JP2022008223A5 - - Google Patents

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Publication number
JP2022008223A5
JP2022008223A5 JP2021103984A JP2021103984A JP2022008223A5 JP 2022008223 A5 JP2022008223 A5 JP 2022008223A5 JP 2021103984 A JP2021103984 A JP 2021103984A JP 2021103984 A JP2021103984 A JP 2021103984A JP 2022008223 A5 JP2022008223 A5 JP 2022008223A5
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JP
Japan
Prior art keywords
fluid
substrate holder
cavities
cavity
showerhead
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JP2021103984A
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English (en)
Japanese (ja)
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JP2022008223A (ja
JP7723918B2 (ja
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Publication of JP2022008223A5 publication Critical patent/JP2022008223A5/ja
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Publication of JP7723918B2 publication Critical patent/JP7723918B2/ja
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JP2021103984A 2020-06-24 2021-06-23 処理ツール用シャワーヘッド Active JP7723918B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202063043394P 2020-06-24 2020-06-24
US63/043394 2020-06-24

Publications (3)

Publication Number Publication Date
JP2022008223A JP2022008223A (ja) 2022-01-13
JP2022008223A5 true JP2022008223A5 (cg-RX-API-DMAC7.html) 2024-06-18
JP7723918B2 JP7723918B2 (ja) 2025-08-15

Family

ID=79031493

Family Applications (1)

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JP2021103984A Active JP7723918B2 (ja) 2020-06-24 2021-06-23 処理ツール用シャワーヘッド

Country Status (3)

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US (2) US12180589B2 (cg-RX-API-DMAC7.html)
JP (1) JP7723918B2 (cg-RX-API-DMAC7.html)
KR (1) KR20210158823A (cg-RX-API-DMAC7.html)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102695104B1 (ko) 2019-08-16 2024-08-14 램 리써치 코포레이션 웨이퍼 내에서 차동 보우를 보상하기 위한 공간적으로 튜닝 가능한 증착 방법 및 장치
JP2022545273A (ja) 2019-08-23 2022-10-26 ラム リサーチ コーポレーション 温度制御型のシャンデリア型シャワーヘッド
JP2022546404A (ja) 2019-08-28 2022-11-04 ラム リサーチ コーポレーション 金属の堆積
JP2023509451A (ja) 2020-01-03 2023-03-08 ラム リサーチ コーポレーション 裏面反り補償堆積のステーション間制御
WO2021154641A1 (en) 2020-01-30 2021-08-05 Lam Research Corporation Uv cure for local stress modulation
US12180589B2 (en) * 2020-06-24 2024-12-31 Tokyo Electron Limited Showerhead for process tool
JP7114763B1 (ja) * 2021-02-15 2022-08-08 株式会社Kokusai Electric 半導体装置の製造方法、基板処理装置、プログラム、および基板処理方法
JP2024534698A (ja) * 2021-09-22 2024-09-20 プレジ リソース マネージャーズ インコーポレイテッド.ディービーエー レインスティック シャワー 循環式シャワーで使用するためのデュアルポートシャワーヘッド
USD1038900S1 (en) * 2021-09-30 2024-08-13 Lam Research Corporation Showerhead for semiconductor processing
WO2023220308A1 (en) * 2022-05-13 2023-11-16 Lam Research Corporation Multi-path helical mixer for asymmetric wafer bow compensation
US12306644B2 (en) * 2022-09-09 2025-05-20 Horiba Stec, Co., Ltd. Hybrid flow ratio controller system with channels for flow ratio control, flow rate or pressure control, and overflow control
KR102828735B1 (ko) * 2023-04-27 2025-07-03 (주)티티에스 샤워헤드 코너 영역의 공정가스 흐름 개선 장치
USD1105018S1 (en) * 2024-02-12 2025-12-09 Lam Research Corporation Shower head
USD1101709S1 (en) * 2024-04-12 2025-11-11 Applied Materials, Inc. Process chamber shower head
WO2025250416A1 (en) * 2024-05-31 2025-12-04 Applied Materials, Inc. Semiconductor manufacturing multi-zone showerhead

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4454621B2 (ja) 2001-01-22 2010-04-21 東京エレクトロン株式会社 処理装置
US7641762B2 (en) * 2005-09-02 2010-01-05 Applied Materials, Inc. Gas sealing skirt for suspended showerhead in process chamber
US8334015B2 (en) 2007-09-05 2012-12-18 Intermolecular, Inc. Vapor based combinatorial processing
US8512509B2 (en) * 2007-12-19 2013-08-20 Applied Materials, Inc. Plasma reactor gas distribution plate with radially distributed path splitting manifold
US8066895B2 (en) 2008-02-28 2011-11-29 Applied Materials, Inc. Method to control uniformity using tri-zone showerhead
US9540731B2 (en) 2009-12-04 2017-01-10 Applied Materials, Inc. Reconfigurable multi-zone gas delivery hardware for substrate processing showerheads
US9267742B2 (en) * 2010-01-27 2016-02-23 Applied Materials, Inc. Apparatus for controlling the temperature uniformity of a substrate
JP6305314B2 (ja) 2014-10-29 2018-04-04 東京エレクトロン株式会社 成膜装置およびシャワーヘッド
US10378107B2 (en) 2015-05-22 2019-08-13 Lam Research Corporation Low volume showerhead with faceplate holes for improved flow uniformity
TWI723024B (zh) * 2015-06-26 2021-04-01 美商應用材料股份有限公司 用於改良的氣體分配的遞迴注入設備
US12180589B2 (en) * 2020-06-24 2024-12-31 Tokyo Electron Limited Showerhead for process tool

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