CN112105687B - 控制固化导热间隙填充材料 - Google Patents
控制固化导热间隙填充材料 Download PDFInfo
- Publication number
- CN112105687B CN112105687B CN201980031750.6A CN201980031750A CN112105687B CN 112105687 B CN112105687 B CN 112105687B CN 201980031750 A CN201980031750 A CN 201980031750A CN 112105687 B CN112105687 B CN 112105687B
- Authority
- CN
- China
- Prior art keywords
- thermally conductive
- gap filler
- conductive gap
- controlled
- filler composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
- C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/613—Cooling or keeping cold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/653—Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/655—Solid structures for heat exchange or heat conduction
- H01M10/6551—Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/262—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with fastening means, e.g. locks
- H01M50/264—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with fastening means, e.g. locks for cells or batteries, e.g. straps, tie rods or peripheral frames
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862670917P | 2018-05-14 | 2018-05-14 | |
| US62/670,917 | 2018-05-14 | ||
| PCT/IB2019/053877 WO2019220287A1 (en) | 2018-05-14 | 2019-05-10 | Control cure thermally-conductive gap filler materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112105687A CN112105687A (zh) | 2020-12-18 |
| CN112105687B true CN112105687B (zh) | 2022-07-15 |
Family
ID=68541151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980031750.6A Expired - Fee Related CN112105687B (zh) | 2018-05-14 | 2019-05-10 | 控制固化导热间隙填充材料 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20210189212A1 (enExample) |
| JP (1) | JP2021523965A (enExample) |
| CN (1) | CN112105687B (enExample) |
| DE (1) | DE112019002449T5 (enExample) |
| WO (1) | WO2019220287A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102021106551A1 (de) | 2021-03-17 | 2022-09-22 | Audi Aktiengesellschaft | Thermisches Interface-Material, Batterieanordnung und Kraftfahrzeug |
| DE102021119206A1 (de) | 2021-07-23 | 2023-01-26 | Audi Aktiengesellschaft | Verfahren zum Abdichten eines Zwischenraums zwischen einem Batteriemodul und einem Batteriegehäuse, Batterie und Kraftfahrzeug |
| JP7778030B2 (ja) | 2022-04-06 | 2025-12-01 | 旭化成ワッカーシリコーン株式会社 | 熱伝導性組成物および該組成物を使用する熱伝導性部材の製造方法 |
| DE102023117128A1 (de) | 2023-06-29 | 2025-01-02 | Audi Aktiengesellschaft | Verfahren und Montagevorrichtung zum Montieren eines Batteriemoduls an einem Gehäusebauteil |
| JP7838191B2 (ja) * | 2024-03-28 | 2026-03-31 | 積水化学工業株式会社 | 熱伝導性組成物 |
| DE102024110875B3 (de) | 2024-04-18 | 2025-06-18 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Verfahren zum Herstellen von Kraftfahrzeugen |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1306008C (zh) * | 2004-11-26 | 2007-03-21 | 胡云楚 | 一种氧化锌与硼酸固相反应制备纳米硼酸锌阻燃剂的方法 |
| CN101073770A (zh) * | 2006-05-19 | 2007-11-21 | 李艺 | 一种加工生物柴油新型复合液态催化剂 |
| SI22669A (sl) * | 2007-11-14 | 2009-06-30 | Kemijski inštitut | NANODELCI IN NANOŽIČKE ZnO Z ORGANOFILNO POVRŠINO IN NJIHOVI NANOKOMPOZITI S POLIMETIIL METAKRILATOM |
| JP2011026383A (ja) * | 2009-07-22 | 2011-02-10 | Sony Chemical & Information Device Corp | 熱硬化型熱伝導性接着組成物 |
| US8198351B2 (en) * | 2009-10-21 | 2012-06-12 | Milliken & Company | Thermoplastic polymer composition |
| CN103842441B (zh) * | 2011-10-04 | 2015-12-23 | 道康宁公司 | 含铁(iii)络合物和缩合反应催化剂、制备该催化剂的方法及含有该催化剂的组合物 |
| CN103450675A (zh) * | 2012-05-31 | 2013-12-18 | 金发科技股份有限公司 | 具有激光直接成型功能的树脂组合物、其制备方法以及该树脂组合物的应用 |
| DE102013206586A1 (de) * | 2013-04-12 | 2014-10-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Halbleitendes Copolymer sowie Verfahren zu dessen Herstellung, Stoffgemisch, elektrisches oder elektronisches Bauelement sowie Verfahren zu dessen Herstellung |
| EP3328918B1 (en) * | 2015-07-27 | 2019-05-15 | Dow Silicones Corporation | Polyorganosiloxane compositions with metal based n-heterocyclic carbene condensation reaction catalysts and methods for the preparation thereof |
| CN106009026B (zh) * | 2016-05-18 | 2018-11-30 | 广州市隆海橡塑有限公司 | 一种发泡剂、制备方法及应用 |
| EP3352290B1 (en) * | 2017-01-19 | 2024-07-17 | 3M Innovative Properties Company | Aziridino-functional polyether thermally-conductive gap filler |
| CN107417967B (zh) * | 2017-05-22 | 2019-07-16 | 清华大学深圳研究生院 | 纳米颗粒填料、硅橡胶复合材料及其制备方法 |
-
2019
- 2019-05-10 DE DE112019002449.3T patent/DE112019002449T5/de not_active Withdrawn
- 2019-05-10 JP JP2020564246A patent/JP2021523965A/ja not_active Withdrawn
- 2019-05-10 CN CN201980031750.6A patent/CN112105687B/zh not_active Expired - Fee Related
- 2019-05-10 US US17/055,220 patent/US20210189212A1/en not_active Abandoned
- 2019-05-10 WO PCT/IB2019/053877 patent/WO2019220287A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| US20210189212A1 (en) | 2021-06-24 |
| JP2021523965A (ja) | 2021-09-09 |
| WO2019220287A1 (en) | 2019-11-21 |
| CN112105687A (zh) | 2020-12-18 |
| DE112019002449T5 (de) | 2021-02-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110214394B (zh) | 氮丙啶基官能聚醚导热间隙填料 | |
| CN112105687A (zh) | 控制固化导热间隙填充材料 | |
| US11118056B2 (en) | Thermally conductive polysiloxane composition | |
| CN112119471B (zh) | 导热间隙填料 | |
| US20190016938A1 (en) | Method for producing insulating heat dissipation sheet | |
| CN111051392B (zh) | 不含硅氧烷的热凝胶 | |
| TW202108676A (zh) | 熱傳導性聚矽氧烷組成物 | |
| US20260136980A1 (en) | Curable organopolysiloxane composition and semiconductor device | |
| CN109312216A (zh) | 高导热复合材料 | |
| JP2016089096A (ja) | 封止用エポキシ樹脂組成物及び半導体装置 | |
| JP2022183821A (ja) | 表面被覆六方晶窒化ホウ素粒子を製造する方法、及び表面被覆六方晶ホウ素粒子 | |
| JPWO2017188286A1 (ja) | 封止用液状エポキシ樹脂組成物及び電子部品装置 | |
| US20190233612A1 (en) | Heat conductive sheet | |
| US20250333582A1 (en) | Gap filler composition and battery pack | |
| US20210403646A1 (en) | Acid-curable composition | |
| JP2023501266A (ja) | 熱伝導性硬化性組成物 | |
| CN113166405A (zh) | 可酸固化组合物 | |
| RU2720195C2 (ru) | Теплопроводящий компаунд | |
| US20240043624A1 (en) | Chain-extended silicones, method of making, curable composition including the same, and thermal gap filler | |
| JP2023508288A (ja) | 反応性希釈剤を含むシリコーンフリーサーマルインターフェース材料 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220715 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |