JP7477433B2 - 研磨方法 - Google Patents

研磨方法 Download PDF

Info

Publication number
JP7477433B2
JP7477433B2 JP2020194067A JP2020194067A JP7477433B2 JP 7477433 B2 JP7477433 B2 JP 7477433B2 JP 2020194067 A JP2020194067 A JP 2020194067A JP 2020194067 A JP2020194067 A JP 2020194067A JP 7477433 B2 JP7477433 B2 JP 7477433B2
Authority
JP
Japan
Prior art keywords
polishing
workpiece
polished
layer
peak
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020194067A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022082902A5 (enExample
JP2022082902A (ja
Inventor
夕貴 渡邉
陽一 塩川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2020194067A priority Critical patent/JP7477433B2/ja
Priority to US17/524,144 priority patent/US12654278B2/en
Priority to KR1020210158307A priority patent/KR102916178B1/ko
Priority to TW110143131A priority patent/TWI924729B/zh
Priority to CN202111375685.4A priority patent/CN114536210A/zh
Publication of JP2022082902A publication Critical patent/JP2022082902A/ja
Publication of JP2022082902A5 publication Critical patent/JP2022082902A5/ja
Application granted granted Critical
Publication of JP7477433B2 publication Critical patent/JP7477433B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2020194067A 2020-11-24 2020-11-24 研磨方法 Active JP7477433B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2020194067A JP7477433B2 (ja) 2020-11-24 2020-11-24 研磨方法
US17/524,144 US12654278B2 (en) 2020-11-24 2021-11-11 Polishing method, polishing monitoring method and polishing monitoring apparatus for workpiece
KR1020210158307A KR102916178B1 (ko) 2020-11-24 2021-11-17 연마 방법, 워크피스의 연마 감시 방법 및 연마 감시 장치
TW110143131A TWI924729B (zh) 2020-11-24 2021-11-19 研磨方法、工件之研磨監視方法及研磨監視裝置
CN202111375685.4A CN114536210A (zh) 2020-11-24 2021-11-19 研磨方法、工件的研磨监视方法及研磨监视装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020194067A JP7477433B2 (ja) 2020-11-24 2020-11-24 研磨方法

Publications (3)

Publication Number Publication Date
JP2022082902A JP2022082902A (ja) 2022-06-03
JP2022082902A5 JP2022082902A5 (enExample) 2023-03-14
JP7477433B2 true JP7477433B2 (ja) 2024-05-01

Family

ID=81811401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020194067A Active JP7477433B2 (ja) 2020-11-24 2020-11-24 研磨方法

Country Status (1)

Country Link
JP (1) JP7477433B2 (enExample)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000310512A (ja) 1999-04-28 2000-11-07 Hitachi Ltd 薄膜の膜厚計測方法及びその装置並びにそれを用いた薄膜デバイスの製造方法及びその装置
JP2009283578A (ja) 2008-05-20 2009-12-03 Tokyo Seimitsu Co Ltd ウェーハの研磨状態モニタ方法並びに研磨状態モニタ装置
JP2010114327A (ja) 2008-11-07 2010-05-20 Tokyo Seimitsu Co Ltd 研磨終了時点の検出方法及び検出装置
US20130280827A1 (en) 2012-04-23 2013-10-24 Dominic J. Benvegnu Method of controlling polishing using in-situ optical monitoring and fourier transform
JP2016105486A (ja) 2010-05-05 2016-06-09 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 終点検出のためのスペクトル特徴部の動的または適応的な追跡
JP2019021748A (ja) 2017-07-14 2019-02-07 株式会社荏原製作所 膜厚測定装置、研磨装置、および研磨方法
CN110940279A (zh) 2018-09-21 2020-03-31 株式会社迪思科 厚度测量装置和具有厚度测量装置的磨削装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06252113A (ja) * 1993-02-26 1994-09-09 Matsushita Electric Ind Co Ltd 半導体基板の平坦化方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000310512A (ja) 1999-04-28 2000-11-07 Hitachi Ltd 薄膜の膜厚計測方法及びその装置並びにそれを用いた薄膜デバイスの製造方法及びその装置
JP2009283578A (ja) 2008-05-20 2009-12-03 Tokyo Seimitsu Co Ltd ウェーハの研磨状態モニタ方法並びに研磨状態モニタ装置
JP2010114327A (ja) 2008-11-07 2010-05-20 Tokyo Seimitsu Co Ltd 研磨終了時点の検出方法及び検出装置
JP2016105486A (ja) 2010-05-05 2016-06-09 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 終点検出のためのスペクトル特徴部の動的または適応的な追跡
US20130280827A1 (en) 2012-04-23 2013-10-24 Dominic J. Benvegnu Method of controlling polishing using in-situ optical monitoring and fourier transform
JP2019021748A (ja) 2017-07-14 2019-02-07 株式会社荏原製作所 膜厚測定装置、研磨装置、および研磨方法
CN110940279A (zh) 2018-09-21 2020-03-31 株式会社迪思科 厚度测量装置和具有厚度测量装置的磨削装置

Also Published As

Publication number Publication date
JP2022082902A (ja) 2022-06-03

Similar Documents

Publication Publication Date Title
JP6404172B2 (ja) 膜厚測定方法、膜厚測定装置、研磨方法、および研磨装置
JP3327289B2 (ja) 工程終了点測定装置及び測定方法及び研磨装置及び半導体デバイス製造方法及び信号処理プログラムを記録した記録媒体
JP5774059B2 (ja) スペクトルを使用した研磨終了点の決定
US8585460B2 (en) Method of making diagram for use in selection of wavelength of light for polishing endpoint detection, method and apparatus for selecting wavelength of light for polishing endpoint detection, polishing endpoint detection method, polishing endpoint detection apparatus, and polishing monitoring method
JP5968783B2 (ja) スペクトルの等高線図のピーク位置と時間の関係を使用する終点方法
TWI521625B (zh) 使用光譜監測來偵測層級清除
TWI467678B (zh) 用於終點偵測之動態或適應性追蹤之頻譜特徵
JP3327175B2 (ja) 検知部及びこの検知部を具えたウェハ研磨装置
CN102017094A (zh) 在使用多个光谱的化学机械抛光中的终点检测
KR102916178B1 (ko) 연마 방법, 워크피스의 연마 감시 방법 및 연마 감시 장치
TW201220415A (en) Tracking spectrum features in two dimensions for endpoint detection
JP2010093147A (ja) 研磨進捗監視方法および研磨装置
US20080130000A1 (en) Determining copper concentration in spectra
JP3360610B2 (ja) 検出方法及び検出装置及び研磨装置
JP2013252613A (ja) 終点検出装置および研磨装置
JP2022082902A (ja) 研磨方法
US20250381639A1 (en) Method of inspecting spectrum of reflected light from workpiece, and polishing apparatus
JP4147675B2 (ja) 検知方法、検知装置、及び研磨装置
JP2014103344A (ja) 研磨方法
KR20240158794A (ko) 연마 방법, 컴퓨터를 동작시키기 위한 프로그램을 저장한 컴퓨터 판독 가능한 기록 매체, 및 연마 장치
JP2022088758A (ja) ワークピースの研磨監視方法および研磨監視装置
JP2024106535A (ja) 膜厚測定に使用されるプリセットスペクトルデータの異常検出方法、および光学的膜厚測定装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230306

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230306

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20231228

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240130

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240329

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240416

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240418

R150 Certificate of patent or registration of utility model

Ref document number: 7477433

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150