JP2021518990A - 回路支持および冷却構造 - Google Patents
回路支持および冷却構造 Download PDFInfo
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- JP2021518990A JP2021518990A JP2020555214A JP2020555214A JP2021518990A JP 2021518990 A JP2021518990 A JP 2021518990A JP 2020555214 A JP2020555214 A JP 2020555214A JP 2020555214 A JP2020555214 A JP 2020555214A JP 2021518990 A JP2021518990 A JP 2021518990A
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- Prior art keywords
- heat
- microwave transmission
- thermally
- conductive support
- heat spreader
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/255—Amplifier input adaptation especially for transmission line coupling purposes, e.g. impedance adaptation
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/33—Bridge form coupled amplifiers; H-form coupled amplifiers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/423—Amplifier output adaptation especially for transmission line coupling purposes, e.g. impedance adaptation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
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- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2201/10174—Diode
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
Abstract
Description
Claims (22)
- 構造であって、
複数の表面を有する3次元熱伝導性支持構造と、
前記熱伝導性支持構造の前記複数の表面の第1の部分に配置され、前記複数の表面の第2の部分に配置されたマイクロ波伝送線路により相互接続された、複数の熱発生電気部材を有する回路と、
を有する、構造。 - 前記熱伝導性材料は、熱が好適面に沿って伝導する異方性の熱伝導特性を有し、前記好適面は、前記熱伝導性支持構造の前記複数の表面の第1の部分と交差する、請求項1に記載の構造。
- 前記熱発生電気部材が設置された前記複数の表面は、前記熱異方性材料の好適面と交差する、請求項1に記載の構造。
- 前記熱異方性材料は、前記複数の表面に配置された伝導性材料を有する、請求項1に記載の構造。
- 前記伝導性材料は、前記マイクロ波伝送線路用のグラウンドプレーン導体を提供する、請求項1に記載の構造。
- 前記熱発生電気部材は、前記伝導性材料と熱的に結合された底部表面を有する、請求項1に記載の構造。
- ヒートシンクを有し、
前記ヒートシンクは、前記熱発生電気部材を有する前記複数の表面と熱的に結合される、請求項1に記載の構造。 - 冷却構造であって、
熱異方性材料を有するヒートスプレッダであって、そのような材料は、熱が好適面に沿って伝導する異方性の熱伝導特性を有する、ヒートスプレッダと、
前記ヒートスプレッダの前記複数の表面の第1の部分の異なるものに配置され、前記ヒートスプレッダの前記複数の表面の第2の異なるものに配置されたマイクロ波伝送線路により相互接続された、複数の熱発生電気部材を有する回路と、
を有する、冷却構造。 - 冷却構造であって、
上部表面に配置された複数のマイクロ波伝送線路、および貫通する開口を有する基板と、
上部表面に形成された穴を有する冷却板であって、前記上部表面は、前記基板の底部表面と熱的に結合される、冷却板と、
熱異方性材料を有するヒートスプレッダであって、そのような材料は、熱が好適面に沿って伝導する異方性の熱伝導特性を有し、前記ヒートスプレッダは、前記開口を貫通し、前記穴の底部表面に達する下側部分を有する、ヒートスプレッダと、
前記ヒートスプレッダの上側部分に配置された回路であって、前記ヒートスプレッダの複数の表面の第1の部分の異なるものに配置され、前記ヒートスプレッダの前記複数の表面の第2の部分に配置されたマイクロ波伝送線路により相互接続された、複数の熱発生電気部材を有し、前記好適面は、前記ヒートスプレッダの複数の表面の前記第1の部分と交差する、回路と、
を有する、冷却構造。 - 前記熱発生部材を有する前記複数の表面は、前記熱異方性材料の前記好適面と交差する、請求項8に記載の冷却構造。
- 前記熱異方性材料は、前記複数の表面に配置された伝導性材料を有する、請求項9に記載の冷却構造。
- 前記伝導性材料は、前記マイクロ波伝送線路用のグラウンドプレーン導体を提供する、請求項11に記載の冷却構造。
- 前記熱発生電気部材は、前記伝導性と熱的に結合され、接合された底部表面を有する、請求項12に記載の冷却構造。
- 前記基板は、入力マイクロ波伝送線路と、出力マイクロ波伝送線路とを有し、
前記回路は、前記入力マイクロ波伝送線路および出力マイクロ波伝送線路と電気的に接続される、請求項9に記載の冷却構造。 - 構造であって、
入力マイクロ波伝送線路および出力マイクロ波伝送線路を有する基板と、
複数の表面を有する3次元熱伝導性支持構造と、
前記ヒートスプレッダの前記複数の表面の異なるものに配置され、前記ヒートスプレッダの前記複数の表面の異なるものに配置されたマイクロ波伝送線路により相互接続された、複数の熱発生電気部材を有する回路と、
を有し、
前記回路は、前記入力マイクロ波伝送線路および出力マイクロ波伝送線路に電気的に接続される、構造。 - 構造であって、
複数の側部を有する3次元熱伝導性支持構造と、
回路と、
を有し、
前記回路は、
前記3次元熱伝導性支持構造の前記複数の側部に配置された複数のマイクロ波伝送線路と、
前記3次元熱伝導性支持構造の前記複数の側部の第1の組と熱的に結合され、接合された、増幅器の組と、
前記3次元熱伝導性支持構造の前記複数の側部の第3のものに接合されたスプリンタと、
前記3次元熱伝導性支持構造の前記複数の側部の第4のものに接合されたコンバイナと、
を有し、
前記増幅器の組、前記スプリンタ、および前記コンバイナは、前記複数のマイクロ波伝送線路と電気的に相互接続され、前記複数のマイクロ波伝送線路の入力の一つは、前記スプリッタの入力に結合され、前記スプリッタの出力の組の各々は、前記複数のマイクロ波伝送線路の第1の組を介して、前記増幅器の組の対応する一つの入力に結合され、前記増幅器の組の出力の組の各々は、前記複数のマイクロ波伝送線路の第2の組を介して、前記コンバイナの入力の組の対応する一つに結合され、前記コンバイナの出力は、前記複数のマイクロ波伝送線路の出力の一つに結合される、構造。 - 前記増幅器の組は、前記3次元熱伝導性支持構造の前記複数の側部の反対側に接合される、請求項16に記載の構造。
- 前記熱伝導性材料は、熱が好適面に沿って伝導する異方性の熱伝導特性を有し、
前記好適面は、前記3次元熱伝導性支持構造の前記複数の側部の反対側と交差する、請求項17に記載の構造。 - 前記スプリッタおよび前記コンバイナは、前記3次元熱伝導性支持構造の前記複数の側部の反対側と接合される、請求項17に記載の構造。
- 構造であって、
複数の側部を有する3次元熱伝導性支持構造と、
前記3次元熱伝導性支持構造の異なる側部に熱的に結合され、接合された、電気的に相互接続された熱発生部材の組と、
を有する、構造。 - 前記3次元熱伝導性支持構造は、熱異方性材料を有するヒートスプレッダを有し、
そのような材料は、熱が好適面に沿って伝導する異方性の熱伝導特性を有し、そのような好適面は、前記3次元熱伝導性支持構造の異なる側と交差する、請求項20に記載の構造。 - 前記3次元熱伝導性支持構造は、外層を有し、
前記外層は、前記熱発生電気部材の熱膨張係数と一致するように選定された熱膨張係数を有する、請求項1に記載の構造。
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US15/948,404 US10785863B2 (en) | 2018-04-09 | 2018-04-09 | Circuit support and cooling structure |
PCT/US2019/023988 WO2019199443A1 (en) | 2018-04-09 | 2019-03-26 | Circuit support and cooling structure |
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US20190313522A1 (en) | 2019-10-10 |
JP7072669B2 (ja) | 2022-05-20 |
EP3776648B1 (en) | 2023-01-04 |
WO2019199443A1 (en) | 2019-10-17 |
EP3776648A1 (en) | 2021-02-17 |
SG11202009487QA (en) | 2020-10-29 |
PL3776648T3 (pl) | 2023-04-17 |
KR20200133388A (ko) | 2020-11-27 |
KR102250940B1 (ko) | 2021-05-11 |
US10785863B2 (en) | 2020-09-22 |
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