JP2022082902A5 - - Google Patents

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Publication number
JP2022082902A5
JP2022082902A5 JP2020194067A JP2020194067A JP2022082902A5 JP 2022082902 A5 JP2022082902 A5 JP 2022082902A5 JP 2020194067 A JP2020194067 A JP 2020194067A JP 2020194067 A JP2020194067 A JP 2020194067A JP 2022082902 A5 JP2022082902 A5 JP 2022082902A5
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JP
Japan
Prior art keywords
polishing
polished
workpiece
layer
thickness
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JP2020194067A
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English (en)
Japanese (ja)
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JP2022082902A (ja
JP7477433B2 (ja
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Priority claimed from JP2020194067A external-priority patent/JP7477433B2/ja
Priority to JP2020194067A priority Critical patent/JP7477433B2/ja
Priority to US17/524,144 priority patent/US20220176513A1/en
Priority to KR1020210158307A priority patent/KR20220071915A/ko
Priority to TW110143131A priority patent/TW202235213A/zh
Priority to CN202111375685.4A priority patent/CN114536210A/zh
Publication of JP2022082902A publication Critical patent/JP2022082902A/ja
Publication of JP2022082902A5 publication Critical patent/JP2022082902A5/ja
Publication of JP7477433B2 publication Critical patent/JP7477433B2/ja
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JP2020194067A 2020-11-24 2020-11-24 研磨方法 Active JP7477433B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2020194067A JP7477433B2 (ja) 2020-11-24 2020-11-24 研磨方法
US17/524,144 US20220176513A1 (en) 2020-11-24 2021-11-11 Polishing method, polishing monitoring method and polishing monitoring apparatus for workpiece
KR1020210158307A KR20220071915A (ko) 2020-11-24 2021-11-17 연마 방법, 워크피스의 연마 감시 방법 및 연마 감시 장치
CN202111375685.4A CN114536210A (zh) 2020-11-24 2021-11-19 研磨方法、工件的研磨监视方法及研磨监视装置
TW110143131A TW202235213A (zh) 2020-11-24 2021-11-19 研磨方法、工件之研磨監視方法及研磨監視裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020194067A JP7477433B2 (ja) 2020-11-24 2020-11-24 研磨方法

Publications (3)

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JP2022082902A JP2022082902A (ja) 2022-06-03
JP2022082902A5 true JP2022082902A5 (enExample) 2023-03-14
JP7477433B2 JP7477433B2 (ja) 2024-05-01

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JP2020194067A Active JP7477433B2 (ja) 2020-11-24 2020-11-24 研磨方法

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Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06252113A (ja) * 1993-02-26 1994-09-09 Matsushita Electric Ind Co Ltd 半導体基板の平坦化方法
JP2000310512A (ja) 1999-04-28 2000-11-07 Hitachi Ltd 薄膜の膜厚計測方法及びその装置並びにそれを用いた薄膜デバイスの製造方法及びその装置
JP5241321B2 (ja) 2008-05-20 2013-07-17 株式会社東京精密 ウェーハの研磨状態モニタ方法並びに研磨状態モニタ装置
JP5339859B2 (ja) 2008-11-07 2013-11-13 株式会社東京精密 研磨終了時点の検出方法及び検出装置
WO2011139571A2 (en) 2010-05-05 2011-11-10 Applied Materials, Inc. Dynamically or adaptively tracking spectrum features for endpoint detection
US8563335B1 (en) 2012-04-23 2013-10-22 Applied Materials, Inc. Method of controlling polishing using in-situ optical monitoring and fourier transform
JP6861116B2 (ja) 2017-07-14 2021-04-21 株式会社荏原製作所 膜厚測定装置、研磨装置、および研磨方法
JP7210200B2 (ja) 2018-09-21 2023-01-23 株式会社ディスコ 厚み計測装置、及び厚み計測装置を備えた研削装置

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