit 3 required to avoid interference between the protective plate 6 and the transfer chamber 21.

Further, in the above embodiment, the upper portion 61 moves in the vertical direction relative to the lower portion 62 in conjunction with the vertical movement of the vapor deposition source unit 3, but the movement of the vapor deposition source unit 3 and the upper side thereof. A configuration that is not linked to the movement of the portion 61 can also be adopted. For example, from the state shown in FIG. 7B, the operator may manually move the upper portion 61 with respect to the lower portion 62, or the upper portion 61 may be moved with respect to the lower portion 62 by using a motor or the like. You may move it.

Further, the mode of interlocking between the movement of the vapor deposition source unit 3 and the movement of the upper portion 61 is not limited to that of interlocking by a mechanical mechanism using a link or the like as in the above embodiment. For example, the film forming apparatus 1 may include a motor for moving the upper portion 61 with respect to the lower portion 62. Then, the control device of the film forming apparatus 1 may drive a motor for moving the upper portion 61 based on the start of raising and lowering the vapor deposition source unit 3 by the elevating unit 72. That is, the movement of the vapor deposition source unit 3 and the movement of the upper portion 61 may be interlocked in a controlled manner.

Further, in the above embodiment, the adhesive plate 6 is arranged below the transport path of the substrate holding tray 100, but the adhesive plate 6 may extend to the upper side of the substrate holding tray 100. That is, the adhesive plate 6 has an opening through which the substrate holding tray 100 can pass, instead of the opening 619 through which the vapor-deposited substance passes as in the above embodiment, at the upper part of the side surface intersecting in the transport direction of the substrate. You may.

Further, the film forming apparatus 1 may include a sensor for detecting a value related to the inclination of the vapor deposition source unit 3. Then, when the value related to the inclination of the vapor deposition source unit 3 detected by this sensor does not satisfy the predetermined condition, the film forming apparatus 1 raises and lowers the vapor deposition source unit 3, that is, between the connection position POS1 and the connection disconnection position POS2. The moving operation may be stopped.

For example, the sensor may directly detect the tilt of the vapor deposition source unit 3 such as a pendulum type or float type tilt sensor, or indirectly detect the tilt like an acceleration sensor. There may be. Further, for example, in the sensor, the vapor deposition source unit 3 is tilted due to a value related to the drive load of the drive portions 722 on both sides (for example, a drive current value) or a load of the vapor deposition source unit 3 applied to the vapor deposition source unit support portion 721 on both sides. It may be one that detects a value that can be grasped as being present.

Further, for example, the film forming apparatus 1 may stop the ascending / descending operation of the vapor deposition source unit 3 when the inclination of the vapor deposition source unit 3 detected by the sensor is equal to or greater than the threshold value. Alternatively, the film forming apparatus 1 moves up and down the vapor deposition source unit 3 when the difference between the drive current values of the drive units 722 on both sides and the load of the vapor deposition source unit 3 on the vapor deposition source unit support portion 721 is equal to or more than the threshold value. May be stopped.

<Second Embodiment>
FIG. 9 is a front view schematically showing the film forming apparatus 13 according to the third embodiment. Further, FIG. 10 is a plan view of the film forming apparatus 13 of FIG. 9, showing a state in which the central vapor deposition source unit 3 is located at the maintenance position POS 3. The present embodiment is different from the first embodiment in that the film forming apparatus 13 includes the take-out unit 50. Hereinafter, the same configurations as those of the first embodiment may be designated by the same reference numerals and the description thereof may be omitted.

The take-out unit 50 takes out a predetermined part from above the vapor deposition source unit 3 located at the maintenance position POS 3. Examples of the predetermined parts include a vapor deposition source chamber 31 housed in the vapor deposition source chamber 31 of the vapor deposition source unit 3, a protective plate 6, and the like. The take-out unit 50 is supported by the frame portion 101 so as to be movable above the vapor deposition source unit 3. The take-out unit 50 includes a holding unit 501, a vertical moving unit 502, and a horizontal moving unit 503.

The holding section 501 holds a predetermined component. For example, the holding portion 501 may grip a predetermined part by moving its tip portion in a predetermined direction such as a horizontal direction. Alternatively, the holding portion 501 is provided with a hook for hooking a wire for slinging, and a predetermined part may be held by hanging the predetermined part with the wire. The holding portion 501 may be configured to be foldable so as to accommodate different sizes.

The vertical moving unit 502 moves the holding unit 501 in the vertical direction. As the vertical moving portion 502, a known technique can be appropriately adopted, but for example, an electric cylinder having a ball screw mechanism, a pneumatic balance cylinder, or the like may be used.

The horizontal moving unit 503 moves the holding unit 501 in the horizontal direction. Specifically, the horizontal moving unit 503 moves the holding unit 501 in the horizontal direction by moving the vertical moving unit 502 in the horizontal direction. For example, the horizontal moving unit 503 includes an X-direction moving unit 5031 that moves the vertical moving unit 502 in the X direction, and a Y-direction moving unit 5032 that moves the vertical moving unit 502 in the Y direction. In the present embodiment, the Y-direction moving unit 5032 moves the vertical moving unit 502 in the Y direction, and the X-direction moving unit 5031 moves the Y-direction moving unit 5032 in the X direction. Known techniques can be appropriately adopted for the X-direction moving unit 5031 and the Y-direction moving unit 5032, but for example, a rack and pinion mechanism and an electric motor for rotating the pinion may be included. Further, a pulley type mechanism may be used, and the movement of at least one of the X direction and the Y direction may be performed manually by an operator without having a drive source.

For example, when the take-out unit 50 takes out a predetermined part from the vapor deposition source unit 3 located at the maintenance position POS 3, the taken-out part is placed on a maintenance table or the like (not shown). This makes it easier for the operator to perform maintenance than when the parts to be maintained are in the vapor deposition source chamber 31.

It is also possible to adopt a configuration in which a plurality of take-out units 50 are provided. In this case, when the vapor deposition source units 3 on both outer sides are pulled out to the maintenance position POS 3, parts can be taken out from each vapor deposition source unit 3 in parallel. Further, when a plurality of take-out units 50 are provided, for example, the rail portion of the X-direction moving portion 5031 may be shared.

The invention is not limited to the above embodiment, and various modifications and changes can be made within the scope of the gist of the invention.

1 film forming equipment, 2 transfer unit, 3 thin film deposition source unit, 6 protective plate

Claims (10)

A transport unit that transports the board and
A film formation source unit that includes a vapor deposition source and is movable to a first position below the transport unit and a second position that is laterally displaced with respect to the first position.
Provided with a protective plate that prevents the vapor-deposited substance released from the vapor-film source from adhering to the inner wall of the film-forming source unit while allowing the vapor-film material to adhere to the substrate.
It is an in-line type film forming device that forms a film on the substrate while transporting the substrate.
The adhesive plate is supported by the film-forming source unit and can move to the first position and the second position together with the film-forming source unit.
A film forming apparatus characterized by this. The film forming apparatus according to claim 1, wherein the adhesive plate can be moved up and down with respect to the film forming source unit. The first aspect of the present invention, wherein the adhesive plate includes a lower portion fixed to the film forming source unit and an upper portion movable up and down with respect to the film forming source unit. Film forming equipment. The film formation source unit can also be moved to a third position above the first position and connected to the lower part of the transport unit.
As the film forming source unit moves from the third position to the first position, the adhesive plate moves downward with respect to the film forming source unit.
The film forming apparatus according to any one of claims 1 to 3. The adhesive plate moves downward with respect to the film forming source unit to a position where contact with the transport unit can be avoided when the film forming source unit moves from the first position to the second position. The film forming apparatus according to any one of claims 1 to 4, wherein the film forming apparatus is characterized. The protective plate is
The side wall that surrounds the vapor deposition source and
Includes an opening facing the substrate through which the vaporized material emitted from the vapor deposition source passes.
The film forming apparatus according to any one of claims 1 to 5. When the film-forming source unit is in the third position connected to the lower part of the transport unit, the protective plate is arranged so that the upper end of the protective plate is located above the lower end of the transport unit. The film forming apparatus according to claim 2, wherein the film forming apparatus is formed. When the film-forming source unit is in the third position, the distance from the lower end of the transport unit to the upper end of the protective plate is from the third position of the film-forming source unit to the first position. The film forming apparatus according to claim 7, wherein the film forming apparatus is larger than the moving distance of the above. A transport unit that transports the board and
A film formation source unit that includes a vapor deposition source and is movable to a first position below the transport unit and a second position that is laterally displaced with respect to the first position.
A protective plate is provided, which allows the vapor-deposited substance discharged from the vapor-film deposition source to adhere to the substrate and prevents the vapor-film deposition material from adhering to the inner wall of the film-forming source unit.
It is an in-line type film forming device that forms a film on the substrate while transporting the substrate.
The adhesive plate is supported by the film-forming source unit and can move to the first position and the second position together with the film-forming source unit.
The film formation source unit can also be moved to a third position above the first position and connected to the lower part of the transport unit.
The film forming apparatus includes a detecting means for detecting a value related to the inclination of the film forming source unit.
A film forming apparatus characterized by this. In the ascending / descending operation between the first position and the third position of the film forming source unit, the stopping means for stopping the ascending / descending operation when the value relating to the inclination detected by the detecting means does not satisfy a predetermined condition. Further prepare,
The film forming apparatus according to claim 9.

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