JP2022013081A5 - - Google Patents

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Publication number
JP2022013081A5
JP2022013081A5 JP2020115388A JP2020115388A JP2022013081A5 JP 2022013081 A5 JP2022013081 A5 JP 2022013081A5 JP 2020115388 A JP2020115388 A JP 2020115388A JP 2020115388 A JP2020115388 A JP 2020115388A JP 2022013081 A5 JP2022013081 A5 JP 2022013081A5
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JP
Japan
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members
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upper side
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JP2020115388A
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English (en)
Japanese (ja)
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JP7419994B2 (ja
JP2022013081A (ja
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Priority to JP2020115388A priority Critical patent/JP7419994B2/ja
Priority claimed from JP2020115388A external-priority patent/JP7419994B2/ja
Priority to PCT/JP2021/022971 priority patent/WO2022004400A1/ja
Priority to US18/013,950 priority patent/US12484201B2/en
Priority to CN202180042507.1A priority patent/CN115715489A/zh
Publication of JP2022013081A publication Critical patent/JP2022013081A/ja
Publication of JP2022013081A5 publication Critical patent/JP2022013081A5/ja
Application granted granted Critical
Publication of JP7419994B2 publication Critical patent/JP7419994B2/ja
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JP2020115388A 2020-07-03 2020-07-03 電気機器 Active JP7419994B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020115388A JP7419994B2 (ja) 2020-07-03 2020-07-03 電気機器
PCT/JP2021/022971 WO2022004400A1 (ja) 2020-07-03 2021-06-17 電気機器
US18/013,950 US12484201B2 (en) 2020-07-03 2021-06-17 Electric device with immersed electronic components and elongated busbar forming an upward flow
CN202180042507.1A CN115715489A (zh) 2020-07-03 2021-06-17 电气设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020115388A JP7419994B2 (ja) 2020-07-03 2020-07-03 電気機器

Publications (3)

Publication Number Publication Date
JP2022013081A JP2022013081A (ja) 2022-01-18
JP2022013081A5 true JP2022013081A5 (enExample) 2022-12-16
JP7419994B2 JP7419994B2 (ja) 2024-01-23

Family

ID=79316091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020115388A Active JP7419994B2 (ja) 2020-07-03 2020-07-03 電気機器

Country Status (4)

Country Link
US (1) US12484201B2 (enExample)
JP (1) JP7419994B2 (enExample)
CN (1) CN115715489A (enExample)
WO (1) WO2022004400A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12402272B2 (en) * 2021-01-12 2025-08-26 Cooler Master Co., Ltd. Single-phase immersion cooling system and method of the same
DE102021130926B4 (de) * 2021-11-25 2025-08-14 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Flüssigkeitsgekühlte Leistungselektronikeinheit
JP7715062B2 (ja) * 2022-03-14 2025-07-30 株式会社豊田自動織機 電気機器
EP4468337B1 (en) * 2023-05-26 2025-10-29 Hitachi Energy Ltd Semiconductor power module, semiconductor power package and method for manufacturing a semiconductor power module

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60249351A (ja) * 1984-05-24 1985-12-10 Fujitsu Ltd 沸騰冷却型回路基板と冷媒液中での配置構造
JPS6285449A (ja) * 1985-10-09 1987-04-18 Fujitsu Ltd 半導体装置の冷却構造
JPH0727997B2 (ja) * 1986-06-12 1995-03-29 富士通株式会社 冷媒クリ−ニング装置
JPH0745761A (ja) * 1993-07-30 1995-02-14 Takeo Yoshino 液冷式ハイブリッドｉｃ
MY115676A (en) * 1996-08-06 2003-08-30 Advantest Corp Printed circuit board with electronic devices mounted thereon
JP3855382B2 (ja) * 1997-08-06 2006-12-06 株式会社デンソー 冷凍サイクル装置
JP2005317798A (ja) * 2004-04-28 2005-11-10 Toshiba Corp 電子機器
US7393236B2 (en) * 2005-09-02 2008-07-01 Gm Global Technology Operations, Inc. Integrated thermal and electrical connection system for power devices
CN201243015Y (zh) * 2008-03-04 2009-05-20 无锡爱迪信光电科技有限公司 大功率发光二极管的液体散热装置
CN101588707A (zh) * 2008-05-19 2009-11-25 华为技术有限公司 一种散热装置及应用其的电子设备
JP5109812B2 (ja) * 2008-05-30 2012-12-26 住友電装株式会社 電気接続箱
US8369090B2 (en) * 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
KR20150111753A (ko) * 2014-03-26 2015-10-06 박일권 발광다이오드 조명장치
EP3317708A2 (en) * 2015-06-30 2018-05-09 CommScope Connectivity Belgium BVBA System for compensation of expansion/contraction of a cooling medium inside a sealed closure
JP6642088B2 (ja) 2016-02-18 2020-02-05 株式会社オートネットワーク技術研究所 電気機器
US10347608B2 (en) * 2016-05-27 2019-07-09 General Electric Company Power module
JP2019029539A (ja) * 2017-07-31 2019-02-21 株式会社ケーヒン・サーマル・テクノロジー 半導体冷却装置
CN108563305B (zh) * 2018-01-29 2023-12-19 广东西江数据科技有限公司 一种喷淋式液冷服务器
JP2019140247A (ja) * 2018-02-09 2019-08-22 日本電気株式会社 冷却装置及び電子機器
JP7011221B2 (ja) * 2018-03-28 2022-01-26 日本電気株式会社 実装基板、電子機器及び素子冷却方法
JP2019220527A (ja) * 2018-06-18 2019-12-26 富士通株式会社 液浸冷却用熱交換器
JP2020088090A (ja) 2018-11-21 2020-06-04 アイシン・エィ・ダブリュ株式会社 電力変換装置用冷却装置
CN110536586B (zh) * 2019-06-13 2024-01-30 刘一航 一种浸没式冷却装置

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