KR102823457B1 - 기판 몸체를 표면 구조화하기 위한 방법 및 기판 몸체 - Google Patents

기판 몸체를 표면 구조화하기 위한 방법 및 기판 몸체 Download PDF

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KR102823457B1
KR102823457B1 KR1020210117522A KR20210117522A KR102823457B1 KR 102823457 B1 KR102823457 B1 KR 102823457B1 KR 1020210117522 A KR1020210117522 A KR 1020210117522A KR 20210117522 A KR20210117522 A KR 20210117522A KR 102823457 B1 KR102823457 B1 KR 102823457B1
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South Korea
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curved
substrate body
substrate
substrate material
extension
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Korean (ko)
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KR20220031526A (ko
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안드레아스 오르트너
다비드 소르
엔스 울리히 토마스
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쇼오트 아게
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Priority claimed from EP20194675.3A external-priority patent/EP3964323A1/de
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/62—Surface treatment of fibres or filaments made from glass, minerals or slags by application of electric or wave energy; by particle radiation or ion implantation
    • C03C25/6206—Electromagnetic waves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H10P14/6536—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to radiation, e.g. visible light
    • H10P14/6542—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to radiation, e.g. visible light by using coherent radiation, e.g. using a laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00595—Control etch selectivity
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/62—Surface treatment of fibres or filaments made from glass, minerals or slags by application of electric or wave energy; by particle radiation or ion implantation
    • C03C25/6206—Electromagnetic waves
    • C03C25/6208—Laser
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0025—Machining, e.g. grinding, polishing, diamond turning, manufacturing of mould parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/0143—Focussed beam, i.e. laser, ion or e-beam

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Geometry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Surface Treatment Of Glass (AREA)
  • Laser Beam Processing (AREA)
KR1020210117522A 2020-09-04 2021-09-03 기판 몸체를 표면 구조화하기 위한 방법 및 기판 몸체 Active KR102823457B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP20194675.3A EP3964323A1 (de) 2020-09-04 2020-09-04 Verfahren zum oberflächenstrukturieren eines substratkörpers und substratkörper
EP20194675.3 2020-09-04
EP21159715.8 2021-02-26
EP21159715 2021-02-26

Publications (2)

Publication Number Publication Date
KR20220031526A KR20220031526A (ko) 2022-03-11
KR102823457B1 true KR102823457B1 (ko) 2025-06-19

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KR1020210117522A Active KR102823457B1 (ko) 2020-09-04 2021-09-03 기판 몸체를 표면 구조화하기 위한 방법 및 기판 몸체

Country Status (5)

Country Link
US (2) US12486197B2 (https=)
EP (1) EP3964324A1 (https=)
JP (2) JP2022044033A (https=)
KR (1) KR102823457B1 (https=)
CN (1) CN114141606A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210141570A (ko) 2019-03-21 2021-11-23 코닝 인코포레이티드 환형 볼텍스 레이저 빔을 사용하는 유리-기반 물체에 마이크로-홀을 형성하기 위한 시스템 및 방법
WO2021003018A1 (en) 2019-07-01 2021-01-07 Corning Incorporated Method of laser processing of transparent workpieces using curved quasi-non-diffracting laser beams
US12434331B2 (en) 2020-09-11 2025-10-07 Corning Incorporated Laser forming non-square edges in transparent workpieces using modified airy beams
US12006245B2 (en) * 2020-09-11 2024-06-11 Corning Incorporated Laser forming non-square edges in transparent workpieces using low intensity airy beams

Citations (3)

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JP2016011219A (ja) 2014-06-27 2016-01-21 旭硝子株式会社 ガラス基板の切断方法
US20170203994A1 (en) * 2016-01-14 2017-07-20 Corning Incorporated Dual-airy-beam systems and methods for processing glass substrates
US20190119150A1 (en) * 2017-10-20 2019-04-25 Corning Incorporated Methods for laser processing transparent workpieces using pulsed laser beam focal lines and chemical etching solutions

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US5919607A (en) * 1995-10-26 1999-07-06 Brown University Research Foundation Photo-encoded selective etching for glass based microtechnology applications
CN1287442C (zh) * 2002-07-30 2006-11-29 新浪潮研究公司 利用固态uv激光器对蓝宝石衬底划线
JP2005219960A (ja) * 2004-02-05 2005-08-18 Nishiyama Stainless Chem Kk ガラスの切断分離方法、フラットパネルディスプレイ用ガラス基板、フラットパネルディスプレイ
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
US10226837B2 (en) * 2013-03-15 2019-03-12 Nlight, Inc. Thermal processing with line beams
US9757815B2 (en) * 2014-07-21 2017-09-12 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser curved filamentation within transparent materials
EP3854513B1 (de) 2014-11-19 2024-01-03 TRUMPF Laser- und Systemtechnik GmbH System zur asymmetrischen optischen strahlformung
DE102014116957A1 (de) 2014-11-19 2016-05-19 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung
DE102014226649A1 (de) * 2014-12-19 2016-06-23 Universität Ulm Verfahren zur Herstellung eines mit Nanodrähten strukturierten Substrats, hergestelltes Substrat und Verwendung des Substrats
JP2018070429A (ja) * 2016-11-02 2018-05-10 ウシオ電機株式会社 穴あき基板の製造方法、微細構造体の製造方法、およびレーザ改質装置
JP2020531392A (ja) * 2017-08-25 2020-11-05 コーニング インコーポレイテッド アフォーカルビーム調整アセンブリを用いて透明被加工物をレーザ加工するための装置及び方法
JP6938021B2 (ja) * 2017-10-31 2021-09-22 株式会社ブイ・テクノロジー レーザリフトオフによる加工方法及び平坦化治具
JP2019108255A (ja) * 2017-12-20 2019-07-04 株式会社Ｎｓｃ ガラス基板製造方法
JP6695318B2 (ja) * 2017-12-27 2020-05-20 Hoya株式会社 円盤状ガラス基板の製造方法、薄板ガラス基板の製造方法、導光板の製造方法及び円盤状ガラス基板
JP7259845B2 (ja) * 2018-03-26 2023-04-18 Ａｇｃ株式会社 拡散素子、照明モジュールおよび非球面レンズの加工方法
DE102018110211A1 (de) * 2018-04-27 2019-10-31 Schott Ag Verfahren zum Erzeugen feiner Strukturen im Volumen eines Substrates aus sprödharten Material
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JP2016011219A (ja) 2014-06-27 2016-01-21 旭硝子株式会社 ガラス基板の切断方法
US20170203994A1 (en) * 2016-01-14 2017-07-20 Corning Incorporated Dual-airy-beam systems and methods for processing glass substrates
US20190119150A1 (en) * 2017-10-20 2019-04-25 Corning Incorporated Methods for laser processing transparent workpieces using pulsed laser beam focal lines and chemical etching solutions

Also Published As

Publication number Publication date
US12486197B2 (en) 2025-12-02
CN114141606A (zh) 2022-03-04
US20220073427A1 (en) 2022-03-10
EP3964324A1 (de) 2022-03-09
JP2025124754A (ja) 2025-08-26
JP2022044033A (ja) 2022-03-16
KR20220031526A (ko) 2022-03-11
US20260055023A1 (en) 2026-02-26

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