JP2022052855A - Substrate processing apparatus and heat insulation member - Google Patents

Abstract

To provide a technique for suppressing dust generation of a heat insulating material in a chamber in which air supply and exhaust are performed.SOLUTION: A substrate processing apparatus 1 includes a chamber 2 and a plurality of support pins 3. The chamber 2 includes a core layer 25 including a heat insulating material. The core layer 25 has an inner surface facing a processing space formed by the chamber 2. The surface of the core layer 25 is covered with a first fiber reinforced resin layer 26.SELECTED DRAWING: Figure 3

Description

The present invention relates to a substrate processing apparatus and a heat insulating member.

In order to manufacture a substrate such as a semiconductor, a substrate processing apparatus for processing the substrate in a chamber is used. For example, the substrate heat treatment apparatus disclosed in Patent Document 1 includes a hot plate, a housing surrounding the hot plate, and a discharge nozzle for discharging heated air inside the housing. The substrate heat treatment apparatus heats the substrate by raising the temperature of the hot plate and discharging heated air from the discharge nozzle.

Japanese Unexamined Patent Publication No. 2008-251862

In the substrate processing equipment, it may be desirable to use a heat insulating material. For example, in the substrate heat treatment apparatus of Patent Document 1, by forming the housing with a heat insulating material, heat dissipation from the housing is reduced. By reducing the heat dissipation of the housing, the temperature inside the housing is stabilized, so that the substrate can be heated efficiently. However, the heat insulating material is generally highly dust-generating. Therefore, when the heat insulating material is used in the chamber where air supply and exhaust are performed, the inside of the chamber may be contaminated by the dust of the heat insulating material.

An object of the present invention is to provide a technique for suppressing dust generation of a heat insulating material in a chamber in which air supply and exhaust are performed.

In order to solve the above problems, the first aspect is a substrate processing apparatus, which forms a processing space for processing the substrate, and exhausts from the ventilation port for supplying air to the processing space and the processing space. The chamber comprises a chamber with an exhaust port for the purpose of the chamber and a substrate support portion for supporting the substrate in the chamber, the chamber having a surface facing the processing space, the surface of which is covered with a fiber reinforced resin. Has a heat insulating material.

The second aspect is the substrate processing apparatus of the first aspect, further comprising a decompression unit that decompresses the inside of the chamber by exhausting air through the exhaust port.

A third aspect is the substrate processing apparatus of the first aspect or the second aspect, wherein the chamber has the heat insulating material whose surface is covered with the fiber reinforced resin.

The fourth aspect is the substrate processing apparatus of the third aspect, further comprising a heating portion for heating the substrate supported by the substrate support portion.

A fifth aspect is the substrate processing apparatus of the fourth aspect, wherein the chamber is supported by the substrate support portion and is supported by the ceiling portion facing the main surface of the substrate and the substrate supported by the substrate support portion. The ceiling portion or the surface of the side wall portion is covered with the fiber reinforced resin.

The sixth aspect is the substrate processing apparatus of the fifth aspect, in which the gas flow path portion located in the ceiling portion or the side wall portion and constituting the flow path through which the high temperature gas can pass and the gas flow path portion. It has an injection unit that is connected and injects a high-temperature gas that passes through the flow path into the chamber.

A seventh aspect is the substrate processing apparatus according to any one of the first to sixth aspects, wherein the heat insulating material is covered with the first fiber reinforced resin and the first surface and the first aspect. It has a second surface covered with a second fiber reinforced resin different from the fiber reinforced resin.

Eighth aspect is the substrate processing apparatus according to any one of the first to seventh aspects, in which at least a part of the surface of the heat insulating material is covered with different kinds of laminated fiber reinforced resins.

A ninth aspect is a heat insulating member comprising a core layer containing a heat insulating material and a fiber reinforced resin layer including a fiber reinforced resin, which is a layer covering the entire surface of the core layer.

A tenth aspect is the heat insulating member of the ninth aspect, wherein the core layer has a first surface and a second surface different from the first surface, and the fiber-reinforced resin layer is the same. A layer covering the first surface of the core layer, the first fiber-reinforced resin layer containing the first fiber-reinforced resin, and a layer covering the second surface of the core layer, the first fiber. It includes a second fiber reinforced resin layer containing a second fiber reinforced resin different from the reinforced resin.

The eleventh aspect is the heat insulating member according to the ninth aspect or the tenth aspect, wherein the fiber reinforced resin layer includes a plurality of laminated layers, and the plurality of layers are different types of fiber reinforced resins. including.

According to the substrate processing apparatus of the first aspect, dust generation of the heat insulating material is suppressed by covering the heat insulating material with the fiber reinforced resin. As a result, it is possible to prevent the inside of the chamber from being contaminated with dust of the heat insulating material.

According to the substrate processing apparatus of the second aspect, vacuum drying can be performed.

According to the substrate processing apparatus of the third aspect, since the chamber has the heat insulating material, the heat dissipation of the chamber is reduced. Further, since the heat insulating material is covered with the fiber reinforced resin, it is possible to prevent dust and the like of the heat insulating material from being scattered inside or outside the chamber.

According to the substrate processing apparatus of the fourth aspect, the substrate supported by the substrate support portion can be heated in the chamber.

According to the substrate processing apparatus of the fifth aspect, the main surface of the substrate can be covered with the ceiling portion, and the side surface of the substrate can be surrounded by the side wall portion. By using insulation covered with fiber reinforced plastic instead of aluminum or stainless steel, heat dissipation in the chamber can be reduced.

According to the substrate processing apparatus of the sixth aspect, the substrate can be heated by injecting a high-temperature gas from the injection unit into the chamber. The chamber can be made smaller by arranging the gas flow path portion in the ceiling portion or the side wall portion.

According to the substrate processing apparatus of the seventh aspect, the first surface and the second surface of the heat insulating material can have different characteristics.

According to the substrate processing apparatus of the eighth aspect, the surface of the heat insulating material can have different kinds of characteristics.

According to the heat insulating member of the ninth aspect, dust generation of the heat insulating material can be suppressed by covering the heat insulating material with the fiber reinforced resin.

According to the heat insulating member of the tenth aspect, the first surface and the second surface of the heat insulating material can have different properties.

According to the heat insulating member of the eleventh aspect, the surface of the heat insulating material can have different kinds of properties.

It is a perspective view which shows the substrate processing apparatus which concerns on 1st Embodiment. It is sectional drawing of the substrate processing apparatus which concerns on 1st Embodiment. It is a figure which shows the high temperature gas supply part. It is sectional drawing which shows a part of a chamber. It is sectional drawing which shows the ceiling part which incorporated the gas flow path part. It is a schematic diagram which shows the substrate processing apparatus which concerns on 2nd Embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. It should be noted that the components described in this embodiment are merely examples, and the scope of the present invention is not limited to them. In the drawings, the dimensions and numbers of each part may be exaggerated or simplified as necessary for easy understanding.

<1. First Embodiment>
FIG. 1 is a perspective view showing the substrate processing apparatus 1 according to the first embodiment. FIG. 2 is a cross-sectional view of the substrate processing apparatus 1 according to the first embodiment. In the following description, the vertical upward direction is simply referred to as "up", and the vertical downward direction is simply referred to as "downward". The inside of chamber 2 is simply referred to as "inside" and the outside of chamber 2 is simply referred to as "outside". However, the directions described below explain the positional relationship of each element, and do not limit the positional relationship of each element.

The substrate processing device 1 is a heat treatment device that heat-treats the substrate 9. The substrate 9 to be processed is, for example, various substrates to be processed for electronic devices, specifically, a semiconductor wafer, a glass substrate for a liquid crystal display or a plasma display, a glass or ceramic substrate for a magnetic disk or an optical disk, and the like. A glass substrate for an organic EL, a glass or silicon substrate for a solar cell, a flexible substrate, a printed circuit board, and the like.

The substrate processing apparatus 1 has a chamber 2, a plurality of support pins 3, a hot plate 4, and a high temperature gas supply unit 5. Hereinafter, each component of the substrate processing apparatus 1 will be described.

<Chamber>
The chamber 2 is a housing for accommodating the substrate 9. The chamber 2 forms a processing space for processing the housed substrate 9. The chamber 2 is, for example, a rectangular parallelepiped. The chamber 2 has a ceiling portion 21, a side wall portion 22, and a bottom portion 23. The ceiling portion 21 is a partition wall that partitions the upper side of the accommodation space. The bottom portion 23 is a partition wall that partitions the lower side of the accommodation space. The side wall portion 22 is a partition wall that partitions the accommodation space at a position between the ceiling portion 21 and the bottom portion 23. When the substrate 9 is supported on the upper end of each support pin 3 described later, the inner surface of the ceiling portion 21 faces the upper surface which is the main surface (largest surface) of the substrate 9. Further, the inner surface of the side wall portion 22 faces the side surface of the substrate 9. The side wall portion 22 surrounds the side surface of the substrate 9.

The ceiling portion 21 has, for example, a rectangular shape when viewed from above. The side wall portion 22 has, for example, a rectangular ring when viewed from above. The lower end of the ceiling portion 21 is connected to the upper end of the side wall portion 22. The ceiling portion 21 may be placed on the upper side of the side wall portion 22. In this case, the ceiling portion 21 or the side wall portion 22 may be in contact with each other via the packing. The packing allows the ceiling portion 21 to eliminate the gap between the ceiling portion 21 and the side wall portion 22.

The side wall portion 22 has an opening portion 221 and a door portion 223. The opening 221 constitutes a carry-in entrance that communicates the inside and the outside of the chamber 2. The substrate 9 is taken in and out of the chamber 2 through the opening 221. The door portion 223 can be moved between the closed position where the carry-in entrance is closed and the open position where the carry-in entrance is opened. As shown in FIG. 2, the arm 100 of the transport mechanism carries the substrate 9 to be processed into the chamber 2. Further, the arm 100 carries out the heat-treated substrate 9 from the chamber 2.

<Support pin>
The substrate processing device 1 has a plurality of support pins 3 and a pin drive unit 31. The support pin 3 has a rod shape extending in the vertical direction. The support pin 3 penetrates the bottom 23 and the hot plate 4 in the vertical direction. The pin drive unit 31 integrally moves each support pin 3 along the vertical direction. The plurality of support pins 3 horizontally support the substrate 9 in the chamber 2. The plurality of support pins 3 are examples of a substrate support portion that supports the substrate 9 in the chamber 2.

<Hot plate>
The hot plate 4 is installed on the bottom 23 side in the chamber 2. The chamber 2 surrounds the hot plate 4. The hot plate 4 has a heater (heat source) inside. The hot plate is an example of a heating unit.

The bottom 23 of the chamber 2 and the hot plate 4 have a plurality of through holes that penetrate in the thickness direction. Each support pin 3 is inserted into a through hole in the bottom 23 and the hot plate 4.

<High temperature gas supply unit>
FIG. 3 is a diagram showing a high temperature gas supply unit 5. The high temperature gas supply unit 5 is a device that supplies high temperature gas into the chamber 2. The high temperature gas supply unit 5 includes a plurality of gas flow path units 51, a plurality of injection units 53, a heater 55, and an air supply unit 57.

The gas flow path portion 51 constitutes a flow path through which high-temperature gas can pass. The gas flow path portion 51 is incorporated in the ceiling portion 21. The gas flow path portion 51 is located in the ceiling portion 21. The injection unit 53 is connected to the gas flow path unit 51. The injection unit 53 forms an injection port for injecting the high-temperature gas flowing through the flow path of the gas flow path portion 51 into the chamber 2. The injection port corresponds to a ventilation port for supplying air to the inside of the chamber 2. The injection portion 53 is a tubular member that forms an opening on the inner surface of the ceiling portion 21. The injection portion 53 is located on the ceiling portion 21.

The high temperature gas supply unit 5 includes a plurality of sets (5 sets in this example) of the gas flow path unit 51 and the injection unit 53. However, the high temperature gas supply unit 5 may include only one set of the gas flow path unit 51 and the injection unit 53.

The upstream end of each gas flow path 51 is exposed to the outside of the ceiling 21 and is connected to the heater 55. The heater 55 is, for example, an in-line heater. The injection portion 53 is connected to the heater 55 via the gas flow path portion 51. The air supply unit 57 supplies gas to the heater 55. The air supply unit 57 has, for example, a fan. The heater 55 heats the gas supplied from the air supply unit 57. The gas heated by the heater 55 passes through each gas flow path portion 51 and is injected from each injection portion 53 into the chamber 2. As a result, the temperature inside the chamber 2 rises, so that the substrate 9 housed in the chamber 2 is heated. The high temperature gas supply unit 5 is an example of a heating unit.

The injection portions 53 may be uniformly dispersed and arranged on the inner surface of the ceiling portion 21. As a result, the high temperature gas is suppressed from being biased in the chamber 2, so that uneven heating of the substrate 9 is suppressed.

As shown in FIG. 2, the chamber 2 may have an exhaust port 225 communicating with the outside of the chamber 2. The gas in the chamber 2 may be discharged to the outside through the exhaust port 225. Further, the exhaust port 225 may communicate with the air supply unit 57. In this case, the gas discharged from the chamber 2 through the exhaust port 225 can be returned to the chamber 2 again.

When the substrate 9 is heat-treated in the substrate processing apparatus 1, first, the opening 221 is opened by moving the door portion 223 to the open position. With the opening 221 open, the substrate 9 supported by the arm 100 of the transport mechanism in a horizontal posture is inserted into the chamber 2 and placed above the hot plate 4. The pin drive unit 31 lifts the substrate 9 from the arm 100 by raising each support pin 3. Then, the arm 100 retracts to the outside of the chamber 2. When the arm 100 is retracted, the pin drive unit 31 lowers each support pin 3 to arrange the substrate 9 at a heating position close to the hot plate 4. The temperature of the hot plate 4 is raised while the substrate 9 is arranged at the heating position. Then, the substrate 9 is heated by the radiant heat of the hot plate 4. Further, the high temperature gas supply unit 5 supplies the high temperature gas into the chamber 2. The substrate 9 is heated by this high temperature gas.

FIG. 4 is a cross-sectional view showing a part of the chamber 2. The chamber 2 has a core layer 25, a first fiber reinforced resin layer 26, and a second fiber reinforced resin layer 27.

The core layer 25 contains, for example, a heat insulating material. The heat insulating material is, for example, a fiber-based heat insulating material, a foam-based heat insulating material, airgel, fumed silica, or a vacuum heat insulating material. The fiber-based heat insulating material is, for example, glass wool, rock wool, cellulose fiber, carbonized cork, wool heat insulating material, wood fiber and the like. The foam-based heat insulating material is, for example, urethane foam, phenol foam, polystyrene foam, beaded polystyrene (EPS), foamed rubber (FEF), and extruded polystyrene (XPS). The airgel is, for example, Syria aerogel, carbon aerogel, and alumina aerogel.

The first fiber reinforced resin layer 26 and the second fiber reinforced resin layer 27 are made of fiber reinforced plastics (FRP). The fiber reinforced resin is a reinforced resin in which fibers are compounded with the resin to improve the strength. The fiber reinforced resin can be produced by impregnating a sheet-shaped fiber cloth with the resin. The resin is a thermosetting resin or a thermoplastic resin. Thermosetting resins are, for example, epoxies, vinyl esters, phenols, unsaturated polyesters, polyimides and bismaleimides. The thermoplastic resin is, for example, polyolefin, polyamide, polycarbonate, polyphenylene sulfide, or polyetheretherketone. The fiber is, for example, glass fiber, carbon fiber, basalt fiber, boron fiber, aramid fiber, polyethylene fiber, polyparaphenylene benzobisoxazole fiber.

By using the fiber reinforced resin on the surface of the chamber 2, it is possible to reduce the weight of the chamber 2 while suppressing the decrease in the strength of the chamber 2. By replacing a material with relatively high heat dissipation such as aluminum or stainless steel with a fiber reinforced resin, the heat dissipation of the chamber 2 can be reduced.

The first fiber reinforced resin layer 26 is located inside the core layer 25. The second fiber reinforced resin layer 27 is located outside the core layer 25. That is, the ceiling portion 21, the side wall portion 22, and the bottom portion 23 of the chamber 2 have the first fiber reinforced resin layer 26, the core layer 25, and the second fiber reinforced resin layer 27 in this order from the inside to the outside of the chamber 2. As described above, the chamber 2 is composed of a heat insulating material (core layer 25) whose surface is covered with a fiber reinforced resin (first fiber reinforced resin layer 26, second fiber reinforced resin layer 27).

<First fiber reinforced resin layer>
The first fiber reinforced resin layer 26 has a first inner layer 261 and a first surface layer 263. The first inner layer 261 is located inside the core layer 25. The first inner layer 261 covers the inner surface of the core layer 25. The first surface layer 263 is located inside the first inner layer 261. The first surface layer 263 covers the inner surface of the first inner layer 261. The first surface layer 263 is the inner surface of the chamber 2. That is, the first surface layer 263 covers the surface of the core layer 25 (heat insulating material) facing the processing space formed by the chamber 2. The first inner layer 261 and the first surface layer 263 are composed of different types of fiber reinforced resins. That is, the inner surface of the chamber 2 is composed of a plurality of types of fiber reinforced resins laminated in the thickness direction.

<Second fiber reinforced resin layer>
The second fiber reinforced resin layer 27 has a second inner layer 271 and a second surface layer 273. The second inner layer 271 is located outside the core layer 25. The second inner layer 271 covers the outer surface of the core layer 25. The second surface layer 273 is located outside the second inner layer 271. The second surface layer 273 covers the outer surface of the second inner layer 271. The second surface layer 273 is the outer surface of the chamber 2. The second inner layer 271 and the second surface layer 273 are composed of different types of fiber reinforced resins. That is, the outer surface of the chamber 2 is composed of a plurality of types of fiber reinforced resins laminated in the thickness direction.

During the heat treatment, the first fiber reinforced resin layer 26 is exposed to a higher temperature than the second fiber reinforced resin layer 27. Therefore, the first fiber reinforced resin layer 26 may be made of a fiber reinforced resin having a lower coefficient of thermal expansion than the fiber reinforced resin of the second fiber reinforced resin layer 27. By forming the first fiber reinforced resin layer 26 exposed to high temperature with a fiber reinforced resin having a low coefficient of thermal expansion, deformation of the chamber 2 due to heat treatment can be suppressed.

The resin used in each of the first inner layer 261 and the first surface layer 263 may be different. The first surface layer 263 may contain a resin (chemical resistant resin) having a higher chemical resistance grade than the resin contained in the first inner layer 261. The chemical resistant resin is, for example, phenol, unsaturated polyester, polyphenylene sulfide. The first inner layer 261 may contain a resin (flame-retardant resin) having a higher flame resistance grade than the resin contained in the first surface layer 263. The flame-retardant resin is, for example, phenol. Further, the first inner layer 261 may contain a resin (heat resistant resin) having a higher heat resistance grade than the resin of the first surface layer 263. The heat-resistant resin is, for example, polyimide, bismaleimide, polyamide, polyphenylene sulfide, or polyetheretherketone. By forming the surface of the chamber 2 with a plurality of types of fiber-reinforced resins containing resins having different resistances, the surface of the chamber 2 can be provided with different types of resistances (characteristics).

The first surface layer 263 may have a higher cosmetic grade than the fiber reinforced resin of the first inner layer 261. The second surface layer 273 may be made of a fiber reinforced resin having a higher cosmetic grade than the fiber reinforced resin of the second inner layer 271. By increasing the cosmetic grade of the first surface layer 263 and the second surface layer 273, it is possible to suppress the generation of dust from the chamber 2.

The first surface layer 263 is, for example, a fiber-reinforced resin obtained by reinforcing a chemical-resistant resin with basalt fibers. The first inner layer 261 is, for example, a fiber-reinforced resin obtained by reinforcing a flame-retardant resin with glass fiber. The second surface layer 273 is, for example, a fiber-reinforced resin obtained by reinforcing a chemical-resistant resin with glass fiber. The second inner layer 271 is, for example, a fiber-reinforced resin obtained by reinforcing a flame-retardant resin with carbon fibers.

The first surface layer 263 may be thinner than the first inner layer 261. Further, the second surface layer 273 may be thinner than the second inner layer 271. By thinning the first surface layer 263 or the second surface layer 273, the material cost of the chamber 2 can be suppressed.

The core layer 25 is covered with the first fiber reinforced resin layer 26 and the second fiber reinforced resin layer 27. That is, the heat insulating material is covered with a fiber reinforced layer. As a result, it is possible to suppress the generation of dust in the heat insulating material. Therefore, the contamination of the substrate processing apparatus 1 by the dust of the heat insulating material is suppressed. The entire outer surface of the core layer 25 may be covered with a layer of fiber reinforced resin. That is, not only the main surfaces on both sides of the core layer 25 but also the side surfaces excluding the main surfaces on both sides may be covered with the layer of the fiber reinforced resin. In this case, dust generation of the heat insulating material contained in the core layer 25 can be suppressed as compared with the case where a part of the surface of the core layer 25 is covered with the fiber reinforced resin layer.

A portion of chamber 2 (eg, ceiling 21, side wall 22 or bottom 23) may be configured to be replaceable. When the substrate processing device 1 is installed in the clean room, for example, it is assumed that only the ceiling portion 21 is brought into the clean room in order to replace the ceiling portion 21 which is a part of the chamber 2. In this case, by making the ceiling portion 21 a heat insulating member in which the entire outer surface of the core layer 25 including the heat insulating material is covered with a layer of fiber reinforced resin, contamination in the clean room due to dust generation can be suppressed.

By having the heat insulating material in the chamber 2, it is possible to suppress the heat of the hot plate 4 and the heat of the gas supplied by the high temperature gas supply unit 5 from diffusing out of the chamber 2.

FIG. 5 is a cross-sectional view showing a ceiling portion 21 in which the gas flow path portion 51 is incorporated. The gas flow path portion 51 may be arranged in the core layer 25. That is, the gas flow path portion 51 may be arranged between the first fiber reinforced resin layer 26 and the second fiber reinforced resin layer 27. Each gas flow path portion 51 may be arranged, for example, in a plurality of accommodating grooves 251 previously provided on the inner surface of the core layer 25 (see FIGS. 4 and 5). The plurality of accommodating grooves 251 are concave portions provided in advance on one main surface of the core layer 25 (heat radiating material in this example). One main surface is, for example, a surface covered with the first fiber reinforced resin layer 26.

When the gas flow path portion 51 is accommodated in the accommodating groove 251, for example, with the gas flow path portion 51 and the injection portion 53 installed in the accommodating groove 251 on one main surface of the core layer 25, the first 1 Inner layer 261 may be formed. The first inner layer 261 is formed, for example, by molding. Specifically, the core layer 25 and the fiber cloth for forming the first inner layer 261 are arranged so as to be overlapped in a mold (not shown). Then, the resin for forming the first inner layer 261 is poured into the mold, so that the resin is impregnated into the fiber cloth. Then, by curing the resin, the first inner layer 261 is formed on one main surface of the core layer 25. When forming the first inner layer 261, the resin may be allowed to enter the accommodation groove 251 of the core layer 25. In this case, as shown in FIG. 5, the gas flow path portion 51 is fixed in the accommodation groove 251 by filling the gap between the inner surface of the accommodation groove 251 and the outer surface of the gas flow path portion 51 with the resin. After the first inner layer 261 is formed, the first surface layer 263 is formed. The second fiber reinforced resin layer 27 can also be formed on the other main surface of the core layer 25, similarly to the first fiber reinforced resin layer 26.

Since the gas flow path portion 51 is incorporated in the core layer 25 including the heat insulating material, the temperature drop of the high temperature gas in the gas flow path portion 51 is suppressed.

The substrate processing apparatus 1 may be provided with a supply unit for supplying a mist of the processing liquid or a vapor (fume) of the processing liquid in the chamber 2. In this case, a tank for storing the treatment liquid, a heating unit for heating the treatment liquid from the tank, and the like may be provided outside the chamber 2. Further, the flow path portion through which the treatment liquid from the tank passes may be incorporated in the core layer 25 in the same manner as the gas flow path portion 51.

<2. 2nd Embodiment>
Next, the second embodiment will be described. In the following description, elements having the same functions as the elements already described may be given the same code or a code to which alphabetic characters are added, and detailed description may be omitted.

FIG. 6 is a schematic view showing the substrate processing apparatus 1A according to the second embodiment. The substrate processing device 1A is a vacuum drying device that dries the substrate 9 by reducing the pressure. The substrate processing device 1A includes a chamber 2A, a plurality of support pins 3, a decompression unit 61, and an air supply unit 57.

The chamber 2A forms a processing space for processing the substrate 9. The plurality of support pins 3 support the substrate 9 in a horizontal position in the chamber 2A. The chamber 2A has a vent 224 for supplying air to the processing space and an exhaust port 225 for exhausting from the processing space. The exhaust port 225 is connected to the decompression unit 61. The vent 224 is connected to the air supply unit 57.

The decompression unit 61 generates a negative pressure for discharging gas from the chamber 2A through the exhaust port 225. The decompression unit 61 has, for example, a vacuum pump. The air supply unit 57 supplies gas into the chamber 2A via the vent 224. The air supply unit 57 has, for example, a fan. Further, the air supply unit 57 may have a switching valve for switching between a state in which the ventilation port 224 communicates with the outside air and a state in which the ventilation port 224 is shut off from the outside air.

When the chamber 2A is depressurized, the depressurizing unit 61 discharges the gas into the chamber 2A while the air supply unit 57 stops the air supply. Further, when the pressure in the chamber 2A is returned to the atmospheric pressure, the air supply unit 57 supplies air with the decompression unit 61 stopping the exhaust.

Similar to the chamber 2 of the first embodiment, the chamber 2A is made of a heat insulating material whose surface is covered with a fiber reinforced resin. Therefore, since the inside and the outside of the chamber 2A can be insulated, the temperature around the chamber 2A is suppressed from affecting the processing (decompression drying treatment) of the substrate 9 in the chamber 2A. In addition, the surface of the heat insulating material is covered with a fiber reinforced resin. Therefore, even if air supply / exhaust, depressurization, and boosting are performed in the chamber 2A, dust generation of the heat insulating material is suppressed, so that the substrate 9 can be prevented from being contaminated with dust of the heat insulating material.

The substrate processing apparatus 1A may include a heating unit such as a hot plate 4 in the chamber 2A. The substrate processing apparatus 1A may heat the substrate 9 while the pressure is reduced by the heating unit.

<3. Modification example>
Although the embodiments have been described above, the present invention is not limited to the above, and various modifications are possible.

The pin drive unit 31 may place the substrate 9 on the hot plate 4 by moving the upper end of each support pin 3 below the upper surface of the hot plate 4. Then, the substrate 9 may be heated while the substrate 9 is supported by the hot plate 4. In this case, the hot plate 4 functions as a substrate support.

The substrate support portion may be a support tool that holds the peripheral edge portion of the substrate 9.

Although the gas flow path portion 51 is incorporated in the ceiling portion 21, it may be incorporated in the side wall portion 22.

The first fiber reinforced resin layer 26 is composed of two layers (first inner layer 261 and first surface layer 263), but may be composed of a single layer or three or more layers. good. The same applies to the second fiber reinforced resin layer 27.

The first fiber reinforced resin layer 26 and the second fiber reinforced resin layer 27 may be made of the same fiber reinforced resin.

One surface in the chamber 2 may be composed of different types of fiber reinforced plastics. For example, in one first inner layer 261, some parts and other parts may be made of fiber reinforced resins of different types from each other.

The substrate processing apparatus 1 may be configured so that a plurality of substrates 9 can be heat-treated at the same time. The substrate processing apparatus 1 may include a substrate support portion capable of simultaneously supporting a plurality of substrates 9 in the chamber 2.

It is not essential that the substrate processing apparatus 1 includes both the hot plate 4 and the high temperature gas supply unit 5 as heating units. The substrate processing apparatus 1 may include only one of the hot plate 4 and the high temperature gas supply unit 5. Further, the substrate processing apparatus 1 may have a configuration (for example, a lamp or the like) for heating the substrate 9 by a method different from that of the hot plate 4 and the high temperature gas supply unit 5.

Although the invention has been described in detail, the above description is exemplary in all aspects and the invention is not limited thereto. It is understood that innumerable variations not illustrated can be assumed without departing from the scope of the present invention. Each configuration described in each of the above-described embodiments and modifications can be appropriately combined or omitted as long as they do not conflict with each other.

1,1A Board processing device 2,2A Chamber 3 Support pin 4 Hot plate 5 High temperature gas supply part 9 Board 21 Ceiling part 22 Side wall part 25 Core layer 26 First fiber reinforced resin layer 27 Second fiber reinforced resin layer 51 Gas flow path Part 53 Injection part 55 Heater 57 Air supply part 61 Decompression part 224 Vent 225 Exhaust port 261 First inner layer 263 First surface layer 271 Second inner layer 273 Second surface layer

Claims (11)

It is a board processing device
A chamber that forms a processing space for processing the substrate and has a vent for supplying air to the processing space and an exhaust port for exhausting from the processing space.
A substrate support portion that supports the substrate in the chamber,
Equipped with
The chamber is
A substrate processing apparatus having a surface facing the processing space and having a heat insulating material whose surface is covered with a fiber reinforced resin. The substrate processing apparatus according to claim 1.
A decompression unit that decompresses the inside of the chamber by exhausting air through the exhaust port.
Further equipped with a substrate processing device. The substrate processing apparatus according to claim 1 or 2.
The chamber
A substrate processing apparatus having the heat insulating material whose surface is covered with the fiber reinforced resin. The substrate processing apparatus according to claim 3.
A heating unit that heats the substrate supported by the substrate support.
Further equipped with a substrate processing device. The substrate processing apparatus according to claim 4.
The chamber
A ceiling portion that is supported by the substrate support portion and faces the main surface of the substrate, and a ceiling portion that faces the main surface of the substrate.
A side wall portion that surrounds the side surface of the substrate supported by the substrate support portion, and a side wall portion.
Have,
A substrate processing apparatus in which the surface of the ceiling portion or the side wall portion is covered with the fiber reinforced resin. The substrate processing apparatus according to claim 5.
A gas flow path portion located in the ceiling portion or the side wall portion and constituting a flow path through which high-temperature gas can pass, and a gas flow path portion.
An injection unit that is connected to the gas flow path and injects high-temperature gas that passes through the flow path into the chamber.
Has a substrate processing device. The substrate processing apparatus according to any one of claims 1 to 6.
The heat insulating material
The first surface covered with the first fiber reinforced plastic,
A second surface covered with a second fiber reinforced resin different from the first fiber reinforced resin, and
Has a substrate processing device. The substrate processing apparatus according to any one of claims 1 to 7.
A substrate processing apparatus in which at least a part of the surface of the heat insulating material is covered with different types of laminated fiber reinforced plastics. It is a heat insulating member
With a core layer containing insulation,
A fiber-reinforced resin layer that covers the entire surface of the core layer and contains a fiber-reinforced resin.
A heat insulating member. The heat insulating member according to claim 9.
The core layer has a first surface and a second surface different from the first surface.
The fiber reinforced resin layer is
A layer covering the first surface of the core layer, the first fiber reinforced resin layer containing the first fiber reinforced resin, and the first fiber reinforced resin layer.
A second fiber reinforced resin layer that covers the second surface of the core layer and contains a second fiber reinforced resin different from the first fiber reinforced resin.
Insulation material, including. The heat insulating member according to claim 9 or 10.
The fiber reinforced resin layer includes a plurality of laminated layers, and includes a plurality of laminated layers.
The plurality of layers are heat insulating members containing different types of fiber reinforced resins.

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