JP2022069413A5 - - Google Patents

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Publication number
JP2022069413A5
JP2022069413A5 JP2021170961A JP2021170961A JP2022069413A5 JP 2022069413 A5 JP2022069413 A5 JP 2022069413A5 JP 2021170961 A JP2021170961 A JP 2021170961A JP 2021170961 A JP2021170961 A JP 2021170961A JP 2022069413 A5 JP2022069413 A5 JP 2022069413A5
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JP
Japan
Prior art keywords
plate thickness
grain size
crystal grain
average crystal
ratio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021170961A
Other languages
English (en)
Japanese (ja)
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JP2022069413A (ja
JP7342923B2 (ja
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Publication date
Application filed filed Critical
Priority to PCT/JP2021/038772 priority Critical patent/WO2022085723A1/ja
Priority to US18/044,005 priority patent/US12281376B2/en
Priority to KR1020237005294A priority patent/KR20230093239A/ko
Priority to TW110139221A priority patent/TWI900680B/zh
Publication of JP2022069413A publication Critical patent/JP2022069413A/ja
Publication of JP2022069413A5 publication Critical patent/JP2022069413A5/ja
Application granted granted Critical
Publication of JP7342923B2 publication Critical patent/JP7342923B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2021170961A 2020-10-23 2021-10-19 スリット銅材、電子・電気機器用部品、バスバー、放熱基板 Active JP7342923B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/JP2021/038772 WO2022085723A1 (ja) 2020-10-23 2021-10-20 スリット銅材、電子・電気機器用部品、バスバー、放熱基板
US18/044,005 US12281376B2 (en) 2020-10-23 2021-10-20 Slit copper material, part for electric/electronic device, bus bar, heat dissipation substrate
KR1020237005294A KR20230093239A (ko) 2020-10-23 2021-10-20 슬릿 동재, 전자·전기 기기용 부품, 버스 바, 방열 기판
TW110139221A TWI900680B (zh) 2020-10-23 2021-10-22 切條銅材、電子/電氣機器用零件、匯流條、散熱基板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020178070 2020-10-23
JP2020178070 2020-10-23

Publications (3)

Publication Number Publication Date
JP2022069413A JP2022069413A (ja) 2022-05-11
JP2022069413A5 true JP2022069413A5 (enExample) 2022-11-08
JP7342923B2 JP7342923B2 (ja) 2023-09-12

Family

ID=81521763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021170961A Active JP7342923B2 (ja) 2020-10-23 2021-10-19 スリット銅材、電子・電気機器用部品、バスバー、放熱基板

Country Status (1)

Country Link
JP (1) JP7342923B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023097756A (ja) * 2021-12-28 2023-07-10 三菱マテリアル株式会社 銅合金、銅合金塑性加工材、電子・電気機器用部品、端子、バスバー、リードフレーム、放熱基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013067848A (ja) * 2011-09-26 2013-04-18 Jx Nippon Mining & Metals Corp Cu−Co−Si系銅合金条及びその製造方法
US11203806B2 (en) * 2016-03-30 2021-12-21 Mitsubishi Materials Corporation Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay
JP6446010B2 (ja) * 2016-09-29 2018-12-26 株式会社神戸製鋼所 放熱部品用銅合金板
CN110462074A (zh) * 2017-03-31 2019-11-15 古河电气工业株式会社 用于带铜板的绝缘基板的铜板材及其制造方法
US12385110B2 (en) * 2018-12-13 2025-08-12 Mitsubishi Materials Corporation Pure copper plate

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