JP2022029258A - Wafer processing method - Google Patents

Abstract

To adjust the position of a cutting blade by detecting the position of a cutting groove in a step cut.SOLUTION: A wafer processing method includes a groove formation step of forming a first groove (first cutting groove 61) having a first width along a scheduled split line of a wafer 10, and a cutting step of cutting the first groove with a blade (second cutting blade B2) thinner than the first width. In the groove formation step, unprocessed regions M1 and M2 are formed on the other end side by forming the first groove along a planned division line within a range from the outer peripheral edge on one end side G1 of the wafer to the outer peripheral edge on the other end side G2. The cutting step includes an adjustment step of cutting the unprocessed region from the other end side of the wafer with the blade along the first groove to the outer peripheral edge on one end side of the wafer, imaging the cutting groove (second cutting groove 62) formed by the blade in the unprocessed region to form a captured image, and adjusting the cutting position of the blade on the basis of the captured image.SELECTED DRAWING: Figure 7

Description

The present invention relates to a method for processing a wafer.

Conventionally, in the cutting process of a semiconductor wafer, for example, as disclosed in Patent Document 1, a semiconductor wafer is half-cut to form a half-cut groove, and then half-cut with a cutting blade having a thickness thinner than the width of the half-cut groove. The so-called step cut that fully cuts the groove is known.

The cutting position, which is the center of the cutting blade in the thickness direction, is designed to be a predetermined position in advance, but when a new cutting blade is installed by replacing the cutting blade, an installation error will occur. Yes, it is assumed that it will deviate from the specified position. In addition, it is assumed that the cutting blade deviates from the specified position due to the heat generated during machining.

Therefore, so-called hairline alignment is performed by performing a calf check at a predetermined timing in the cutting process of the wafer as a workpiece and adjusting the position of the cutting blade. Specifically, the cutting groove is imaged by an image pickup device (camera, microscope), and if there is a deviation between the position of the cutting groove and the reference position set in the image pickup device, the position of the cutting blade is adjusted. As a result, adjustment is made to match the position of the cutting groove with the reference position. As a result, in the next cutting process by the cutting blade, the cutting groove can be formed based on the specified position.

Japanese Unexamined Patent Publication No. 2012-146831

However, when the region of the already formed half-cut groove is cut by the cutting blade, the cutting groove formed by the cutting blade is formed in the half-cut groove, so that when the image is analyzed, the captured image is analyzed. It may be difficult to accurately detect the position of the cutting groove.

Furthermore, when a cutting blade is made to enter the half-cut groove to form a cutting groove, there is a concern that the cutting blade may come into contact with the groove wall of the half-cut groove and be cut to follow the half-cut groove. Will be done. In this case, it is considered that the position of the cutting groove is deviated from the actual position of the cutting blade, that is, the position of the cutting blade that has not entered the half-cut groove. Therefore, the exact position of the actual cutting blade cannot be detected, and as a result, the accurate position adjustment of the cutting blade cannot be performed.

In view of the above, the present invention presents a cutting blade by accurately detecting the position of a cutting groove in a wafer processing method in which a so-called step cut is performed in which a groove already formed is fully cut to form a cutting groove. It proposes a new technology that enables accurate position adjustment of the blade.

The problem to be solved by the present invention is as described above, and next, the means for solving this problem will be described.

According to one aspect of the invention
A groove forming step of forming a first groove of a first width along the planned division line of a wafer having a plurality of planned division lines, and a groove forming step.
A cutting step of cutting the first groove with a cutting blade having a thickness thinner than the first width.
It is a wafer processing method equipped with
In the groove forming step,
An unprocessed region is formed on the other end side by forming the first groove in a range not reaching the outer peripheral edge on the other end side from the outer peripheral edge on the one end side of the wafer along the planned division line.
In the cutting step
The cutting blade cuts the raw region from the other end side of the wafer and cuts along the first groove to the outer peripheral edge of the one end side of the wafer.
It is an adjustment step that is carried out at a predetermined timing.
In the cutting step, a cutting groove formed by the cutting blade is imaged in the raw area to form an image, and an adjustment step for adjusting the cutting position of the cutting blade based on the image is further performed. Prepared,
It is a wafer processing method.

Further, according to one aspect of the present invention.
In the adjustment step
The cutting groove is imaged with an image pickup device,
The position of the cutting groove in the width direction of the cutting groove appearing in the captured image is detected, and the position of the cutting groove is detected.
The cutting position of the cutting blade is adjusted so that the position of the cutting groove matches the reference position preset for the image pickup device.
It is a wafer processing method.

Further, according to one aspect of the present invention.
In the adjustment step
The captured image is formed so as to include the first groove in which the cutting groove is formed.
The position of the cutting groove in the width direction of the cutting groove appearing in the captured image is detected, and the position of the cutting groove is detected.
The cutting position of the cutting blade is adjusted so that the position of the cutting groove coincides with the position of the first groove.
It is a wafer processing method.

According to one embodiment of the present invention, an unprocessed region is formed in the groove forming step, and a second cutting groove is formed in this unprocessed region in the cutting step. It is possible to display the second cutting groove at a position that does not overlap with the groove of 1. As a result, when performing image analysis, it is possible to detect the second cutting groove with high accuracy, and it is possible to accurately detect the position of the second cutting groove. This enables more accurate position adjustment of the cutting blade.

Further, according to one embodiment of the present invention, the position of the cutting blade can be adjusted with reference to a reference position preset for the image pickup apparatus.

Further, according to one embodiment of the present invention, the position of the cutting blade can be adjusted with reference to the position of the first groove.

The perspective view which shows the structural example of the cutting apparatus provided with the cutting blade. (A) is a perspective view showing an example of a wafer to be a workpiece. (B) is a perspective view showing the configuration of a wafer unit. The figure which shows the state that a cutting process is performed while holding a wafer by a holding table. (A) is a figure which shows that the 1st cutting groove is formed by the 1st cutting blade. (B) is a figure showing that a full cut is performed by a second cutting blade and a second cutting groove is formed. (C) is a diagram showing a state in which a wafer is cut by a second cutting blade in an unprocessed region. The flowchart which shows each step of the wafer processing method. (A) is a diagram showing a groove forming step (first direction). (B) is a diagram showing a groove forming step (second direction). (A) is a diagram showing a cutting step (first direction). (B) is a diagram showing a cutting step (second direction). (A) is a diagram showing a captured image and a reference line. (B) is a diagram showing a second cutting groove on a captured image. (C) is a diagram for explaining the amount of deviation between the second cutting groove and the reference position. The figure which shows the other adjustment method of the 2nd cutting blade.

In the following description, a half-cutting step is performed using a cutting device 2 provided with the first cutting blade shown in FIG. 1 and a cutting device equivalent to FIG. 1 but not shown with the second cutting blade. An example of step cutting in which the full cutting process is performed in order by each cutting device will be described.

In this way, in addition to performing step cutting including a half-cut process and a full-cut process using two cutting devices, half-cutting is performed by a dual dicer equipped with two cutting units (cutting blades) in one cutting device. It is also possible to carry out a step cut in which the process and the full cut process are performed in order.

In addition, step cutting may be performed using one laser processing device and one cutting device. That is, after performing a half-cut process by ablation processing (grooving) by a laser processing device, a full-cut process is performed by a cutting device. The laser processing apparatus can be configured to include a laser oscillator that generates a laser beam and a concentrator that condenses the laser beam on the wafer.

The configuration of the cutting device 2 shown in FIG. 1 will be described.
A holding table 18 is arranged on the base 4 of the cutting device 2 so as to be reciprocating in the X-axis direction by a moving mechanism (not shown). A water cover 14 is arranged around the holding table 18, and the bellows 16 is connected to the water cover 14 and the base 4.

At the front corner of the base 4, a cassette mounting table 21 for mounting a cassette 20 for accommodating a work piece is provided.

A gate-shaped column 24 is erected on the base 4, and a pair of guide rails 26 extending in the Y-axis direction are fixed to the column 24. A Y-axis moving block 28 is mounted on the column 24 so as to be guided by a guide rail 26 by a Y-axis moving mechanism 34 including a ball screw 30 and a pulse motor 32 so as to be movable in the Y-axis direction.

A pair of guide rails 36 extending in the Z-axis direction are fixed to the Y-axis moving block 28. On the Y-axis moving block 28, the Z-axis moving block 38 is guided by a guide rail 36 by a Z-axis moving mechanism 44 including a ball screw 40 and a pulse motor 42, and is mounted so as to be movable in the Z-axis direction.

A cutting unit 46 and an image pickup device 52 (camera) are attached to the Z-axis moving block 38. The cutting unit 46 is configured by detachably mounting a first cutting blade B1 on the tip of a spindle 48 (FIG. 3) that is rotationally driven by a motor (not shown).

A spinner cleaning unit 54 having a spinner table 56 is provided on the base 4, and the workpiece after cutting is sucked and held by the spinner table 56 to perform spinner cleaning and spin drying. There is.

The cutting device 2 is provided with a display monitor 60 that displays the operating status of the device and enables operation input by the operator. The display monitor 60 can display an image captured by the image pickup device 52.

FIG. 2A shows an example of a wafer 10 to be a workpiece.
The wafer 10 is divided into chips by arranging the devices 11 in a grid pattern on the surface 10a of the semiconductor substrate and cutting the wafer 10 along the scheduled division line 13 (street). The planned division line 13 extends in the first direction D1 and the second direction D2 orthogonal to the first direction D1, and the distance between the planned division lines 13 extending in each direction D1 and D2 is the index width. Will be done.

FIG. 2B shows a wafer unit U in which the back surface 10b side of the wafer 10 is attached to the tape T and the annular frame F and the wafer 10 are integrated via the tape T. A plurality of the wafer units U are housed in the cassette 20 shown in FIG. 1, and are sequentially conveyed to the holding table 18 to process the wafer 10.

FIG. 3 is a diagram showing a state in which the wafer 10 is held by the holding table 18 and cutting is performed.
The annular frame F of the wafer unit U is clamped by the clamp 18a, and the wafer 10 is suction-held on the holding table 18.

As shown in FIG. 3, the first cutting blade B1 of the cutting unit 46 is positioned and rotated at a predetermined position in the Z-axis direction in the height direction, and the holding table 18 is machined and fed in the direction of arrow K. Then, the cutting process of the wafer 10 is carried out.

As shown in FIG. 4A, the first cutting blade B1 forms a first cutting groove 61 (first groove) having a predetermined depth without completely cutting the wafer 10. be. The first cutting groove 61 is a so-called half-cut groove in which a remaining portion is formed at the bottom of the groove.

As shown in FIG. 4A, the width 61w of the first cutting groove 61 is configured to have a width corresponding to the blade thickness W1 of the first cutting blade B1.

FIG. 4B is a diagram showing that a full cut is performed by the second cutting blade B2 and a second cutting groove 62 is formed in the cutting step described later. The second cutting blade B2 cuts the wafer 10 completely by cutting until it reaches the tape T.

As shown in FIG. 4B, the blade thickness W2 of the second cutting blade B2 is configured to be narrower than the blade thickness W1 of the first cutting blade B1. Corresponding to the blade thickness W2, the width 62w of the second cutting groove 62 is configured to be narrower than the width 61w of the first cutting groove 61.

FIG. 4C is a diagram showing how the wafer 10 is cut by the second cutting blade B2 in the raw regions M1 and M2 (FIGS. 7A and 7B) described later. The first cutting groove 61 (FIG. 4A) does not exist in the unprocessed regions M1 and M2, and cutting is performed only by the second cutting blade B2.

Next, each step of the wafer processing method according to the present invention will be described in order. Each step is performed in the order of the flowchart shown in FIG. 5, and the control of various drive units for carrying out each step is performed by the controller 100 provided in the first and second cutting devices 2 and 2A. ..

<Groove formation step S1>
As shown in FIGS. 6A and 6B, it is a step of forming a first cutting groove 61 having a first width along the planned division line of a wafer having a plurality of scheduled division lines 13. It is carried out by the cutting device 2 (FIG. 1) of 1.

First, as shown in FIG. 6A, the index feed in the Y-axis direction of the first cutting blade B1 and the machining feed in the X-axis direction of the wafer 10 are alternately repeated to obtain the first direction of the wafer 10. A first cutting groove 61 (half-cut groove) is formed for all scheduled division lines 13 extending to D1. Note that, in FIGS. 6A and 6B, the device 11 appearing on the surface of the wafer 10 (FIG. 2A is not shown) is omitted.

Here, as shown in FIG. 6A, the first cutting groove 61 extending in the first direction D1 is from the outer peripheral edge of the one end side G1 of the first direction D1 of the wafer 10 to the outside of the other end side G2. It is formed in a range that does not reach the peripheral edge, whereby the raw region M1 is formed on the other end side G2.

The range in which the raw region M1 is formed is not particularly limited, but for example, the raw region M1 can be formed in a region other than the region in which the device 11 (FIG. 2A) is formed. ..

In FIG. 6A, the position of the notch N of the wafer 10, the first direction D1, and the second direction D2 orthogonal to the first direction D1 are represented.

Next, by rotating the holding table 18 (FIG. 1) 90 degrees clockwise from the state shown in FIG. 6 (A), the wafer 10 is rotated 90 degrees clockwise, and then as shown in FIG. 6 (B). In addition, for all scheduled division lines 13 extending in the second direction D2 of the wafer 10 by alternately repeating the index feed in the Y-axis direction of the first cutting blade B1 and the machining feed in the X-axis direction of the wafer 10. , The first cutting groove 61 (half-cut groove) is formed.

Here, as shown in FIG. 6B, the first cutting groove 61 extending in the second direction D2 is from the outer peripheral edge of the one end side G1 of the second direction D2 of the wafer 10 to the outside of the other end side G2. It is formed in a range that does not reach the peripheral edge, whereby the raw region M2 is formed on the other end side G2.

The range in which the raw region M2 is formed is not particularly limited, but for example, the raw region M2 can be formed in a region other than the region where the device 11 (FIG. 2A) is formed. ..

<Rotation step S2>
As shown in FIG. 7 (A), the wafer 10 is set in the second cutting device in a state of being rotated by 180 degrees with respect to the angle in the groove forming step S1 shown in FIG. 6 (A). The other end side G2 of the wafer 10 is arranged so as to be close to the cutting blade B2 of the above. The rotation of the wafer 10 can be carried out in either the first cutting device or the second cutting device, or may be carried out in the transfer process from the first cutting device to the second cutting device. .. When the groove forming step S1 shown in FIG. 6A is carried out by a laser processing apparatus, the unprocessed region M1 is formed on one end side G1 so that the groove forming step S1 is 180 when set in the second cutting apparatus. It is not necessary to rotate the degree.

<Cutting step S3>
As shown in FIG. 7A, the second cutting blade B2 cuts the raw region M1 from the other end side G2 of the wafer 10, and the one end side G1 of the wafer 10 is cut along the first cutting groove 61. It is a step of cutting up to the outer peripheral edge, and is carried out by the second cutting device 2A (FIG. 1).

In this embodiment, after the groove forming step S1 is performed on the wafer in the cutting device 2 shown in FIG. 1, the wafer is washed by the spinner cleaning unit 54, the wafer is carried out, and the wafer is transferred to another second cutting device. do. In the second cutting device, as shown in FIG. 4B, the second cutting groove 62 is formed by performing a full cut by the second cutting blade B2.

As shown in FIG. 7A, the index feed in the Y-axis direction of the second cutting blade B2 and the machining feed in the X-axis direction of the wafer 10 are alternately repeated in the first direction D1 of the wafer 10. A second cutting groove 62 (full cut groove) is formed along the extending first cutting groove 61. Note that, in FIGS. 7A and 7B, the device 11 appearing on the surface of the wafer 10 (FIG. 2A is not shown) is omitted.

Here, as shown in FIG. 7A, the second cutting blade B2 is cut from the raw region M1 side, and only the second cutting groove 62 is formed in the raw region M1. Will be.

Next, by rotating the holding table 18 (FIG. 1) 90 degrees clockwise from the state shown in FIG. 7 (A), the wafer 10 is rotated 90 degrees clockwise, and then as shown in FIG. 7 (B). In addition, by alternately repeating the index feed in the Y-axis direction of the second cutting blade B2 and the machining feed in the X-axis direction of the wafer 10, the first cutting groove 61 extending in the second direction D2 of the wafer 10 is formed. A second cutting groove 62 (full cut groove) is formed along the line.

As shown in FIG. 7B, also in the second direction D2 of the wafer 10, the second cutting blade B2 cuts from the raw region M2 side, and in the raw region M2, the second cutting blade B2 is cut. Only the cutting groove 62 will be formed.

As described above, the second cutting groove 62 (full cut groove) along the planned division line 13 (FIG. 2A) is formed in the first and second directions D1 and D2 of the wafer 10. After that, the tape T (FIG. 2B) can be expanded into chips by another dividing device.

<Adjustment step S4>
In the process of carrying out the above cutting step S3, the adjustment step S4 is carried out at a predetermined timing.
In the adjustment step S4, for example, as shown in FIG. 7A, a second cutting groove 62 already formed in the raw region M1 is imaged and a calf check is performed, and as shown in FIG. 8C. , When there is a deviation between the second cutting groove 62 (position 62a of the center line 62c) and the reference position 92, the position of the second cutting blade B2 is adjusted by the deviation amount Δ. The reference position coincides with the actually formed second cutting groove 62.

More specifically, as shown in FIGS. 1 and 7A, the controller 100 of the second cutting device 2A has the holding table 18 and the image pickup based on the operation of the display monitor 60 (FIG. 1) by the operator. The device 52 is moved to position the image pickup device 52 above the location of the second cutting groove 62 most recently formed in the raw region M1.

As shown in FIG. 8 (A), the image pickup device 52 (FIG. 1) is preset with a reference position 92 for defining the position of the image pickup device 52 in the Y-axis direction, and is set in FIG. 8 (A). ), The reference line 92a is displayed at the position corresponding to the reference position 92. The reference line 92a is displayed by being superimposed on the captured image 90 by software, and is represented by a alternate long and short dash line in the example of FIG. 8A. The captured image 90 can be displayed on the display monitor 60 (FIG. 1), and the operator can visually recognize the reference line 92a.

Then, as shown in FIG. 8B, when an image is taken by the image pickup apparatus 52 (FIG. 1), a second cutting groove 62 formed in the raw region M1 appears in the image pickup image 90. In this embodiment, since the image pickup apparatus 52 (FIG. 1) is composed of an optical camera, light is absorbed in the portion of the second cutting groove 62, and the captured image 90 shows the location of the second cutting groove 62. Is displayed in gray.

Next, as shown in FIG. 8C, the controller 100 analyzes and detects the second cutting groove 62 from the gray area of the captured image 90, and detects the width of the detected second cutting groove 62. A center line 62c extending to the center of the direction (Y-axis direction) is defined, and the position of the center line 62c is defined as the position 62a of the second cutting groove 62.

Next, as shown in FIG. 8C, when the position 62a of the second cutting groove 62 deviates from the reference position 92, the controller 100 calculates the deviation amount Δ and the second cutting. The position of the second cutting blade B2 in the Y-axis direction is adjusted by the amount corresponding to the deviation amount Δ in the direction in which the position 62a of the groove 62 coincides with the reference position 92, and the adjusted position is stored in the memory. The controller 100 controls the position of the second cutting blade B2 in the Y-axis direction based on the adjusted position information.

By adjusting the position of the second cutting blade B2 as described above, it becomes possible to form the second cutting groove 62 to be formed next after the adjustment step S4 at a predetermined position. ..

Here, as shown in FIG. 8C, in the captured image 90, the second cutting groove 62 at a position that does not overlap with the first cutting groove 61 can be acquired, and the controller 100 performs image analysis. In this case, the second cutting groove 62 can be detected with high accuracy. Then, the center line 62c extending to the center of the detected second cutting groove 62 in the width direction (Y-axis direction) can be accurately detected. This enables more accurate position adjustment of the second cutting blade B2.

In the above description, the second cutting groove 62 that has already been formed is imaged to perform a calf check, and the second cutting blade B2 is adjusted. However, the unprocessed area is used only for the calf check. The second cutting blade B2 may be cut into M1 to form the second cutting groove 62.

Further, in the above description, in the state of FIG. 7A, the second cutting groove 62 extending in the first direction D1 of the raw region M1 is imaged to perform a calf check, and the second cutting blade B2 An example of adjusting the position in the Y-axis direction has been described, but in the state of FIG. 7B, a calf check is performed by imaging a second cutting groove 62 extending in the second direction D2 of the raw region M2. The same procedure can be used to adjust the position of the second cutting blade B2 in the Y-axis direction.

Next, another adjusting method of the second cutting blade B2 will be described.
The captured image 95 shown in FIG. 9 captures a second cutting groove 62 (full cut groove) in the unprocessed region M1 and a first cutting groove 61 (half cut groove) located outside the unprocessed region M1. It is an image that was made. Based on this captured image 95, the position of the second cutting blade B2 in the Y-axis direction may be adjusted to match the position of the first cutting blade B1 in the Y-axis direction.

According to this, the first cutting groove 61 (half-cut groove) and the second cutting groove 62 (full-cut groove) can be completely matched, and the second cutting groove 62 is formed at a specified position. can do. As a premise, it is necessary that the first cutting groove 61 (half-cut groove) is formed at a specified position, and the calf check of the first cutting groove 61 (half-cut groove) and the position in the Y-axis direction. The adjustment is made in advance, and the specific method thereof is not particularly limited.

In the example of using the captured image 95 of FIG. 9, the controller 100 analyzes and detects the second cutting groove 62 from the gray area of the captured image 95, and the width of the detected second cutting groove 62. A center line 62c extending to the center of the direction (Y-axis direction) is defined, and the position of the center line 62c is defined as the position 62a of the second cutting groove 62.

Further, the controller 100 detects the first cutting groove 61 from the lower light gray area of the captured image 95, and extends to the center of the detected first cutting groove 61 in the width direction (Y-axis direction). The center line 61c is defined, and the position of the center line 61c is defined as the position 61a of the first cutting groove 61.

As shown in FIG. 9, when the position 62a of the second cutting groove 62 deviates from the position 61a of the first cutting groove 61, the controller 100 calculates the deviation amount Δ and the second cutting groove 61. Adjust the position of the second cutting blade B2 in the Y-axis direction by the amount corresponding to the deviation amount Δ in the direction in which the position 62a of the cutting groove 62 coincides with the position 61a of the first cutting groove 61, and the adjusted position. Is stored in the memory. The controller 100 controls the position of the second cutting blade B2 in the Y-axis direction based on the adjusted position information.

As described above, the position 62a of the second cutting groove 62 may be adjusted by so-called hairline alignment that matches the second cutting groove 62 with the first cutting groove 61.

Even in this case, the second cutting groove 62 located at a position that does not overlap with the first cutting groove 61 is imaged, so that the second cutting groove 62 can be used with high accuracy when the controller 100 performs image analysis. It becomes possible to detect. Then, the center line 62c extending to the center of the detected second cutting groove 62 in the width direction (Y-axis direction) can be accurately detected.

The present invention can be realized as described above.
That is, as shown in FIGS. 1 to 8.
A groove forming step S1 for forming a first groove (first cutting groove 61) having a first width of 61w along the scheduled division line 13 of the wafer 10 having a plurality of scheduled division lines 13.
The cutting step S3 for cutting the first groove (first cutting groove 61) with a blade (second cutting blade B2) having a thickness thinner than the first width 61w.
It is a processing method of the wafer 10 provided with the above.
In the groove forming step S1,
The other end side G2 is formed by forming a first groove (first cutting groove 61) in a range not reaching the outer peripheral edge of the other end side G2 from the outer peripheral edge of the one end side G1 of the wafer 10 along the planned division line 13. The raw regions M1 and M2 are formed in
In cutting step S3
The cutting blade (second cutting blade B2) cuts the raw regions M1 and M2 from the other end side G2 of the wafer 10, and one end side of the wafer 10 along the first groove (first cutting groove 61). Cut to the outer peripheral edge of G1
Adjustment step S4 performed at a predetermined timing.
In the cutting step S3, the cutting groove (second cutting groove 62) formed by the cutting blade is imaged in the raw areas M1 and M2 to form the captured image 90, and the cutting blade (second cutting groove) is formed based on the captured image 90. The adjustment step S4 for adjusting the cutting position of the cutting blade B2) is further provided.
This is a method for processing the wafer 10.

According to this processing method, the unprocessed regions M1 and M2 are formed in the groove forming step S1, and the second cutting groove 62 is formed in the unprocessed regions M1 and M2 in the cutting step S3. In the captured image 90, the second cutting groove 62 at a position that does not overlap with the first cutting groove 61 can be displayed. As a result, when performing image analysis, the second cutting groove 62 can be detected with high accuracy, and the position of the second cutting groove 62 can be accurately detected. This enables more accurate position adjustment of the second cutting blade B2.

Further, as shown in FIGS. 8A to 8C,
In the adjustment step S4,
The cutting groove (second cutting groove 62) is imaged by the image pickup device 52 (FIG. 1), and the cutting groove (second cutting groove 62) is imaged.
The position of the cutting groove (position 62a of the center line 62c) in the width direction of the cutting groove (second cutting groove 62) appearing in the captured image 90 is detected.
Adjust the cutting position of the cutting blade (second cutting blade B2) so that the position of the cutting groove (position 62a of the center line 62c) matches the reference position 92 preset for the image pickup device 52 (FIG. 1). It is supposed to be done.

According to this, the position of the cutting blade (second cutting blade B2) can be adjusted with reference to the reference position 92 preset with respect to the image pickup apparatus 52 (FIG. 1).

Also, as shown in FIG.
In the adjustment step S4,
It is assumed that the captured image 95 is formed so as to include the first groove (first cutting groove 61) in which the cutting groove (second cutting groove 62) is formed.
The position of the cutting groove (position 62a of the center line 62c) in the width direction of the cutting groove appearing in the captured image 95 is detected.
The cutting position of the cutting blade (second cutting blade B2) is adjusted so that the position of the cutting groove coincides with the position of the first groove (first cutting groove 61) (position 61a of the center line 61c). It is supposed to be.

According to this, the position of the cutting blade (second cutting blade B2) can be adjusted with reference to the position of the first groove (first cutting groove 61).

2 Cutting device 2A Cutting device 10 Wafer 10a Front surface 10b Back surface 11 Device 13 Scheduled division line 18 Holding table 46 Cutting unit 52 Imaging device 60 Display monitor 61 First cutting groove 61a Position 61c Center line 61w Width 62 Second cutting groove 62a Position 62c Center line 62w Width 90 Captured image 92 Reference position 92a Reference line 95 Captured image B1 First cutting blade B2 Second cutting blade G1 One end side G2 One end side M1 Raw area M2 Raw area W1 Blade thickness W2 Blade Thickness Δ Deviation amount S1 Groove formation step S2 Rotation step S3 Cutting step S4 Adjustment step

Claims (3)

A groove forming step of forming a first groove of a first width along the planned division line of a wafer having a plurality of planned division lines, and a groove forming step.
A cutting step of cutting the first groove with a cutting blade having a thickness thinner than the first width.
It is a wafer processing method equipped with
In the groove forming step,
An unprocessed region is formed on the other end side by forming the first groove in a range not reaching the outer peripheral edge on the other end side from the outer peripheral edge on the one end side of the wafer along the planned division line.
In the cutting step
The cutting blade cuts the raw region from the other end side of the wafer and cuts along the first groove to the outer peripheral edge of the one end side of the wafer.
It is an adjustment step that is carried out at a predetermined timing.
In the cutting step, a cutting groove formed by the cutting blade is imaged in the raw area to form an image, and an adjustment step for adjusting the cutting position of the cutting blade based on the image is further performed. Prepared,
Wafer processing method. In the adjustment step
The cutting groove is imaged with an image pickup device,
The position of the cutting groove in the width direction of the cutting groove appearing in the captured image is detected, and the position of the cutting groove is detected.
The cutting position of the cutting blade is adjusted so that the position of the cutting groove matches the reference position preset for the image pickup device.
The wafer processing method according to claim 1, wherein the wafer is processed. In the adjustment step
The captured image is formed so as to include the first groove in which the cutting groove is formed.
The position of the cutting groove in the width direction of the cutting groove appearing in the captured image is detected, and the position of the cutting groove is detected.
The cutting position of the cutting blade is adjusted so that the position of the cutting groove coincides with the position of the first groove.
The wafer processing method according to claim 1, wherein the wafer is processed.

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