JP2022074028A - 搬送ハンド及び基板処理装置 - Google Patents
搬送ハンド及び基板処理装置 Download PDFInfo
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
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- NEXSMEBSBIABKL-UHFFFAOYSA-N hexamethyldisilane Chemical compound C[Si](C)(C)[Si](C)(C)C NEXSMEBSBIABKL-UHFFFAOYSA-N 0.000 description 2
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- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
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Abstract
Description
また、本発明の一実施形態によれば、搬送ハンドが基板を搬送の時、基板上でアーキング現象が発生されることを最小化することができる。
2100 第1ボディー
2102 第1本体
2110 第1フィンガー
2111 第1-1フィンガー
2112 第1-2フィンガー
2130 第1ベース
2131 第1湾入部
2132 第1安着部
2133 第1挿入ホール
2134 第1結合ホール
2150 支持ピン
2400 第1吸着ライン
2500 第1吸着アセンブリ
2510 第1吸着パッド
2511 第1ヘッド部
2512 第1リング突起
2513 第1支持突起
2514 第1貫通ホール
2516 第1挿入部
2517 第1接触部
2550 第1伝導性リング
2570 第1固定部材
2571 第1本体部
2572 第1吸着ホール
2576 第1係止部
3000 第2搬送ハンド
3110 第2ボディー
3110 第2フィンガー
3111 第2-1フィンガー
3112 第2-2フィンガー
3130 第2ベース
3131 結合部
3134 第2結合ホール
3135 バキュームホール
3136 支持部
3137 第2安着部
3140 カバープレート
3400 第2吸着ライン
3500 第2吸着アセンブリ
3510 第2吸着パッド
3550 第2伝導性リング
3570 第2固定部材
Claims (20)
- 基板を搬送する搬送ハンドにおいて、
ボディーと、
前記ボディーに設置され、基板の下面に減圧を提供して基板を前記ボディーの上部で支持する吸着アセンブリと、を含み、
前記吸着アセンブリは、
基板と接触し、導電性を有する吸着パッドと、
前記吸着パッドと前記ボディーとの間に提供され、前記吸着パッドと電気的に連結されるシーリング部材と、を含み、
前記シーリング部材は、接地される搬送ハンド。 - 前記吸着パッドは、
前記ボディーに対してチルト可能に提供される請求項1に記載の搬送ハンド。 - 前記ボディーは、接地され、
前記シーリング部材は、前記ボディーと電気的に連結されて接地される請求項1に記載の搬送ハンド。 - 前記シーリング部材は、
前記吸着パッドが有する抵抗のサイズより小さい抵抗のサイズを有する素材で提供される請求項1乃至請求項3のいずれかの一項に記載の搬送ハンド。 - 前記ボディーは、
前記シーリング部材が有する抵抗のサイズより小さい抵抗のサイズを有する素材で提供される請求項4に記載の搬送ハンド。 - 前記吸着パッドは、
基板の下面と接触するヘッド部と、
前記ボディーに挿入される挿入部と、
前記ヘッド部、そして前記挿入部の間に形成され、前記シーリング部材と接触される接触部と、を含み、前記接触部は、屈曲された形状を有する請求項1乃至請求項3のいずれかの一項に記載の搬送ハンド。 - 前記シーリング部材と前記接触部の断面を見る時、
前記シーリング部材の曲率半径と前記接触部の曲率半径は、互いに同一なサイズを有する請求項6に記載の搬送ハンド。 - 前記吸着パッドには、
前記ボディーに提供され、基板の下面に減圧を提供する吸着ラインと流体連通するホールと、
前記吸着パッドの上面縁領域にリング突起が形成される請求項1乃至請求項3のいずれかの一項に記載の搬送ハンド。 - 前記吸着パッドには、
前記吸着パッドの上面、そして前記リング突起より内側に少なくとも1つ以上の支持突起が形成される請求項8に記載の搬送ハンド。 - 前記支持突起の上端高さは、
前記リング突起の上端高さより低い請求項9に記載の搬送ハンド。 - 基板を搬送する搬送ハンドにおいて、
ボディーと、
前記ボディーに設置され、基板を支持し、基板に帯電された静電気を除電する除電経路の中で少なくとも一部を形成する吸着アセンブリと、を含み、
前記吸着アセンブリは、
基板と接触し、前記ボディーに対してチルト可能に提供され、導電性を有する吸着パッドと、
前記吸着パッドの下部に提供され、前記吸着パッドと電気的に連結される伝導性リングを含む搬送ハンド。 - 前記伝導性リングは、
前記吸着パッドが有する抵抗のサイズより小さい抵抗のサイズを有する素材で提供される請求項11に記載の搬送ハンド。 - 前記吸着パッドは、
抵抗のサイズが106オーム以上、そして109オーム以下である素材で提供され、
前記伝導性リングは、
抵抗のサイズが103オーム以上、そして104オーム以下である素材で提供される請求項12に記載の搬送ハンド。 - 前記吸着パッドには、
前記ボディーに提供され、基板の下面に減圧を提供する吸着ラインと流体連通するホールと、
前記吸着パッドの上面縁領域に形成されるリング突起と、
前記吸着パッドの上面、そして前記リング突起より内側に複数の支持突起が形成され、
前記支持突起の上端高さは、
前記リング突起の上端高さより低い請求項11乃至請求項13のいずれかの一項に記載の搬送ハンド。 - 前記支持突起は、
上部から見る時、前記吸着パッドの上面に円周方向に沿って互いに離隔されて配列される請求項14に記載の搬送ハンド。 - 前記ボディーは、
前記伝導性リングが安着される安着部が形成されたベースをさらに含み、
前記ベースと前記伝導性リングの断面から見る時、
前記安着部は、屈曲された形状を有し、
前記伝導性リングの曲率半径は、前記安着部の曲率半径より小さいサイズを有する請求項11乃至請求項13のいずれかの一項に記載の搬送ハンド。 - 前記吸着アセンブリは、
前記吸着パッドが前記ベースから離脱されることを防止する固定部材を含み、
前記固定部材は、
前記吸着パッドに形成される貫通ホールに挿入される本体部と、
上部から見る時、前記ベースと重畳されるように前記本体部から側方向に延長される係止部と、を含む請求項16に記載の搬送ハンド。 - 基板を処理する装置において、
基板が収納された容器が置かれるロードポートを有するインデックスモジュールと、
基板に対する処理工程を遂行する処理モジュールと、を含み、
前記インデックスモジュール、前記処理モジュールの中で少なくともいずれか一つには、
基板を搬送する搬送ハンドを有するロボットが提供され、
前記搬送ハンドは、
フィンガー、本体、そして前記本体又は前記フィンガーに設置されるベースを有するボディーと、
前記ボディーに設置され、基板の下面を真空吸着して基板を前記ボディーの上部で支持する吸着アセンブリと、を含み、
前記吸着アセンブリは、
基板と接触し、前記ボディーにチルト可能に提供され、導電性を有する吸着パッドと、
前記吸着パッド、そして前記ベースの間に提供され、前記吸着パッド、そして前記ベースと接触されて電気的に連結される伝導性リングと、を含み、
前記ベースは、
接地された前記本体又は前記フィンガーと電気的に連結される基板処理装置。 - 前記ベースは、
アルミニウム素材で提供され、その表面がニッケルを含む素材でコーティングされ、
前記伝導性リングは、
弗素系樹脂を含む素材で提供され、
前記吸着パッドは、
導電性プラスチックを含む素材で提供される請求項18に記載の基板処理装置。 - 前記装置は、
前記処理モジュールと異なる処理工程を遂行する外部の処理装置を互いに連結させるインターフェイスモジュールをさらに含み、
前記インデックスモジュール、前記処理モジュール、そして前記インターフェイスモジュールの中で少なくともいずれか一つには、
前記搬送ハンドを有するロボットが提供される請求項18又は請求項19に記載の基板処理装置。
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