JP2021523965A - 制御硬化熱伝導性ギャップフィラー材料 - Google Patents

制御硬化熱伝導性ギャップフィラー材料 Download PDF

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JP2021523965A
JP2021523965A JP2020564246A JP2020564246A JP2021523965A JP 2021523965 A JP2021523965 A JP 2021523965A JP 2020564246 A JP2020564246 A JP 2020564246A JP 2020564246 A JP2020564246 A JP 2020564246A JP 2021523965 A JP2021523965 A JP 2021523965A
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gap filler
conductive gap
curing
thermally conductive
controlled
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Japanese (ja)
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JP2021523965A5 (enExample
Inventor
ビー． ワーネス，ジェニー
ビー． ワーネス，ジェニー
ユーリエヴィッチ，シモーネ
アール． ゲーブ，シーグフリード
アール． ゲーブ，シーグフリード
ビッシンガー，ペーター
シュタイガー，ボルフ
エム． ヒギンズ，ジェレミー
エム． ヒギンズ，ジェレミー
エイヒラー，イェンス
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of JP2021523965A publication Critical patent/JP2021523965A/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/61—Types of temperature control
    • H01M10/613—Cooling or keeping cold
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/653—Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/655—Solid structures for heat exchange or heat conduction
    • H01M10/6551—Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/262—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with fastening means, e.g. locks
    • H01M50/264—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with fastening means, e.g. locks for cells or batteries, e.g. straps, tie rods or peripheral frames
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
JP2020564246A 2018-05-14 2019-05-10 制御硬化熱伝導性ギャップフィラー材料 Withdrawn JP2021523965A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862670917P 2018-05-14 2018-05-14
US62/670,917 2018-05-14
PCT/IB2019/053877 WO2019220287A1 (en) 2018-05-14 2019-05-10 Control cure thermally-conductive gap filler materials

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JP2021523965A true JP2021523965A (ja) 2021-09-09
JP2021523965A5 JP2021523965A5 (enExample) 2022-05-17

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JP2020564246A Withdrawn JP2021523965A (ja) 2018-05-14 2019-05-10 制御硬化熱伝導性ギャップフィラー材料

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Country Link
US (1) US20210189212A1 (enExample)
JP (1) JP2021523965A (enExample)
CN (1) CN112105687B (enExample)
DE (1) DE112019002449T5 (enExample)
WO (1) WO2019220287A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025205390A1 (ja) * 2024-03-28 2025-10-02 積水化学工業株式会社 熱伝導性組成物

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021106551A1 (de) 2021-03-17 2022-09-22 Audi Aktiengesellschaft Thermisches Interface-Material, Batterieanordnung und Kraftfahrzeug
DE102021119206A1 (de) 2021-07-23 2023-01-26 Audi Aktiengesellschaft Verfahren zum Abdichten eines Zwischenraums zwischen einem Batteriemodul und einem Batteriegehäuse, Batterie und Kraftfahrzeug
JP7778030B2 (ja) 2022-04-06 2025-12-01 旭化成ワッカーシリコーン株式会社 熱伝導性組成物および該組成物を使用する熱伝導性部材の製造方法
DE102023117128A1 (de) 2023-06-29 2025-01-02 Audi Aktiengesellschaft Verfahren und Montagevorrichtung zum Montieren eines Batteriemoduls an einem Gehäusebauteil
DE102024110875B3 (de) 2024-04-18 2025-06-18 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Verfahren zum Herstellen von Kraftfahrzeugen

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CN1306008C (zh) * 2004-11-26 2007-03-21 胡云楚 一种氧化锌与硼酸固相反应制备纳米硼酸锌阻燃剂的方法
CN101073770A (zh) * 2006-05-19 2007-11-21 李艺 一种加工生物柴油新型复合液态催化剂
SI22669A (sl) * 2007-11-14 2009-06-30 Kemijski inštitut NANODELCI IN NANOŽIČKE ZnO Z ORGANOFILNO POVRŠINO IN NJIHOVI NANOKOMPOZITI S POLIMETIIL METAKRILATOM
JP2011026383A (ja) * 2009-07-22 2011-02-10 Sony Chemical & Information Device Corp 熱硬化型熱伝導性接着組成物
US8198351B2 (en) * 2009-10-21 2012-06-12 Milliken & Company Thermoplastic polymer composition
CN103842441B (zh) * 2011-10-04 2015-12-23 道康宁公司 含铁(iii)络合物和缩合反应催化剂、制备该催化剂的方法及含有该催化剂的组合物
CN103450675A (zh) * 2012-05-31 2013-12-18 金发科技股份有限公司 具有激光直接成型功能的树脂组合物、其制备方法以及该树脂组合物的应用
DE102013206586A1 (de) * 2013-04-12 2014-10-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Halbleitendes Copolymer sowie Verfahren zu dessen Herstellung, Stoffgemisch, elektrisches oder elektronisches Bauelement sowie Verfahren zu dessen Herstellung
EP3328918B1 (en) * 2015-07-27 2019-05-15 Dow Silicones Corporation Polyorganosiloxane compositions with metal based n-heterocyclic carbene condensation reaction catalysts and methods for the preparation thereof
CN106009026B (zh) * 2016-05-18 2018-11-30 广州市隆海橡塑有限公司 一种发泡剂、制备方法及应用
EP3352290B1 (en) * 2017-01-19 2024-07-17 3M Innovative Properties Company Aziridino-functional polyether thermally-conductive gap filler
CN107417967B (zh) * 2017-05-22 2019-07-16 清华大学深圳研究生院 纳米颗粒填料、硅橡胶复合材料及其制备方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025205390A1 (ja) * 2024-03-28 2025-10-02 積水化学工業株式会社 熱伝導性組成物
JPWO2025205390A1 (enExample) * 2024-03-28 2025-10-02
JP7838191B2 (ja) 2024-03-28 2026-03-31 積水化学工業株式会社 熱伝導性組成物

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CN112105687B (zh) 2022-07-15
US20210189212A1 (en) 2021-06-24
WO2019220287A1 (en) 2019-11-21
CN112105687A (zh) 2020-12-18
DE112019002449T5 (de) 2021-02-11

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