JP2022020088A - 冷却装置、半導体製造装置および半導体製造方法 - Google Patents
冷却装置、半導体製造装置および半導体製造方法 Download PDFInfo
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- 239000003507 refrigerant Substances 0.000 claims abstract description 117
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- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
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- F25B2400/04—Refrigeration circuit bypassing means
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Abstract
Description
前記凝縮器の中に配置された熱交換器を含む冷却系と、を備え、前記凝縮器は、前記冷媒が液体状態で存在する第1部分と、前記冷媒が気体状態で存在する第2部分とを有し、前記熱交換器の少なくとも一部は、前記第2部分に配置されている。
ここで、dTは温度変化、Tは状態温度、ΔVは蒸発に伴う体積変化、dPは圧力変化、Lは潜熱を示す。
Claims (18)
- 凝縮器の中の冷媒をポンプ、加熱器、絞り弁、気化器を介して前記凝縮器に戻すように前記冷媒を循環させる循環系と、
前記凝縮器の中に配置された熱交換器を含む冷却系と、を備え、
前記凝縮器は、前記冷媒が液体状態で存在する第1部分と、前記冷媒が気体状態で存在する第2部分とを有し、前記熱交換器の少なくとも一部は、前記第2部分に配置されている、
ことを特徴とする冷却装置。 - 前記冷却系は、前記第2部分の圧力または温度を所定値に維持する、
ことを特徴とする請求項1に記載の冷却装置。 - 前記凝縮器の中に、前記冷媒より沸点が低い気体が封入されている、
ことを特徴とする請求項1又は2に記載の冷却装置。 - 前記冷却系は、前記熱交換器を通して第2冷媒を循環させる第2循環系を含む、
ことを特徴とする請求項1乃至3のいずれか1項に記載の冷却装置。 - 前記第2部分の圧力または温度を検出するセンサと、
前記センサの出力に基づいて前記第2冷媒を制御する制御部と、を更に備える、
ことを特徴とする請求項4に記載の冷却装置。 - 前記第2循環系は、第2ポンプと、第2加熱器と、流量調整弁と、排熱器と、タンクとを更に含み、
前記タンクから前記第2ポンプおよび前記第2加熱器を介して前記熱交換器に前記第2冷媒が送られ、前記熱交換器から前記排熱器を介して前記タンクに前記第2冷媒が戻される、
ことを特徴とする請求項5に記載の冷却装置。 - 前記制御部は、前記センサの出力に基づいて前記第2冷媒の温度、流量および圧力の少なくとも一方を制御する、
ことを特徴とする請求項6に記載の冷却装置。 - 前記制御部は、前記センサの出力に基づいて前記第2ポンプおよび前記流量調整弁の少なくとも一方を制御する、
ことを特徴とする請求項6に記載の冷却装置。 - 前記第2循環系は、圧縮機と、第2凝縮器と、膨張弁とを更に含み、
前記圧縮機から前記第2凝縮器および前記膨張弁を介して前記熱交換器に前記第2冷媒が送られ、前記熱交換器から前記圧縮機に前記第2冷媒が戻される、
ことを特徴とする請求項5に記載の冷却装置。 - 前記制御部は、前記熱交換器における前記第2冷媒の気化潜熱を制御する、
ことを特徴とする請求項9に記載の冷却装置。 - 前記制御部は、前記センサの出力に基づいて前記第2冷媒の温度、流量および圧力の少なくとも1つを制御する、
ことを特徴とする請求項9又は10に記載の冷却装置。 - 前記制御部は、前記センサの出力に基づいて前記圧縮機および前記膨張弁の少なくとも一方を制御する、
ことを特徴とする請求項9又は10に記載の冷却装置。 - 前記第2循環系は、前記圧縮機から第2凝縮器および前記膨張弁を介して前記熱交換器に至る主経路をバイパスするバイパス経路を更に含み、
前記バイパス経路に調整弁が設けられている、
ことを特徴とする請求項9乃至11のいずれか1項に記載の冷却装置。 - 前記制御部は、前記センサの出力に基づいて前記圧縮機、前記膨張弁および前記調整弁の少なくとも一方を制御する、
ことを特徴とする請求項13に記載の冷却装置。 - 前記加熱器は、第2熱交換器を含み、
前記圧縮機と前記第2凝縮器との間の経路から分岐され、前記第2熱交換器を介して前記圧縮機に戻る第3循環経路が構成され、
前記第3循環経路に第2調整弁が設けられている、
ことを特徴とする請求項13又は14に記載の冷却装置。 - 発熱部を有する半導体製造装置であって、
請求項1乃至15のいずれか1項に記載の冷却装置を備え、
前記冷却装置は、前記発熱部からの熱によって前記気化器の中の前記冷媒を気化させることによって前記発熱部を冷却するように構成されている、
ことを特徴とする半導体製造装置。 - パターンを形成するパターン形成装置として構成されている、
ことを特徴とする請求項16に記載の半導体製造装置。 - 請求項16又は17に記載の半導体製造装置によって基板を処理する工程と、
前記工程で処理された基板を加工する工程と、
を含むことを特徴とする半導体製造方法。
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