JP2022044033A - 基板本体の表面をパターニングする方法および基板本体 - Google Patents

基板本体の表面をパターニングする方法および基板本体 Download PDF

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Publication number
JP2022044033A
JP2022044033A JP2021144037A JP2021144037A JP2022044033A JP 2022044033 A JP2022044033 A JP 2022044033A JP 2021144037 A JP2021144037 A JP 2021144037A JP 2021144037 A JP2021144037 A JP 2021144037A JP 2022044033 A JP2022044033 A JP 2022044033A
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Japan
Prior art keywords
curved
substrate
substrate body
substrate material
partially
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Pending
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JP2021144037A
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English (en)
Japanese (ja)
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JP2022044033A5 (https=
Inventor
オアトナー アンドレアス
Ortner Andreas
ゾーア ダーフィト
Sohr David
ウルリヒ トーマス イェンス
Ulrich Thomas Jens
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Schott AG
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Schott AG
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Priority claimed from EP20194675.3A external-priority patent/EP3964323A1/de
Application filed by Schott AG filed Critical Schott AG
Publication of JP2022044033A publication Critical patent/JP2022044033A/ja
Publication of JP2022044033A5 publication Critical patent/JP2022044033A5/ja
Priority to JP2025088177A priority Critical patent/JP2025124754A/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/62—Surface treatment of fibres or filaments made from glass, minerals or slags by application of electric or wave energy; by particle radiation or ion implantation
    • C03C25/6206—Electromagnetic waves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H10P14/6536—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to radiation, e.g. visible light
    • H10P14/6542—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to radiation, e.g. visible light by using coherent radiation, e.g. using a laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00595—Control etch selectivity
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/62—Surface treatment of fibres or filaments made from glass, minerals or slags by application of electric or wave energy; by particle radiation or ion implantation
    • C03C25/6206—Electromagnetic waves
    • C03C25/6208—Laser
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0025—Machining, e.g. grinding, polishing, diamond turning, manufacturing of mould parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/0143—Focussed beam, i.e. laser, ion or e-beam

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Geometry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Surface Treatment Of Glass (AREA)
  • Laser Beam Processing (AREA)
JP2021144037A 2020-09-04 2021-09-03 基板本体の表面をパターニングする方法および基板本体 Pending JP2022044033A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025088177A JP2025124754A (ja) 2020-09-04 2025-05-27 基板本体の表面をパターニングする方法および基板本体

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP20194675.3A EP3964323A1 (de) 2020-09-04 2020-09-04 Verfahren zum oberflächenstrukturieren eines substratkörpers und substratkörper
EP20194675 2020-09-04
EP21159715 2021-02-26
EP21159715 2021-02-26

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025088177A Division JP2025124754A (ja) 2020-09-04 2025-05-27 基板本体の表面をパターニングする方法および基板本体

Publications (2)

Publication Number Publication Date
JP2022044033A true JP2022044033A (ja) 2022-03-16
JP2022044033A5 JP2022044033A5 (https=) 2024-11-06

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JP2021144037A Pending JP2022044033A (ja) 2020-09-04 2021-09-03 基板本体の表面をパターニングする方法および基板本体
JP2025088177A Pending JP2025124754A (ja) 2020-09-04 2025-05-27 基板本体の表面をパターニングする方法および基板本体

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JP2025088177A Pending JP2025124754A (ja) 2020-09-04 2025-05-27 基板本体の表面をパターニングする方法および基板本体

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Country Link
US (2) US12486197B2 (https=)
EP (1) EP3964324A1 (https=)
JP (2) JP2022044033A (https=)
KR (1) KR102823457B1 (https=)
CN (1) CN114141606A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210141570A (ko) 2019-03-21 2021-11-23 코닝 인코포레이티드 환형 볼텍스 레이저 빔을 사용하는 유리-기반 물체에 마이크로-홀을 형성하기 위한 시스템 및 방법
WO2021003018A1 (en) 2019-07-01 2021-01-07 Corning Incorporated Method of laser processing of transparent workpieces using curved quasi-non-diffracting laser beams
US12434331B2 (en) 2020-09-11 2025-10-07 Corning Incorporated Laser forming non-square edges in transparent workpieces using modified airy beams
US12006245B2 (en) * 2020-09-11 2024-06-11 Corning Incorporated Laser forming non-square edges in transparent workpieces using low intensity airy beams

Citations (6)

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JP2005219960A (ja) * 2004-02-05 2005-08-18 Nishiyama Stainless Chem Kk ガラスの切断分離方法、フラットパネルディスプレイ用ガラス基板、フラットパネルディスプレイ
JP2016011219A (ja) * 2014-06-27 2016-01-21 旭硝子株式会社 ガラス基板の切断方法
US20160016257A1 (en) * 2014-07-21 2016-01-21 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser curved filamentation within transparent materials
US20170203994A1 (en) * 2016-01-14 2017-07-20 Corning Incorporated Dual-airy-beam systems and methods for processing glass substrates
US20190119150A1 (en) * 2017-10-20 2019-04-25 Corning Incorporated Methods for laser processing transparent workpieces using pulsed laser beam focal lines and chemical etching solutions
JP2019108255A (ja) * 2017-12-20 2019-07-04 株式会社Ｎｓｃ ガラス基板製造方法

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US5919607A (en) * 1995-10-26 1999-07-06 Brown University Research Foundation Photo-encoded selective etching for glass based microtechnology applications
CN1287442C (zh) * 2002-07-30 2006-11-29 新浪潮研究公司 利用固态uv激光器对蓝宝石衬底划线
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
US10226837B2 (en) * 2013-03-15 2019-03-12 Nlight, Inc. Thermal processing with line beams
EP3854513B1 (de) 2014-11-19 2024-01-03 TRUMPF Laser- und Systemtechnik GmbH System zur asymmetrischen optischen strahlformung
DE102014116957A1 (de) 2014-11-19 2016-05-19 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung
DE102014226649A1 (de) * 2014-12-19 2016-06-23 Universität Ulm Verfahren zur Herstellung eines mit Nanodrähten strukturierten Substrats, hergestelltes Substrat und Verwendung des Substrats
JP2018070429A (ja) * 2016-11-02 2018-05-10 ウシオ電機株式会社 穴あき基板の製造方法、微細構造体の製造方法、およびレーザ改質装置
JP2020531392A (ja) * 2017-08-25 2020-11-05 コーニング インコーポレイテッド アフォーカルビーム調整アセンブリを用いて透明被加工物をレーザ加工するための装置及び方法
JP6938021B2 (ja) * 2017-10-31 2021-09-22 株式会社ブイ・テクノロジー レーザリフトオフによる加工方法及び平坦化治具
JP6695318B2 (ja) * 2017-12-27 2020-05-20 Hoya株式会社 円盤状ガラス基板の製造方法、薄板ガラス基板の製造方法、導光板の製造方法及び円盤状ガラス基板
JP7259845B2 (ja) * 2018-03-26 2023-04-18 Ａｇｃ株式会社 拡散素子、照明モジュールおよび非球面レンズの加工方法
DE102018110211A1 (de) * 2018-04-27 2019-10-31 Schott Ag Verfahren zum Erzeugen feiner Strukturen im Volumen eines Substrates aus sprödharten Material
WO2021076432A1 (en) * 2019-10-14 2021-04-22 Corning Incorporated Foldable apparatus and methods of making
KR102728003B1 (ko) * 2019-11-14 2024-11-12 삼성디스플레이 주식회사 폴더블 유리 기판, 및 이를 포함하는 폴더블 표시 장치

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Publication number Priority date Publication date Assignee Title
JP2005219960A (ja) * 2004-02-05 2005-08-18 Nishiyama Stainless Chem Kk ガラスの切断分離方法、フラットパネルディスプレイ用ガラス基板、フラットパネルディスプレイ
JP2016011219A (ja) * 2014-06-27 2016-01-21 旭硝子株式会社 ガラス基板の切断方法
US20160016257A1 (en) * 2014-07-21 2016-01-21 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser curved filamentation within transparent materials
US20170203994A1 (en) * 2016-01-14 2017-07-20 Corning Incorporated Dual-airy-beam systems and methods for processing glass substrates
US20190119150A1 (en) * 2017-10-20 2019-04-25 Corning Incorporated Methods for laser processing transparent workpieces using pulsed laser beam focal lines and chemical etching solutions
JP2019108255A (ja) * 2017-12-20 2019-07-04 株式会社Ｎｓｃ ガラス基板製造方法

Also Published As

Publication number Publication date
US12486197B2 (en) 2025-12-02
CN114141606A (zh) 2022-03-04
US20220073427A1 (en) 2022-03-10
EP3964324A1 (de) 2022-03-09
JP2025124754A (ja) 2025-08-26
KR102823457B1 (ko) 2025-06-19
KR20220031526A (ko) 2022-03-11
US20260055023A1 (en) 2026-02-26

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