CN114141606A - 衬底主体的表面结构化方法和衬底主体 - Google Patents

衬底主体的表面结构化方法和衬底主体 Download PDF

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Publication number
CN114141606A
CN114141606A CN202111037013.2A CN202111037013A CN114141606A CN 114141606 A CN114141606 A CN 114141606A CN 202111037013 A CN202111037013 A CN 202111037013A CN 114141606 A CN114141606 A CN 114141606A
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CN
China
Prior art keywords
substrate body
curved
substrate
distinctive
substrate material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111037013.2A
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English (en)
Chinese (zh)
Inventor
A·奥特纳
D·佐尔
J·U·托马斯
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Schott AG
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Schott AG
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Publication date
Priority claimed from EP20194675.3A external-priority patent/EP3964323A1/de
Application filed by Schott AG filed Critical Schott AG
Publication of CN114141606A publication Critical patent/CN114141606A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/62—Surface treatment of fibres or filaments made from glass, minerals or slags by application of electric or wave energy; by particle radiation or ion implantation
    • C03C25/6206—Electromagnetic waves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H10P14/6536—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to radiation, e.g. visible light
    • H10P14/6542—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to radiation, e.g. visible light by using coherent radiation, e.g. using a laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00595—Control etch selectivity
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/62—Surface treatment of fibres or filaments made from glass, minerals or slags by application of electric or wave energy; by particle radiation or ion implantation
    • C03C25/6206—Electromagnetic waves
    • C03C25/6208—Laser
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0025—Machining, e.g. grinding, polishing, diamond turning, manufacturing of mould parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/0143—Focussed beam, i.e. laser, ion or e-beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Geometry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Surface Treatment Of Glass (AREA)
  • Laser Beam Processing (AREA)
CN202111037013.2A 2020-09-04 2021-09-06 衬底主体的表面结构化方法和衬底主体 Pending CN114141606A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP20194675.3A EP3964323A1 (de) 2020-09-04 2020-09-04 Verfahren zum oberflächenstrukturieren eines substratkörpers und substratkörper
EP20194675.3 2020-09-04
EP21159715.8 2021-02-26
EP21159715 2021-02-26

Publications (1)

Publication Number Publication Date
CN114141606A true CN114141606A (zh) 2022-03-04

Family

ID=77640510

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111037013.2A Pending CN114141606A (zh) 2020-09-04 2021-09-06 衬底主体的表面结构化方法和衬底主体

Country Status (5)

Country Link
US (2) US12486197B2 (https=)
EP (1) EP3964324A1 (https=)
JP (2) JP2022044033A (https=)
KR (1) KR102823457B1 (https=)
CN (1) CN114141606A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210141570A (ko) 2019-03-21 2021-11-23 코닝 인코포레이티드 환형 볼텍스 레이저 빔을 사용하는 유리-기반 물체에 마이크로-홀을 형성하기 위한 시스템 및 방법
WO2021003018A1 (en) 2019-07-01 2021-01-07 Corning Incorporated Method of laser processing of transparent workpieces using curved quasi-non-diffracting laser beams
US12434331B2 (en) 2020-09-11 2025-10-07 Corning Incorporated Laser forming non-square edges in transparent workpieces using modified airy beams
US12006245B2 (en) * 2020-09-11 2024-06-11 Corning Incorporated Laser forming non-square edges in transparent workpieces using low intensity airy beams

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5919607A (en) * 1995-10-26 1999-07-06 Brown University Research Foundation Photo-encoded selective etching for glass based microtechnology applications
CN1978167A (zh) * 2002-07-30 2007-06-13 新浪潮研究公司 利用固态uv激光器对蓝宝石衬底划线的系统及方法
CN104043900A (zh) * 2013-03-15 2014-09-17 恩耐激光技术有限公司 通过线束改进的热处理
CN105209218A (zh) * 2013-01-15 2015-12-30 康宁激光技术有限公司 对平坦衬底进行基于激光的加工的方法和设备
JP2016011219A (ja) * 2014-06-27 2016-01-21 旭硝子株式会社 ガラス基板の切断方法
US20170203994A1 (en) * 2016-01-14 2017-07-20 Corning Incorporated Dual-airy-beam systems and methods for processing glass substrates
US20170348727A1 (en) * 2014-12-19 2017-12-07 Universität Ulm Method for producing a substrate structured by nanowires, produced substrate, and use of the substrate
US20190119150A1 (en) * 2017-10-20 2019-04-25 Corning Incorporated Methods for laser processing transparent workpieces using pulsed laser beam focal lines and chemical etching solutions
TW201923882A (zh) * 2017-10-31 2019-06-16 日商Ｖ科技股份有限公司 利用雷射剝離法之加工方法及平坦化治具
WO2019189225A1 (ja) * 2018-03-26 2019-10-03 Ａｇｃ株式会社 拡散素子、照明モジュールおよび非球面レンズの加工方法
US20190329251A1 (en) * 2018-04-27 2019-10-31 Schott Ag Method for producing fine structures in the volume of a substrate composed of hard brittle material

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JP2005219960A (ja) * 2004-02-05 2005-08-18 Nishiyama Stainless Chem Kk ガラスの切断分離方法、フラットパネルディスプレイ用ガラス基板、フラットパネルディスプレイ
US9757815B2 (en) * 2014-07-21 2017-09-12 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser curved filamentation within transparent materials
EP3854513B1 (de) 2014-11-19 2024-01-03 TRUMPF Laser- und Systemtechnik GmbH System zur asymmetrischen optischen strahlformung
DE102014116957A1 (de) 2014-11-19 2016-05-19 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung
JP2018070429A (ja) * 2016-11-02 2018-05-10 ウシオ電機株式会社 穴あき基板の製造方法、微細構造体の製造方法、およびレーザ改質装置
JP2020531392A (ja) * 2017-08-25 2020-11-05 コーニング インコーポレイテッド アフォーカルビーム調整アセンブリを用いて透明被加工物をレーザ加工するための装置及び方法
JP2019108255A (ja) * 2017-12-20 2019-07-04 株式会社Ｎｓｃ ガラス基板製造方法
JP6695318B2 (ja) * 2017-12-27 2020-05-20 Hoya株式会社 円盤状ガラス基板の製造方法、薄板ガラス基板の製造方法、導光板の製造方法及び円盤状ガラス基板
WO2021076432A1 (en) * 2019-10-14 2021-04-22 Corning Incorporated Foldable apparatus and methods of making
KR102728003B1 (ko) * 2019-11-14 2024-11-12 삼성디스플레이 주식회사 폴더블 유리 기판, 및 이를 포함하는 폴더블 표시 장치

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5919607A (en) * 1995-10-26 1999-07-06 Brown University Research Foundation Photo-encoded selective etching for glass based microtechnology applications
CN1978167A (zh) * 2002-07-30 2007-06-13 新浪潮研究公司 利用固态uv激光器对蓝宝石衬底划线的系统及方法
CN105209218A (zh) * 2013-01-15 2015-12-30 康宁激光技术有限公司 对平坦衬底进行基于激光的加工的方法和设备
CN104043900A (zh) * 2013-03-15 2014-09-17 恩耐激光技术有限公司 通过线束改进的热处理
JP2016011219A (ja) * 2014-06-27 2016-01-21 旭硝子株式会社 ガラス基板の切断方法
US20170348727A1 (en) * 2014-12-19 2017-12-07 Universität Ulm Method for producing a substrate structured by nanowires, produced substrate, and use of the substrate
US20170203994A1 (en) * 2016-01-14 2017-07-20 Corning Incorporated Dual-airy-beam systems and methods for processing glass substrates
US20190119150A1 (en) * 2017-10-20 2019-04-25 Corning Incorporated Methods for laser processing transparent workpieces using pulsed laser beam focal lines and chemical etching solutions
TW201923882A (zh) * 2017-10-31 2019-06-16 日商Ｖ科技股份有限公司 利用雷射剝離法之加工方法及平坦化治具
WO2019189225A1 (ja) * 2018-03-26 2019-10-03 Ａｇｃ株式会社 拡散素子、照明モジュールおよび非球面レンズの加工方法
US20190329251A1 (en) * 2018-04-27 2019-10-31 Schott Ag Method for producing fine structures in the volume of a substrate composed of hard brittle material

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US12486197B2 (en) 2025-12-02
US20220073427A1 (en) 2022-03-10
EP3964324A1 (de) 2022-03-09
JP2025124754A (ja) 2025-08-26
JP2022044033A (ja) 2022-03-16
KR102823457B1 (ko) 2025-06-19
KR20220031526A (ko) 2022-03-11
US20260055023A1 (en) 2026-02-26

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